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6.1 Modeling of Low-Pressure Processes
In the following the model for low-pressure processes will be derived in a
general way applicable to etching as well as to deposition processes. Starting
point for the considerations are the transport kinetics of particles in
low-pressure atmospheres, which are completed with the discussion about
particle distributions. Finally the derivations lead to the general
formulation of the rate equations.
Subsections
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Up: 6. Low-Pressure Etching and
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W. Pyka: Feature Scale Modeling for Etching and
Deposition Processes in Semiconductor Manufacturing