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Publication list for
Lado Filipovic
as author or essentially involved person

53 records


Publications in Scientific Journals


11. P. Manstetten, L. Filipovic, A. Hössinger, J. Weinbub, S. Selberherr:
"Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures using One-Dimensional Radiosity";
Solid-State Electronics, 128, (invited) (2017), 141 - 147 doi:10.1016/j.sse.2016.10.029.

10. L. Filipovic, S. Selberherr:
"Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology";
IEEE Transactions on Device and Materials Reliability, 16, (2016), 483 - 495 doi:10.1109/TDMR.2016.2625461.

9. L. Filipovic, S. Selberherr:
"Stress in Three-Dimensionally Integrated Sensor Systems";
Microelectronics Reliability, 61, (2016), 3 - 10 doi:10.1016/j.microrel.2015.09.013.

8. E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, R. Minixhofer, L. Filipovic, R. Lacerda de Orio, S. Selberherr:
"Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias";
Microelectronic Engineering, 137, (2015), 141 - 145 doi:10.1016/j.mee.2014.11.014.

7. L. Filipovic, S. Selberherr:
"Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors";
Sensors, 15, (2015), 7206 - 7227 doi:10.3390/s150407206.

6. L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Intrinsic Stress Analysis of Tungsten-Lined Open TSVs";
Microelectronics Reliability, 55, (2015), 1843 - 1848 doi:10.1016/j.microrel.2015.06.014.

5. L. Filipovic, S. Selberherr:
"The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias";
Microelectronics Reliability, 54, (2014), 1953 - 1958 doi:10.1016/j.microrel.2014.07.014.

4. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Seinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank:
"Methods of Simulating Thin Film Deposition Using Spray Pyrolysis Techniques";
Microelectronic Engineering, 117, (2014), 57 - 66 doi:10.1016/j.mee.2013.12.025.

3. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Steinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank, C. Gspan, W. Grogger:
"Modeling the Growth of Tin Dioxide using Spray Pyrolysis Deposition for Gas Sensor Applications";
IEEE Transactions on Semiconductor Manufacturing, 27, (2014), 269 - 277 doi:10.1109/TSM.2014.2298883.

2. L. Filipovic, S. Selberherr:
"A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework";
Microelectronic Engineering, 107, (2013), 23 - 32 doi:10.1016/j.mee.2013.02.083.

1. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Seinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank, C. Gspan, W. Grogger:
"A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework";
Engineering Letters, 21, (invited) (2013), 224 - 240.


Contributions to Books


6. P. Manstetten, L. Filipovic, A. Hössinger, J. Weinbub, S. Selberherr:
"Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes";
in "Proceedings of the 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", IEEE Xplore, 2016, ISBN: 978-1-4673-8608-1, 120 - 123 doi:10.1109/ULIS.2016.7440067.

5. L. Filipovic, S. Selberherr:
"Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors";
in "Advanced CMOS-Compatible Semiconductor Devices 17", Y. Omura, J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen (ed); The Electrochemical Society, 2015, ISBN: 978-1-62332-238-0, 243 - 250 doi:10.1149/06605.0243ecst.

4. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Steinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank, C. Gspan, W. Grogger:
"Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors";
in "Transactions on Engineering Technologies", G.-C. Yang, S.-L. Ao, L. Gelman (ed); Springer, 2014, ISBN: 978-94-017-8831-1, 295 - 310 doi:10.1007/978-94-017-8832-8.

3. L. Filipovic, S. Selberherr:
"A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy";
in "Lecture Notes in Computer Science, Vol. 7116", I. Lirkov, S. Margenov, J. Wasniewski (ed); Springer, 2012, ISBN: 978-3-642-29842-4, 447 - 454 doi:10.1007/978-3-642-29843-1_50.

2. L. Filipovic, S. Selberherr:
"A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator";
in "Monte Carlo Methods and Applications", K. K. Sabelfeld, I. Dimov (ed); De Gruyter, 2012, ISBN: 978-3-11-029347-0, 97 - 104 doi:10.1515/9783110293586.97.

1. J. Weinbub, K. Rupp, L. Filipovic, A. Makarov, S. Selberherr:
"Towards a Free Open Source Process and Device Simulation Framework";
in "The 15th International Workshop on Computational Electronics (IWCE)", IEEE Xplore, 2012, ISBN: 978-1-4673-0705-5, 1 - 4 doi:10.1109/IWCE.2012.6242867.


Talks and Poster Presentations (with Proceedings-Entry)


34. P. Manstetten, L. Filipovic, A. Hössinger, J. Weinbub, S. Selberherr:
"Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nürnberg, Deutschland; 2016-09-06 - 2016-09-08; in "21st International Conference on Simulation of Semiconductor Processes and Devices", (2016), ISBN: 978-1-5090-0817-9, 265 - 268 doi:10.1109/SISPAD.2016.7605198.

33. L. Filipovic, S. Selberherr:
"Effects of the Deposition Process Variation on the Performance of Open TSVs";
Poster: IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA; 2016-05-31 - 2016-06-03; in "Proceedings of IEEE Electronic Components and Technology Conference (ECTC)", (2016), ISBN: 978-1-5090-1204-6, 2188 - 2195 doi:10.1109/ECTC.2016.177.

32. L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Impact of Across-Wafer Variation on the Electrical Performance of TSVs";
Talk: International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 - 2016-05-26; in "Proceedings of IEEE International Interconnect Technology Conference (IITC)", (2016), ISBN: 978-1-5090-0386-0, 130 - 132 doi:10.1109/IITC-AMC.2016.7507707.

31. L. Filipovic, S. Selberherr:
"Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors";
Talk: World Congress of Smart Materials (WCSM), Singapore; (invited) 2016-03-04 - 2016-03-06; in "Proceedings of the BIT's 2nd Annual World Congress of Smart Materials 2016", (2016), 517.

30. P. Manstetten, L. Filipovic, A. Hössinger, J. Weinbub, S. Selberherr:
"Modeling Neutral Particle Flux in High Aspect Ratio Holes using a One-Dimensional Radiosity Approach";
Talk: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Wien; 2016-01-25 - 2016-01-27; in "Book of Abstracts of the 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon", (2016), ISBN: 978-3-901578-29-8, 68 - 69.

29. L. Filipovic, S. Selberherr:
"Processing of Integrated Gas Sensor Devices";
Talk: IEEE International Conference on Electrical and Electronic Technology TENCON, Macau, China; (invited) 2015-11-01 - 2015-11-04; in "Proceedings of the IEEE Region 10 Annual Conference (TENCON)", (2015), ISBN: 978-1-4799-8639-2, 6 page(s) doi:10.1109/TENCON.2015.7372781.

28. L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Intrinsic Stress Analysis of Tungsten-Lined Open TSVs";
Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 - 2015-10-09; in "Abstracts of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis", (2015), 71.

27. F. Roger, A. P. Singulani, S. Carniello, L. Filipovic, S. Selberherr:
"Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation";
Talk: International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 - 2015-09-04; in "Proceedings of the 6th International Workshop on CMOS Variability (VARI)", (2015), ISBN: 978-1-5090-0071-5, 39 - 44 doi:10.1109/VARI.2015.7456561.

26. L. Filipovic, S. Selberherr:
"Stress in Three-Dimensionally Integrated Sensor Systems";
Talk: International Conference on Materials for Advanced Technologies(ICMAT), Singapore; (invited) 2015-06-28 - 2015-07-03; in "Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT)", (2015), 342.

25. L. Filipovic, S. Selberherr:
"Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors";
Talk: Meeting of the Electrochemical Society (ECS), Chicago, Illinois, USA; 2015-05-24 - 2015-05-28; in "Proceedings of the 227th ECS Meeting (ECS)", (2015), Vol.67, ISSN: 1938-6737, 2 page(s) .

24. L. Filipovic, S. Selberherr:
"Kinetics of Droplet Motion During Spray Pyrolysis";
Talk: Energy Materials Nanotechnology (EMN East Meeting), Phuket, Thailand; (invited) 2015-05-08 - 2015-05-11; in "EMN Meeting on Droplets 2015 Program and Abstract Book", (2015), 127 - 128.

23. L. Filipovic, S. Selberherr:
"About Processes and Performance of Integrated Gas Sensor Components";
Talk: Energy Materials Nanotechnology (EMN East Meeting), Orlando, USA; (invited) 2014-11-22 - 2014-11-25; in "Abstracts Intl.Conf.on Energy - Materials - Nanotechnology (EMN)", (2014), 96 - 97.

22. L. Filipovic, S. Selberherr:
"Spray Pyrolysis Deposition for Gas Sensor Integration in the Backend of Standard CMOS Processes";
Talk: International Conference on Solid State and Integrated Circuit Technology (ICSICT), Guilin, China; (invited) 2014-10-28 - 2014-10-31; in "Proc.Intl.Conf.on Solid-State and Integrated Circuit Technology (ICSICT)", (2014), ISBN: 978-1-4799-3282-5, 1692 - 1695 doi:10.1109/ICSICT.2014.7021507.

21. L. Filipovic, S. Selberherr:
"Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology";
Talk: International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 - 2014-10-17; in "Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics", (2014), 41.

20. L. Filipovic, S. Selberherr:
"The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias";
Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Berlin, Germany; 2014-09-29 - 2014-10-02; in "Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)", (2014), 36.

19. L. Filipovic, F. Rudolf, E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, A. P. Singulani, R. Minixhofer, S. Selberherr:
"Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 - 2014-09-11; in "Proceedings of the 19th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2014), ISBN: 978-1-4799-5285-4, 341 - 344 doi:10.1109/SISPAD.2014.6931633.

18. L. Filipovic, R. Orio, S. Selberherr:
"Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs";
Talk: International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Singapore; 2014-06-30 - 2014-07-04; in "Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits", (2014), ISBN: 978-1-4799-3931-2, 321 - 326 doi:10.1109/IPFA.2014.6898137.

17. L. Filipovic, R. Orio, S. Selberherr, A. P. Singulani, F. Roger, R. Minixhofer:
"Effects of Sidewall Scallops on Open Tungsten TSVs";
Talk: International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 - 2014-06-05; in "Conference Proceedings of International Reliability Physics Symposium", (2014), ISBN: 978-1-4799-3317-4, 3E.3.1 - 3E.3.6 doi:10.1109/IRPS.2014.6860633.

16. L. Filipovic, R. Orio, S. Selberherr:
"Process and Reliability of SF6/O2 Plasma Etched Copper TSVs";
Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium; 2014-04-07 - 2014-04-09; in "Proceedings of the IEEE 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", (2014), ISBN: 978-1-4799-4791-1, 4 page(s) doi:10.1109/EuroSimE.2014.6813768.

15. E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, R. Minixhofer, L. Filipovic, R. Orio, S. Selberherr:
"Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAs";
Talk: European Workshop on Materials for Advanced Metallization (MAM), Chemnitz, Germany; 2014-03-02 - 2014-03-05; in "Book of Abstracts", (2014), 2 page(s) .

14. L. Filipovic, R. Orio, S. Selberherr:
"Process and performance of Copper TSVs";
Talk: Workshop of the Thematic Network on Silicon On Insulator Technology, Devices and Circuits (EUROSOI), Tarragona, Spain; 2014-01-27 - 2014-01-29; in "Conference Proceedings of the Tenth Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits", (2014), 1 - 2.

13. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Steinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank, C. Gspan, W. Grogger:
"Modeling the Growth of Thin SnO2 Films using Spray Pyrolysis Deposition";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in "Proceedings of the 18th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3, 208 - 211 doi:10.1109/SISPAD.2013.6650611.

12. L. Filipovic, S. Selberherr, G. Mutinati, E. Brunet, S. Steinhauer, A. Köck, J. Teva, J. Kraft, J. Siegert, F. Schrank:
"Modeling Spray Pyrolysis Deposition";
Talk: World Congress on Engineering (WCE), London, UK; 2013-07-03 - 2013-07-05; in "Proceedings of the World Congress on Engineering (WCE) Vol II", (2013), ISBN: 978-988-19252-8-2, 987 - 992.

11. A. P. Singulani, H. Ceric, L. Filipovic, E. Langer:
"Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology";
Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland; 2013-04-14 - 2013-04-17; in "Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE)", (2013), ISBN: 978-1-4673-6137-8, 6 page(s) doi:10.1109/EuroSimE.2013.6529938.

10. L. Filipovic, S. Selberherr:
"Simulations of Local Oxidation Nanolithography by AFM Based on the Generated Electric Field";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Denver, CO, USA; 2012-09-05 - 2012-09-07; in "Proceedings of the 17th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2012), ISBN: 978-0-615-71756-2, 189 - 192.

9. L. Filipovic, S. Selberherr:
"Electric Field Based Simulations of Local Oxidation Nanolithography using Atomic Force Microscopy in a Level Set Environment";
Talk: Intl. Symposium on Microelectronics Technology and Devices (SBMicro), Brasilia, Brazil; 2012-08-30 - 2012-09-02; in "ECS Transactions", (2012), Vol.1, ISBN: 978-1-56677-990-6, 265 - 272 doi:10.1149/04901.0265ecst.

8. L. Filipovic, S. Selberherr:
"Simulation of Silicon Nanopatterning Using nc-AFM";
Poster: International Conference on non-contact Atomic Force Microscopy, Cesky Krumlov; 2012-07-01 - 2012-07-05; in "Abstracts 15th International Conference on non-contact Atomic Force Microscopy (nc-AFM)", (2012), 108.

7. J. Weinbub, K. Rupp, L. Filipovic, A. Makarov, S. Selberherr:
"Towards a Free Open Source Process and Device Simulation Framework";
Poster: International Workshop on Computational Electronics (IWCE), Madison, WI, USA; 2012-05-22 - 2012-05-25; in "Book of Abstracts of the 15th International Workshop on Computational Electronics (IWCE)", (2012), 141 - 142.

6. L. Filipovic, S. Selberherr:
"A Level Set Simulator for Nanooxidation using Non-Contact Atomic Force Microscopy";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Osaka, Japan; 2011-09-08 - 2011-09-10; in "Proceedings of the 16th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2011), ISBN: 978-1-61284-418-3, 307 - 310 doi:10.1109/SISPAD.2011.6035031.

5. L. Filipovic, S. Selberherr:
"A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator";
Talk: Seminar on Monte Carlo Methods (MCM), Borovets; 2011-08-29 - 2011-09-02; in "Abstracts IMACS Seminar on Monte Carlo Methods (MCM)", (2011), 30.

4. L. Filipovic, M. Nedjalkov, S. Selberherr:
"A Monte Carlo Simulator for Non-Contact Atomic Force Microscopy";
Talk: International Conference on Large-Scale Scientific Computations (LSSC), Sozopol, Bulgaria; 2011-06-06 - 2011-06-10; in "Abstracts Intl. Conf. on Large-Scale Scientific Computations", (2011), 42 - 43.

3. L. Filipovic, H. Ceric, J. Cervenka, S. Selberherr:
"A Simulator for Local Anodic Oxidation of Silicon Surfaces";
Talk: IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Niagara Falls, Canada; 2011-05-08 - 2011-05-11; in "Proceedings of the 24th Canadian Conference on Electrical and Computer Engineering (CCECE 2011)", (2011), ISBN: 978-1-4244-9789-8, 695 - 698 doi:10.1109/CCECE.2011.6030543.

2. L. Filipovic, O. Ertl, S. Selberherr:
"Parallelization Strategy for Hierarchical Run Length Encoded Data Structures";
Talk: IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011), Innsbruck; 2011-02-15 - 2011-02-17; in "Proceedings of the IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011)", (2011), ISBN: 978-0-88986-864-9, 131 - 138 doi:10.2316/P.2011.719-045.

1. O. Ertl, L. Filipovic, S. Selberherr:
"Three-Dimensional Simulation of Focused Ion Beam Processing Using the Level Set Method";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Bologna, Italy; 2010-09-06 - 2010-09-08; in "Proceedings of the 15th International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2010), ISBN: 978-1-4244-7700-5, 49 - 52 doi:10.1109/SISPAD.2010.5604573.


Talks and Poster Presentations (without Proceedings-Entry)


1. B. Ullmann, A. Grill, P. Manstetten, M. Jech, M. Kampl, W. H. Zisser, L. Filipovic, M. Thesberg, F. Rudolf, T. Windbacher, J. Cervenka, M. Katterbauer, J. Weinbub:
"Ihr Smartphone - ein Supercomputer vor 20 Jahren. Ein Einblick in die Mikro- und Nanoelektronik";
Talk: Lange Nacht der Forschung 2016, Wien; 2016-04-22.


Doctor's Theses (authored and supervised)


1. L. Filipovic:
"Topography Simulation of Novel Processing Techniques";
Reviewer: S. Selberherr, D. Vasileska; E360, 2012, oral examination: 2012-12-17.