2.4 SiC Device Fundamentals

In order to minimize the development and production costs of SiC electronics, it is essential that SiC device fabrication takes advantage of existing silicon and GaAs wafer processing infrastructure as much as possible. As will be discussed in this section, most of the steps necessary to fabricate SiC devices starting from SiC wafers can be accomplished using modified commercial silicon processes and fabrication tools.

Subsections

• 2.4.1 Choice of Polytype for Devices
• 2.4.2 Selective Doping- Ion Implantation

T. Ayalew: SiC Semiconductor Devices Technology, Modeling, and Simulation