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5. Photoresist Exposure/Bleaching Simulation

The photoresist exposure/bleaching module is the second stage within the overall lithography simulation flow illustrated in Figure 3.1. The physical problems of light propagation within the photosensitive resist thereby encountered as well as the chemical modification of the resist material induced by light absorption are extremely difficult to model. The reasons for this are, however, of different nature:

Before we start the chapter as outlined, we want to point out the role of the exposure/bleaching module in the overall concept (cf. Figure 3.1). On the one hand it has to be linked to the two-dimensional/one-dimensional aerial image that is the result of the imaging module, on the other hand it yields the output for the development tool in form of a three-dimensionally/two-dimensionally distributed attribute describing the chemical state of the photoresist after exposure. Hence special care has to be given to well-designed and flexible input and output interfaces.



 
next up previous contents
Next: 5.1 Exposure Kinetics Up: PhD Thesis Heinrich Kirchauer Previous: 4.4.2 Numerical Backward Transform
Heinrich Kirchauer, Institute for Microelectronics, TU Vienna
1998-04-17