Chapter 2
Measurement Methods

To be able to characterize the reliability phenonmenon of the negative and positive bias temperature instability (NBTI/PBTI), the experimental access to the degrading and as well observable transistor parameters has to be explained first. State-of-the-art measurements reveal that degradation starts earlier than 1 μs  [11] and continues to proceed even beyond weeks [12]. As such, both the onset and the saturation of degradation are outside the experimental window, which today spans about 12 decades in time. The minimum times in this window are due to the limited resolution of the measurement equipment, while the maximum times are restricted by the time a reliability engineer has to perform these kind of measurements1 . Now, a fundamental prerequisite for the description of NBTI lies in an accurate determination of its impacts on the device. But precise measurements of the electric parameters as proper measures of the “real” degradation (e.g. interface state density) are not trivial. This is on one hand due to the immediate relaxation of the degradation once the stress is interrupted, i.e. VG   is set to weak inversion or even accumulation. In 1977 Jeppson et al. already described that traps created during negative bias temperature stress can be removed by thermal annealing. The higher the temperature during the annealing process, the quicker the degradation process recovers and the damage is annealed [13]. Nevertheless the NBTI community appeared not interested in the fact that degradation may be reversible under certain conditions for many years. Hence, there was no apparent need to quickly measure the degradation, which of course had a serious impact on the initial modeling attempts. Rangan et al. was one of the first to revive the discussion on the recovery of NBTI [14]. A few years later Reisinger et al. described the influence of very fast to very slow components contributing to degradation and recovery due to NBTI and contrasted their results to existing physical models in [15], which will be thoroughly discussed in Chapter 3. Today the scientific community has accepted that fast measurements are necessary, but unfortunately there is always a trade-off between a fast and simultaneously accurate method.

This chapter will give a brief overview of the various measurement methods, their delay times, their effect on the device itself, and their other limitations. Moreover, their output signal post-processing complexity is discussed using approximate formulae.

 2.1 Measurement-Stress-Measurement
  2.1.1 Monitoring I
D   at V
  TH
  2.1.2 Direct Monitoring of VTH
  2.1.3 Extended-Measurement-Stress-Measurement Setup
 2.2 Transfer-Characteristics
  2.2.1 Fast Pulsed ID(VG )  -characteristics
  2.2.2 Improved Method of Reisinger
 2.3 On-The-Fly (OTF)
 2.4 Charge Pumping
 2.5 On-the-Fly Fast Charge Pumping
 2.6 Capacitance Voltage Profiling