4. List of Acronyms

CFL Courant-Friedrichs-Levy
CMOS Complementary Metal Oxide Semiconductor
CVD Chemical Vapor Deposition
DIRECT Dividing Rectangles
DNA Deoxyribonucleic Acid
DOE Design of Experiments
DRAM Dynamic Random Access Memory
EGO Extensible Genetic Optimizer
ELSA Enhanced Level Set Applications
HDP High Density Plasma
HPCVD High Pressure Chemical Vapor Deposition
ILD Interlevel Dielectric
LPCVD Low Pressure Chemical Vapor Deposition
MOS Metal Oxide Semiconductor
MOSFET Metal Oxide Semiconductor Field Effect Transistor
PDE Partial Differential Equation
PECVD Plasma Enhanced Chemical Vapor Deposition
PIF Profile Interchange Format
PVD Physical Vapor Deposition
RSM Response Surface Methodology
SEM Scanning Electron Microscope
SIA Semiconductor Industry Association
SIESTA Simulation Environment for Semiconductor Technology Analysis
SIMS Secondary Ion Mass Spectrometry
SRAM Static Random Access Memory
RTA Rapid Thermal Annealing
TCAD Technology Computer Aided Design
TED Transient Enhanced Diffusion
TEOS Tetraethoxysilane, $ \mathrm{Si(OC_2H_5)_4}$
ULSI Ultra Large Scale Integration
VISTA Viennese Integrated System for TCAD Applications
VLSI Very Large Scale Integration

Clemens Heitzinger 2003-05-08