Within this section, the implementation of the model (5.8) will be used to compute the stress evolution in thin films during thermal cycles. The discussion starts with a simple substrate/film system and evolves progressively towards thin films in a TSV, where the equibiaxial assumption is no longer valid.
Consider again the full-plate sample of Fig. 5.1. Krauss et al. placed this sample in a
thermal cycle up to 500
C at a rate of 1
C/s and recorded the measured stress at each
step. It was inferred from this data, and also from other results of thin film modeling
[81][93], that the stress behavior can be explained by the dislocation glide model described
in the previous section by (5.8).