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A.5.1 SOI

The idea of the silicon-on-insulator (SOI) technology is to replace the semiconductor below the channel region of a MOSFET with an insulator so as to eliminate or reduce the effects of the parasitic components. The resulting device contains only a thin film of semiconductor, which is partially or fully depleted underneath the gate. For fully depleted SOI this results in a number of advantages: the effects of the depletion capacitance per area \ensuremath{C_{\mathit{d}}} and of the source and drain junctions are mostly eliminated, which results in an ideal subthreshold behavior (i.e. $\ensuremath{S}\xspace \approx 60\rm mV$), greatly reduced junction capacitances \ensuremath{C_{\mathit{SB}}} \ensuremath{C_{\mathit{DB}}}, and immunity against punch-through and alpha particles. Especially the good subthreshold behavior makes SOI attractive for low-voltage applications.

There are, however, some severe drawbacks of SOI, which have their origins in economics and circuit issues rather than in mere device physics: the cost for SOI wafers is much higher than for conventional bulk-technology wafers, the advantages of almost-zero junction capacitance cannot be fully exploited in a circuit because drains are always connected to other gates via interconnects and because of potential circuit instability. Finally, short-channel effects are somewhat reduced but not eliminated. This also limits the maximum allowable thickness of the substrate insulator, which results in a tradeoff between \ensuremath{V_{\mathit{T}}} roll-off and DIBL on the one hand and subthreshold slope and drain capacitance on the other.

Thus, despite the remaining advantages of SOI, this technology is not a silver bullet against the spurious effects of bulk technology, all the more as many options of bulk technology have not been exploited yet. This has so far held back a transition to SOI for high-volume high-performance digital VLSI applications. In other fields such as smart-power technologies SOI is a well-established niche technology due to its excellent isolation properties and the integrability with high-voltage and high-power devices. This provides for an ongoing improvement of SOI wafer fabrication and keeps the SOI question for digital VLSI open.


next up previous contents
Next: A.5.2 Bipolar and BiCMOS Up: A.5 Other IC Technologies Previous: A.5 Other IC Technologies

G. Schrom