1  Introduction

1.1 History of Device Integration Technology
1.2 Limitations of the Current Technology
1.3 Three-Dimensional Integration and TSVs
1.3.1 Types of Three-Dimensional Integration
1.3.2 TSV Fabrication
1.3.3 Via First, Via Middle, and Via Last
1.4 Challenges and Opportunities
1.5 Outline of the Thesis