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Next: 7. Applications Up: 6. Three-dimensional Interconnect Simulation Previous: 6.4 Size of the


6.5 Commercial Tools

The largest TCAD commercial vendors present a wide range of solutions for interconnect simulations. These tools have user-friendly and task-oriented interfaces, but still lack some of the features we have incorporated. When comparing with those following an approximated approach [82], [83], [84] we offer, e.g., additionally models for reactive ion etching and sputter deposition, the possibility of a transient mode simulation (especially suitable for clock delay problems as noted).



Rui Martins
1999-02-24