Bibliography

1

Molex^®.
A leading one-source supplier of interconnect products.
Images for car-audio device, cell phone and rack.
www.molex.com.

2

IEC.
The leading organization that prepares and publishes international standards for all electrical, electronic and related technologies.
International standards for EMC measurements, limits and models.
www.iec.ch.

3

Mohamed Ramdani, Etienne Sicard, Sonia Ben Dhia, and Johann Catrysse.
Towards an EMC roadmap for integrated circuits.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 8-11, May 2008.

4

ITRS.
Sets industry targets and milestones for the next 15 jears.
International Technology Roadmap for Semiconductors.
www.public.itrs.net.

5

Mart Coenen and Dick de Greef.
Optimization techniques for minimizing IR-drop and supply bounce.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 79-83, November 2005.

6

Cecile Labussiere-Dorgan, Sonia Bendhia, Etienne Sicard, Tao Junwu, Henqrique J. Quaresma, Christophe Lochot, and Bertrand Vrignon.
Modeling the electromagnetic emission of a microcontroller using a single model.
In IEEE Transactions on Electromagnetic Compatibility, volume 50, pages 22-34, February 2008.

7

Mario Steiner, Bernd Deutschmann, and Kurt Lamedschwandner.
EMC aware programming of micro controller based systems.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 63-68, November 2005.

8

Shih-Yi Yuan, Jia-Wen Luo, Ming-Yuh Lin, and Shry-Sann Liao.
Microcontroller instruction set simulator for EMI prediction.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 271-276, November 2007.

9

Shih-Yi Yuan, Huai-En Chung, Chiu-Kuo Chen, and Shry-Sann Liao.
Irregular and long time current waveform handling improvement for EMC simulation.
In EMC Europe, Symposium on Electromagnetic Compatibility, pages 569-573, September 2008.

10

Erion Gjonaj and Thomas Weiland.
Full wave analysis of a large IC package using parallel computing.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 295-299, November 2007.

11

Kane Yee.
Numerical solution of inital boundary value problems involving Maxwell's equations in isotropic media.
In IEEE Transactions on Antennas and Propagation, volume 14, pages 302 - 307, May 1966.

12

Allen Taflove and Susan C. Hangess.
Computational Electrodynamics: The Finite-Difference Time-Domain Method.
Artech, 2000.

13

Yang Yang and Rushan Chen.
Numerical simulation of microstrip circuits using unconditional stable CN-FDTD method combined with preconditioned GMRES.
In International Conference on Microwave and Millimeter Wave Technology. ICMMT 2008, volume 2, pages 956 - 959, April 2008.

14

Salvador González Garcia, Tae-Woo Lee, and Susan C. Hagness.
On the accuracy of the ADI-FDTD method.
In IEEE Antennas and Wireless Propagation Letters, volume 1, pages 31-34, 2002.

15

Nico Gödel, Sebastian Lange, and Markus Clemens.
Time domain discontinuous Galerkin method with efficient modelling of boundary conditions for simulations of electromagnetic wave propagation.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 594 - 597, May 2008.

16

Hansruedi Heeb and Albert E. Ruehli.
Three-dimensional interconnect analysis using partial element equivalent circuits.
In IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications, volume 39, pages 974 - 982, November 1992.

17

Dipanjan Gope, Albert E. Ruehli, Yang Chuanyi, and Vikram Jandhyala.
(S)PEEC: Time- and frequency-domain surface formulation for modeling conductors and dielectrics in combined circuit electromagnetic simulations.
In IEEE Transactions on Microwave Theory and Techniques, volume 54, pages 2453-2464, June 2006.

18

Günter Wollenberg and Sergey V. Kochetov.
Coupling into 3D interconnect structures with nonlinear loads - An application of the method of partial elements.
In Proceedings of the XXVIIth URSI General Assembly, pages 2185-2188, 2002.

19

Dipanjan Gope, Albert E. Ruehli, and Vikram Jandhyala.
Speeding up PEEC partial inductance computations using a QR-based algorithm.
In IEEE Transactions on Very Large Scale Integration (VLSI) Systems, volume 15, pages 60 - 68, January 2007.

20

Jane Cullum, Albert E. Ruehli, and Tong Zhang.
A method for reduced-order modeling and simulation of large interconnect circuits and its application to PEEC models with retardation.
In IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing, volume 47, pages 261 - 273, April 2000.

21

Norio Matsui, Dileep Divekar, and Neven Orhanovic.
SI and EMI analysis of analog circuit board combination of PEEC and MOR.
In International Symposium on Electromagnetic Compatibility, volume 1, pages 260 - 265, August 2004.

22

Martin Nilsson.
Rapid solution of parameter-dependent linear systems for electromagnetic problems in the frequency domain.
In IEEE Transactions on Antennas and Propagation, volume 53, pages 777 - 784, February 2005.

23

Arnulf Kost.
Numerische Methoden in der Berechung elektromagnetischer Felder.
Springer-Verlag Berlin Heidelberg, 1994.

24

Nail A. Gumerov and Ramani Duraiswami.
Fast Multipole Methods for the Helmholtz Equation in Three Dimensions.
Elsevier Ltd, 2004.

25

Joris Peeters, Ignace Bogaert, Jan Fostier, and Femke Olyslager.
Accurate wideband evaluation of the shielding effectiveness of complex enclosures using an asynchronous parallel NSPWMLFMA.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 204-207, May 2008.

26

Femke Olyslager, Kristof Cools, Ignace Bogaert, Jan Fostier, Joris Peeters, Francesco P Andriulli, and Eric Michielssen.
Recent advances in fast multipole methods to simulate ever larger and more complex structures.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 367-370, May 2008.

27

Ulrich Jakobus and Johann van Tonder.
Anwendung einer mehrstufigen schnellen Multipolmethode zur Analyse komplexer EMV Probleme.
In Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit, pages 219-226, February 2004.

28

Ulrich Jakobus, Johann van Tonder, and Marlize Schoeman.
Advanced EMC modeling by means of a parallel MLFMM and coupling with network theory.
In IEEE Symposium on Electromagnetic Compatibility, pages 1-5, August 2008.

29

Heinz Rebholz and Stefan Tenbohlen.
A fast radiated emission model for arbitrary cable harness configurations based on measurements and simulations.
In IEEE Symposium on Electromagnetic Compatibility, pages 1-5, August 2008.

30

Heiko Haase, Jürgen Nietsch, and Torsten Steinmetz.
Transmission-line super theory: A new approach to an effective calculation of electromagnetic interactions.
In The Radio Science Bulletin, number 307, pages 33-60, December 2003.

31

Peter Kralicek.
Makromodellieung des Strahlungsverhaltens von Subsystemen zur Systemanalyse.
Dissertation, Institut für Grundlagen der Elektrotechnik und Messtechnik der Universität Hannover, November 2006.

32

David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas P. Van Doren, Fei Sha, and Michael J. Wilhelm.
Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables.
In IEEE Transactions on Electromagnetic Compatibility, volume 38, pages 557-566, November 1996.

33

David M. Hockanson, Cheung-Wei Lam, James L. Drewniak, Todd H. Hubing, and Thomas P. Van Doren.
Experimental and numerical investigations of fundamental radiation mechanisms in PCB designs with attached cables.
In IEEE Symposium on Electromagnetic Compatibility, pages 305-310, August 1996.

34

James L. Drewniak, Fei Sha, Thomas P. Van Doren, and Todd H. Hubing.
Diagnosing and modeling common-mode radiation from printed circuit boards with attached cables.
In IEEE Symposium on Electromagnetic Compatibility, pages 465-470, August 1995.

35

Todd H. Hubing, Thomas P. Van Doren, and James. L. Drewniak.
Identifying and quantifying printed circuit board inductance.
In Proceedings of IEEE International Symposium on Electromagnetic Compatibility, pages 205-208, August 1994.

36

David M. Hockanson, James L. Drewniak, Todd H. Hubing, Thomas P. Van Doren, Cheung-Wei Lam Fei Sha, and Lawrence Rubin.
Quantifying EMI resulting from finite-impedance reference planes.
In IEEE Transactions on Electromagnetic Compatibility, volume 39, pages 286-297, November 1997.

37

Marco Leone.
Design expressions for the trace-to-edge common-mode inductance of a printed circuit board.
In IEEE Transactions on Electromagnetic Compatibility, volume 43, pages 667-671, November 2001.

38

Hwan-Woo Shim and Todd H. Hubing.
Model for estimating the radiated emissions from a printed circuit board with attached cables due to voltage-driven sources.
In IEEE Transactions on Electromagnetic Compatibilty, volume 47, pages 899-907, November 2005.

39

Hwan W. Shim and Todd H. Hubing.
Derivation of a closed-form approximate expression for the self-capacitance of a printed circuit board trace.
In IEEE Transactions on Electromagnetic Compatibilty, volume 47, pages 1004-1008, November 2005.

40

David M. Hockanson, James L. Drewniak, Todd H. Hubing, and Thomas P. Van Doren.
FDTD modeling of common-mode radiation from cables.
In IEEE Transactions on Electromagnetic Compatibility, volume 38, pages 376-387, August 1996.

41

David M. Hockanson, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Thomas P. Van Doren, and Richard E. DuBroff.
FDTD and experimental investigation of EMI from stacked-card PCB configurations.
In IEEE Transactions on Electromagnetic Compatibility, volume 43, pages 1-10, February 2001.

42

Guang-Tsai Lei, Robert W. Techentin, and Barry K. Gilbert.
High-frequency characterization of power/ground-plane structures.
In IEEE Transactions on Microwave Theory Tech, volume 47, pages 562-569, May 1999.

43

Chen Wang, Jingkum Mao, Giuseppe Selli, Shaofeng Luan, Lin Zhang, Jun Fan, David J. Pommerenke, Richard E. DuBroff, and James L. Drewniak.
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances.
In IEEE Transactions of Advanced Packaging, volume 29, pages 320-334, May 2006.

44

Eric Bracken, Sergey Poltyanko, Shankar Raman, and Zoltan J. Cendes.
Efficient full-wave simulation of high-speed printed circuit boards and electronic packages.
In Antennas and Propagation Society International Symposium IEEE, volume 3, pages 3301-3304, June 2004.

45

Richard L. Chen, Ji Chen, Todd H. Hubing, and Weimin Shi.
Via coupling within power-return plane structures considering the radiation loss.
In International Symposium on Electromagnetic Compatibility 2004, EMC 2004, volume 2, pages 386-391, August 2004.

46

Richard L. Chen, Ji Chen, Todd H. Hubing, and Weimin Shi.
Analytical model for the rectangular power-ground structure including radiation loss.
In IEEE Transactions on Electromagnetic Compatibilty, volume 47, pages 10-16, February 2005.

47

Martin Paul Robinson, Trevor M. Benson, Christos Christopoulos, John F. Dawson, Martin D. Ganley, Andy C. Marvin, Stuart J. Porter, and David W. P. Thomas.
Analytical formulation for the shielding effectiveness of enclosures with apertures.
In IEEE Transactions on Electromagnetic Compatibilty, volume 40, pages 240-248, August 1998.

48

David W. P. Thomas, Alan C. Denton, Tadeusz Konefal, Trevor Benson, Christos Christopoulos, John F. Dawson, Andy Marvin, Stuart J. Porter, and Phillip Sewell.
Model of the electromagnetic fields inside a cuboidal enclosure populated with conducting planes or printed circuit boards.
In IEEE Transactions on Electromagnetic Compatibilty, volume 43, pages 161-169, May 2001.

49

Tadeusz Konefal, John F. Dawson, Alan C. Denton, Trevor M. Benson, Christos Christopoulos, Andrew C. Marvin, Stuart J. Porter, and David W. P. Thomas.
Electromagnetic coupling between wires inside a rectangular cavity using multiple-mode-analogous-transmission-line circuit theory.
In IEEE Transactions on Electromagnetic Compatibility, volume 43, pages 273-281, August 2001.

50

Tadeusz Konefal, John F. Dawson, Andy C. Marvin, Martin P. Robinson, and Stuart J. Porter.
A fast multiple mode intermediate level circuit model for the prediction of shielding effectiveness of a rectangular box containing a rectangular aperture.
In IEEE Transactions on Electromagnetic Compatibility, volume 47, pages 678-691, November 2005.

51

IEC.
62014-3: Models of integrated circuits for EMI behavioral simulation.
Technical report, International Electrotechnical Comission, 2002.

52

Alexandre Boyer, Etienne Sicard, and Jean-Luc Levant.
On the prediction of near-field micro controller emission.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 216-220, November 2005.

53

Vijay Kasturi, Shaowei Deng, Todd Hubing, and Daryl Beetner.
Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements.
In IEEE Symposium on Electromagnetic Compatibility, pages 422-425, August 2006.

54

IEC.
61967-2: Integrated circuits, measurements of electromagnetic emissions 150kHz to 1GHz-part 2: Measurement of radiated emissions, TEM cell and wideband TEM cell method.
Technical report, International Electrotechnical Comission, 2005.

55

Prasad Kodali.
Engineering Electromagnetic Compatibility, chapter Conducted Interference Measurements, page 139.
IEEE Press, 1996.

56

IEC.
CISPR25: Vehicles, boats and internal combustion engines, radio disturbance characteristics, limits and methods of measurement for the protection of on board receivers.
Technical Report Edition 3, International Special Committee on Radio Interference, 2008.

57

Todd Hubing.
Building IC models based on measurements and using these models productively.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 15-17, 2007.

58

Marco Leone.
Closed-form expressions for the electromagnetic radiation of microstrip signal traces.
In IEEE Transactions on Electromagnetic Compatibility, volume 47, pages 322-328, May 2007.

59

Marco Leone.
The radiation of a rectangular power-bus structure at multiple cavity-mode resonances.
In IEEE Transactions on Electromagnetic Compattibility, volume 45, pages 486-492, August 2003.

60

Thomas Steinecke, Mehmet Goekcen, Dirk Hesidenz, and Andreas Gstoettner.
High-accuracy emission simulation models for VLSI chips including package and printed circuit board.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 41-46, November 2007.

61

Thomas Steinecke and Dirk Hesidenz.
VLSI IC emission models for system simulation.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 24-27, May 2008.

62

Marco Leone.
Ermittlung des Gleichtakt-Abstrahlungspegels von Leiterplatten unter Berücksichtigung von angeschlossenen Kabeln.
In Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit, pages 183-190, April 2002.

63

Mike Engelhardt and Linear Technology Corporation.
A freeware network simulation program.
LT semiconductor product inormation, LTSpice, application notes and simulation models.
www.linear.com.

64

Sven Tamm and Marco Leone.
Semiconductor macromodeling for power electronic applications.
In International Symposium on Electromagnetic Compatibility, EMC Europe 2008, pages 41-46, 2008.

65

Markus Bücker, Jens Gerling, Uwe Keller, and Michael Brahm.
Impedanzberechung flächiger Versorgungssysteme beliebiger Berandung.
In Elektromagnetische Verträglichkeit, 12. Internationale Fachmesse und Kongress, pages 361-368. VDE Verlag GMBH, Berlin und Offenbach, Bismarkstrasse 33, 2004.

66

Omar M. Ramahi, Vinay Subramanian, and Bruce Archambeault.
A simple finite-difference frequency-domain (FDFD) algorithm for analysis of switching noise in printed circuit boards and packages.
In IEEE transactions on advanced packaging, volume 26, pages 191-198, May 2003.

67

Peter B. Johns.
The solution of inhomogeneous waveguide problems using a transmission-line matrix.
In IEEE Transactions on Microwave Theory and Techniques, volume 22, pages 205-215, May 1974.

68

Sina Akhtarzad and Peter B. Johns.
Three-dimensional transmission-line matrix computer analysis of microstrip resonators.
In IEEE Transaction on Microwave Theory and Techniques, volume 23, pages 990-997, December 1975.

69

Lee Keunmyung and Alan Barber.
Modeling and analysis of multichip module power supply planes.
In IEEE Transactions on Advanced Packaging, volume 18, pages 628-639, 1995.

70

R. W. Clough.
The finite element method in plane stress analysis.
In Conference of Electronic Computation, ASCE, number 2, pages 345-378, 1960.

71

Rainer Sabelka.
Dreidimensionale Finite Elemente Simulation von Verdrahtungsstrukturen auf Integrierten Schaltungen.
Dissertation, Technische Universität Wien, February 2001.

72

Alexander Nentchev.
Numerical Analysis and Simulation in Microelectronics by Vector Finite Elements.
Dissertation, Technische Universität Wien, January 2008.

73

Zoltan J . Cendes.
Vector finite elements for electromagnetic field computation.
In IEEE Transactions on Magnetics, volume 27, pages 3958-3966, September 1991.

74

Robert Bauer.
Numerische Berechnung von Kapazitäten in dreidimensionalen Verdrahtungsstrukturen.
Dissertation, Technische Universität Wien, November 1994.

75

Institute for Microelectronics.
Main research field is the development of software tools for the simulation of semiconductor devices and technological process steps.
Weblink of the institute, with publications and software tools.
www.iue.tuwien.ac.at.

76

Ansoft^®.
Simulation software for high performance electronic design.
Simulation tool information, data sheets, examples.
www.ansoft.com.

77

Otto Zinke and Heinrich Brunswig.
Hochfrequenztechnik 1, chapter Mikrostreifenleitung (Microstrip), page 165.
Springer-Verlag Berlin Heidelberg New York, 2000.

78

Fritz Oberhettinger and Wilhelm Magnus.
Anwendung der elliptischen Funktionen in Physik und Technik.
Springer Verlag, 1949.

79

Fritz Oberhettinger and Wilhelm Magnus.
Die Berechnung des Wellenwiderstandes einer Bandleitung mit kreisförmigem bzw. rechteckigem Außenleiterquerschnitt.
In Electrical Engineering (Archiv für Elektrotechnik), volume 37, pages 380-390, August 1943.

80

Meinke Grundlach.
Taschenbuch der Hochfrequenztechnik Band 2 Komponenten, chapter 3, page K10.
Springer-Verlag, 1992.

81

Bernd Deutschmann, Harald Pitsch, and Gunter Langer.
Near field measurements to predict the electromagntic emission from integrated circuits.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 27-32, November 2005.

82

Cécile Labussiere, Christophe Lochot, and Alexandre Boyer.
Characterization of the radiation from a 16-bit microcontroller by using miniature near-field probes.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 33-38, November 2005.

83

Thiemo Stadtler and Jan L. ter Haseborg.
Nahfeldscanner im Zeitbereich.
In Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit, pages 253-260, March 2006.

84

Thiemo Stadtler, Larry Eifler, and Jan Luiken ter Haseborg.
Double probe near field scanner, a new device for measurements in time domain.
In IEEE Symposium on Electromagnetic Compatibility, volume 1, pages 86-90, August 2006.

85

Peter Kralicek.
Makromodellierung des Strahlungsverhaltens von Subsystemen zur Systemanalyse, chapter Bestimmung der Multipolmomente aus den Betragsdaten, pages 47-55.
Dissertation, Institut für Grundlagen der Elektrotechnik und Messtechnik der Universität Hannover, November 2006.

86

Stefano Grivet-Talocia.
EMC group, Politecnico di Torino.
IDEM, a tool for the extraction of lumped equivalent circuits from measured or simulated data.
www.emc.polito.it/software/.

87

Stefano Grivet-Talocia, Flavio. G. Canavero, Igor S. Stievano, and Ivan A. Maio.
Circuit extraction via time-domain vector fitting.
In IEEE Symposium on Electromagnetic Compatibility, pages 1005-1010, August 2004.

88

Stefano Grivet-Talocia and Andrea Ubolli.
On the generation of large passive macromodels for complex interconnect structures.
In IEEE Transactions on Advanced Packaging, volume 29, pages 39-54, February 2006.

89

Alexandre Boyer, Ettiene Sicard, and Sonia Ben Dhia.
IC-EMC, a demonstration freeware for predicting electromagnetic compatibility of integrated circuits.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 16-19, May 2008.

90

IEC.
Cookbook for integrated circuit model ICEM, project number 62014-3.
Technical report, International Electrotechnical Comission, October 2001.

91

Dirk Hesidenz and Thomas Steinecke.
Chip-package EMI modeling and simulation tool EXPO.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 231-234, November 2005.

92

Etienne Sicard, Mathieu Fer, and Lionel Courau.
Package modeling for EMC prediction, a 64 pin case study.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 77-80, November 2007.

93

H Koehne, Thomas Steinecke, Werner John, and H Reichl.
Power grid analysis of CMOS devices for EMI prediction.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 57-59, November 2005.

94

Jaemin Kim, Yujeong Shim, Eakhwan Song, Kyoungchoul Koo, and Joungho Kim.
Modeling of chip level power distribution network based on segmentation method.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 49-54, November 2007.

95

Jerome Cordi, Ali Alaeldine, Jan Luc Levant, Richard Perdriau, Mohamed Ramdani, and Patrice Pinel.
Automated extraction of the passive distribution network of an integrated circuit for the assessment of conducted electromagnetic emission.
In 2008 Asia-Pacific Symposium on Electromagnetic Compatibility, pages 36-39, May 2008.

96

Andreas Gstöttner, Thomas Steinecke, and Mario Huemer.
High level modeling of dynamic switching currents in VLSI IC modules.
In Proceedings of the 5th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 207-210, November 2005.

97

Andreas Gstöttner and Mario Huemer.
Estimation of current profiles for large digital VLSI modules in early design phases.
In Proceedings of the 6th International Workshop on Electromagnetic Compatibility of Integrated Circuits, pages 87-90, November 2007.

98

JEITA.
Promoting the standardization activities of the international electrotechnical commission (IEC) and international standards organization (ISO); cooperating in the formation of japan industrial standards (JIS); establishing JEITA standards.
Japan Electronics and Information Technology Industries Association.
www.jeita.or.jp/english/.

99

Shaowei Deng, Todd Hubing, and Daryl G. Beetner.
Characterizing the electric field coupling from IC heatsink structures to external cables using TEM cell measurements.
In IEEE Transactions on Electromagnetic Compatibility, volume 49, pages 785-791, November 2007.

100

Shaowei Deng, Todd H. Hubing, and Daryl G. Beetner.
Using TEM cell measurements to estimate the maximum radiation from PCBs with cables due to magnetic field coupling.
In IEEE Transactions on Electromagnetic Compatibility, volume 50, pages 419-423, May 2008.

101

Hwan-Woo Shim and Todd H. Hubing.
A closed-form expression for estimating radiated emissions from the power planes in a populated printed circuit board.
In IEEE Transactions on Electromagnetic Compatibility, volume 48, pages 74-81, February 2006.

102

Roger F. Harrington.
Time-harmonic electromagnetic fields, chapter 3, pages 106-109.
IEEE Press and Wiley Intersience, 2 edition, 2001.

103

George Cain and Gunter H. Meyer.
Separation of variables for partial differential equations: An eigenfunction approach.
Chapman and Hall, CRC Press, 2005.

104

Constantine A. Balanis.
Antenna Theory, chapter Fundamental Parameters of Antennas.
John Wiley & Sons Inc., 3 edition, 2005.

105

Keith M. Carver and James W. Mink.
Microstrip antenna technology.
In IEEE Transactions on Antennas Propagation, volume 29, pages 2-24, January 1981.

106

Warren L. Stutzmann and Gary A. Thiele.
Antenna Theory and Design.
John Wiley & Sons Inc., 1981.

107

AR.
EMC, RF, and microwave equipment.
Product information and Datasheets.
www.ar-worldwide.com.

108

Schwarz Rhode.
EMC test and measurement equipment.
Measurement equipment Specifications and application notes.
www2.rohde-schwarz.com.

109

Würth Elektronik.
Circuit board technology, EMC and inductive solutions, intelligent connecting systems, photovoltaics.
Ferrite component datasheets.
www.we-online.de.

110

Christian Poschalko and Siegfried Selberherr.
Radiated emission from the slot of a slim cubical enclosure with multiple sources inside.
In EMC-EUROPE 2008, International Symposium on Electromagnetic Compatibility, pages 1-6, September 2008.

111

CU-ICAR.
Automotive electronics and electromagnetic compatibility.
Electromagnetic compatibility issues and design rules.
www.cvel.clemson.edu/emc/index.html.

112

Todd Hubing.
PCB EMC design guidelines: A brief annotated list.
In IEEE International Symposium on Electromagnetic Compatibility, volume 1, pages 34-36, August 2003.

113

Kenneth L. Kaiser.
Electromagnetic Compatibility Handbook.
CRC Press, 2004.

114

Mark I. Montrose.
Printed Circuit Board Design Techniques for EMC Compliance: A Handbook for Designers.
Wiley-IEEE Press, 2000.

115

Archambeault R. Bruce and James Drewniak.
PCB Design for Real-World EMI Control.
Springer Verlag, 2002.

Subsections

• Own Publications
• Part : Curriculum Vitae

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover