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Publications Johann Cervenka

73 records

Publications in Scientific Journals

16.   Cervenka, J., Kosik, R., Nedjalkov, M. (2021).
A Deterministic Wigner Approach for Superposed States.
Journal of Computational Electronics, 20(6), 2104–2110. https://doi.org/10.1007/s10825-021-01801-9 (reposiTUm)

15.   Kosik, R., Cervenka, J., Kosina, H. (2021).
Numerical Constraints and Non‑Spatial Open Boundary Conditions for the Wigner Equation.
Journal of Computational Electronics, 20(6), 2052–2061. https://doi.org/10.1007/s10825-021-01800-w (reposiTUm)

14.   Illarionov, Yu. Yu., Vexler, M. I., Karner, M., Tyaginov, S. E., Cervenka, J., Grasser, T. (2015).
TCAD Simulation of Tunneling Leakage Current in CaF2/Si(111) MIS Structures.
Current Applied Physics, 15(2), 78–83. https://doi.org/10.1016/j.cap.2014.10.015 (reposiTUm)

13.   Tyaginov, S. E., Illarionov, Yu. Yu., Vexler, M. I., Bina, M., Cervenka, J., Franco, J., Kaczer, B., Grasser, T. (2014).
Modeling of Deep-Submicron Silicon-Based MISFETs With Calcium Fluoride Dielectric.
Journal of Computational Electronics, 13(3), 733–738. https://doi.org/10.1007/s10825-014-0593-9 (reposiTUm)

12.   Vasicek, M., Cervenka, J., Esseni, D., Palestri, P., Grasser, T. (2012).
Applicability of Macroscopic Transport Models to Decananometer MOSFETs.
IEEE Transactions on Electron Devices, 59(3), 639–646. https://doi.org/10.1109/ted.2011.2181177 (reposiTUm)

11.   Starkov, I., Tyaginov, S., Enichlmair, H., Cervenka, J., Jungemann, C., Carniello, S., Park, J. M., Ceric, H., Grasser, T. (2011).
Hot-Carrier Degradation Caused Interface State Profile-Simulation Versus Experiment.
Journal of Vacuum Science, Technology B, 29(1), 01AB09. https://doi.org/10.1116/1.3534021 (reposiTUm)

10.   Cervenka, J., Kosina, H., Selberherr, S., Zhang, J., Hrauda, N., Stangl, J., Bauer, G., Vastola, G., Marzegalli, A., Montalenti, F., Miglio, L. (2011).
Strained MOSFETs on Ordered SiGe Dots.
Solid-State Electronics, 65–66, 81–87. https://doi.org/10.1016/j.sse.2011.06.041 (reposiTUm)

9.   Tyaginov, S. E., Starkov, I., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J. M., Enichlmair, H., Karner, M., Kernstock, C., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T. (2010).
Interface Traps Density-Of-States as a Vital Component for Hot-Carrier Degradation Modeling.
Microelectronics Reliability, 50, 1267–1272. (reposiTUm)

8.   Ceric, H., de Orio, R. L., Cervenka, J., Selberherr, S. (2009).
A Comprehensive TCAD Approach for Assessing Electromigration Reliability of Modern Interconnects.
IEEE Transactions on Device and Materials Reliability, 9(1), 9–19. https://doi.org/10.1109/tdmr.2008.2000893 (reposiTUm)

7.   Vasicek, M., Cervenka, J., Wagner, M., Karner, M., Grasser, T. (2008).
A 2D Non-Parabolic Six-Moments Model.
Solid-State Electronics, 52(10), 1606–1609. https://doi.org/10.1016/j.sse.2008.06.010 (reposiTUm)

6.   Vasicek, M., Cervenka, J., Wagner, M., Karner, M., Grasser, T. (2008).
Parameter Modeling for Higher-Order Transport Models in UTB SOI MOSFETs.
Journal of Computational Electronics, 7(3), 168–171. https://doi.org/10.1007/s10825-008-0239-x (reposiTUm)

5.   Cervenka, J., Ceric, H., Selberherr, S. (2008).
Three-Dimensional Simulation of Sacrificial Etching.
Microsystem Technologies, 14(4–5), 665–671. https://doi.org/10.1007/s00542-007-0491-1 (reposiTUm)

4.   Wagner, M., Karner, M., Cervenka, J., Vasicek, M., Kosina, H., Holzer, S., Grasser, T. (2007).
Quantum Correction for DG MOSFETs.
Journal of Computational Electronics, 5(4), 397–400. https://doi.org/10.1007/s10825-006-0032-7 (reposiTUm)

3.   Wessner, W., Cervenka, J., Heitzinger, C., Hossinger, A., Selberherr, S. (2006).
Anisotropic Mesh Refinement for the Simulation of Three-Dimensional Semiconductor Manufacturing Processes.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 25(10), 2129–2139. https://doi.org/10.1109/tcad.2005.862750 (reposiTUm)

2.   Cervenka, J., Wessner, W., Al-Ani, E., Grasser, T., Selberherr, S. (2006).
Generation of Unstructured Meshes for Process and Device Simulation by Means of Partial Differential Equations.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 25(10), 2118–2128. https://doi.org/10.1109/tcad.2006.876514 (reposiTUm)

1.  J. Cervenka, R. Klima, M. Knaipp, S. Selberherr:
"Three-Dimensional Device Optimization by Green's Functions";
European Physical Journal - Applied Physics, 21 (2003), 103 - 106. https://doi.org/10.1051/epjap:2002121

Contributions to Books

4.   Cervenka, J., Kosik, R., Vasicek, M.-T., Gritsch, M., Selberherr, S., Grasser, T. (2023).
Macroscopic Transport Models for Classical Device Simulation.
In M. Rudan, R. Brunetti, S. Reggiani (Eds.), Springer Handbook of Semiconductor Devices (pp. 1335–1381). Springer. https://doi.org/10.1007/978-3-030-79827-7_37 (reposiTUm)

3.   Cervenka, J., Ellinghaus, P., Nedjalkov, M. (2015).
Deterministic Solution of the Discrete Wigner Equation.
In I. Dimov, S. Fidanova, I. Lirkov (Eds.), Numerical Methods and Applications (pp. 149–156). Springer International Publishing. https://doi.org/10.1007/978-3-319-15585-2_17 (reposiTUm)

2.   Cervenka, J., Zoric, A., Gurov, T., Arsov, G. (2010).
GRINKO - Grid E-Infrastructure and Networking With Kosovo.
In JOINT RESEARCH AND TECHNOLOGY DEVELOPMENT Projects 2007-2010 (pp. 150–162). KAIP. (reposiTUm)

1.   Wittmann, R., Uppal, S., Hoessinger, A., Cervenka, J., Selberherr, S. (2006).
A Study of Boron Implantation Into High Ge Content SiGe Alloys.
In D. Harame, J. Boquet, M. Caymax, J. Cressler, H. Iwai, S. Koester, G. Masini, J. Murota, A. Reznicek, K. Rim, B. Tillack, S. Zaima (Eds.), ECS Transactions (pp. 667–676). ECS Transactions. https://doi.org/10.1149/1.2355862 (reposiTUm)

Talks and Poster Presentations (with Proceedings-Entry)

45.   Cervenka, J., Kosik, R., Senra Ribeiro, F. (2023).
Parallel Solution of the Schrödinger-Poisson Equation on GPUs.
In 14th International Conference on Large-Scale Scientific Computations (LSSC '23): Scientific Program: Abstracts: List of Participants (pp. 34–35), Sozopol, Bulgaria. (reposiTUm)

44.   Kosik, R., Cervenka, J., Kosina, H. (2021).
Open Boundary Conditions for the Wigner and the Characteristic Von Neumann Equation.
In Book of Abstracts of the International Wigner Workshop (IW2) (pp. 42–43), Waikoloa, Hawaii, USA. (reposiTUm)

43.   Kosik, R., Cervenka, J., Thesberg, M., Kosina, H. (2020).
A Revised Wigner Function Approach for Stationary Quantum Transport.
In Large-Scale Scientific Computing: 12th International Conference, LSSC 2019 (pp. 403–410), Sozopol, Bulgaria. https://doi.org/10.1007/978-3-030-41032-2_46 (reposiTUm)

42.   Kosik, R., Cervenka, J., Kosina, H. (2020).
Numerical Solution of the Constrained Wigner Equation.
In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. https://doi.org/10.23919/sispad49475.2020.9241624 (reposiTUm)

41.   Cervenka, J., Weinbub, J. (2019).
Superposed States and the Wigner Approach.
In Proceedings of the International Conference on Large-Scale Scientific Computations (LSSC) (p. 50), Sozopol, Bulgaria. (reposiTUm)

40.   Cervenka, J., Filipovic, L. (2017).
Numerical Aspects of the Deterministic Solution of the Wigner Equation.
In Book of Abstracts of the International Wigner Workshop (IW2) (pp. 42–43), Waikoloa, Hawaii, USA. (reposiTUm)

39.   Cervenka, J., Ellinghaus, P., Nedjalkov, M., Langer, E. (2015).
Optimization of the Deterministic Solution of the Discrete Wigner Equation.
In Large-Scale Scientific Computing 10th International Conference, LSSC 2015 (pp. 269–276), Sozopol, Bulgaria. https://doi.org/10.1007/978-3-319-26520-9_29 (reposiTUm)

38.   Cervenka, J., Ellinghaus, P. (2015).
Preconditioned Deterministic Solver for the Wigner Equation.
In Abstracts International Conference on Large-Scale Scientific Computations (LSSC) (p. 31), Sozopol, Bulgaria. (reposiTUm)

37.   Cervenka, J., Ellinghaus, P., Nedjalkov, M. (2014).
Deterministic Solution of the Discrete Wigner Equation.
In Eighth International Conference on Numerical Methods and Applications (p. 36), Borovets, Bulgaria. (reposiTUm)

36.   Cervenka, J., Steinmair, A., Park, J., Seebacher, E., Grasser, T. (2012).
TCAD Simulations of Statistical Process Variations for High-Voltage LDMOS Transistors.
In Proceedings of the 3rd European Workshop on CMOS Variability (p. 4), Nice, France. (reposiTUm)

35.   Weinbub, J., Cervenka, J., Rupp, K., Selberherr, S. (2011).
A Generic High-Quality Meshing Framework.
In Proceedings of the 11th US National Congress on Computational Mechanics (USNCCM) (p. 1), Minneapolis, USA. (reposiTUm)

34.   Filipovic, L., Ceric, H., Cervenka, J., Selberherr, S. (2011).
A Simulator for Local Anodic Oxidation of Silicon Surfaces.
In 2011 24th Canadian Conference on Electrical and Computer Engineering(CCECE), Saskatoon, SK, Canada. https://doi.org/10.1109/ccece.2011.6030543 (reposiTUm)

33.   Weinbub, J., Cervenka, J., Rupp, K., Selberherr, S. (2011).
High-Quality Mesh Generation Based on Orthogonal Software Modules.
In 2011 International Conference on Simulation of Semiconductor Processes and Devices, Osaka, Japan. https://doi.org/10.1109/sispad.2011.6035078 (reposiTUm)

32.   Starkov, I., Tyaginov, S., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J., Enichlmair, H., Karner, M., Kernstock, C., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T. (2010).
Analysis of Worst-Case Hot-Carrier Conditions for High Voltage Transistors Based on Full-Band Monte-Carlo Simulations.
In Proceedings of the 17th International Symposium on the Physical, Failure Analysis of Integrated Circuits (pp. 139–144), Singapore. (reposiTUm)

31.   Starkov, I., Tyaginov, S., Enichlmair, H., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J., Ceric, H., Grasser, T. (2010).
HC Degradation Model: Interface State Profile-Simulations vs. Experiment.
In Book of Abstracts (p. 128), Catania. (reposiTUm)

30.   Tyaginov, S., Starkov, I., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J., Enichlmair, H., Karner, M., Kernstock, C., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T. (2010).
Hot-Carrier Degradation Modeling Using Full-Band Monte-Carlo Simulations.
In Proceedings of the 17th International Symposium on the Physical, Failure Analysis of Integrated Circuits (pp. 341–345), Singapore. (reposiTUm)

29.   Tyaginov, S., Starkov, I., Triebl, O., Cervenka, J., Jungemann, C., Carniello, S., Park, J., Enichlmair, H., Karner, M., Kernstock, C., Seebacher, E., Minixhofer, R., Ceric, H., Grasser, T. (2010).
Interface Traps Density-Of-States as a Vital Component for Hot-Carrier Degradation Modeling.
In Proceedings of the 21st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (p. 3), Maastricht. (reposiTUm)

28.   Cervenka, J., Kosina, H., Selberherr, S., Zhang, J., Hrauda, N., Stangl, J., Bauer, G., Vastola, G., Marzegalli, A., Miglio, L. (2010).
Strained MOSFETs on Ordered SiGe Dots.
In Proceedings of the European Solid-State Device Research Conference (ESSDERC) (pp. 297–300), Montreux, Austria. (reposiTUm)

27.   Vasicek, M., Sverdlov, V., Cervenka, J., Grasser, T., Kosina, H., Selberherr, S. (2010).
Transport in Nanostructures: A Comparative Analysis Using Monte Carlo Simulation, the Spherical Harmonic Method, and Higher Moments Models.
In Large-Scale Scientific Computing: 7th International Conference, LSSC 2009 (pp. 443–450), Sozopol, Bulgaria. https://doi.org/10.1007/978-3-642-12535-5_52 (reposiTUm)

26.   Schwaha, P., Cervenka, J., Nedjalkov, M., Gurov, T., Arsov, G., Misev, A., Zoric, A., Ilic, S. (2009).
Computational Electronics on GRID: A Mixed Mode Carrier Transport Model.
In AIP Conference Proceedings, Sozopol (Bulgaria). https://doi.org/10.1063/1.3265331 (reposiTUm)

25.   Ceric, H., de Orio, R., Cervenka, J., Selberherr, S. (2009).
Copper Microstructure Impact on Evolution of Electromigration Induced Voids.
In 2009 International Conference on Simulation of Semiconductor Processes and Devices, San Diego, CA, United States. https://doi.org/10.1109/sispad.2009.5290222 (reposiTUm)

24.   Orio, R., Ceric, H., Cervenka, J., Selberherr, S. (2009).
Electromigration Failure Development in Modern Dual-Damascene Interconnects.
In Proceedings of the International Conference on Very Large Scale Integration (VLSI-SoC) (p. 5), Florianopolis. (reposiTUm)

23.   de Orio, R., Ceric, H., Cervenka, J., Selberherr, S. (2009).
The Effect of Copper Grain Size Statistics on the Electromigration Lifetime Distribution.
In 2009 International Conference on Simulation of Semiconductor Processes and Devices, San Diego, CA, United States. https://doi.org/10.1109/sispad.2009.5290219 (reposiTUm)

22.   Ceric, H., Orio, R., Cervenka, J., Selberherr, S. (2009).
The Effect of Microstructure on Electromigration Induced Voids.
In Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 694–697), Singapore. (reposiTUm)

21.   Orio, R., Ceric, H., Cervenka, J., Selberherr, S. (2009).
The Effect of Microstructure on Electromigration-Induced Failure Development.
In ECS Transactions (pp. 345–352), Ouro Preto. (reposiTUm)

20.   Orio, R., Ceric, H., Cervenka, J., Selberherr, S. (2009).
The Effect of Microstructure on the Electromigration Lifetime Distribution.
In Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA2009) (pp. 731–734), Singapore. (reposiTUm)

19.   Sverdlov, V., Vasicek, M., Cervenka, J., Grasser, T., Kosina, H., Selberherr, S. (2009).
Transport in Nanostructures: A Comparative Analysis Using Monte Carlo Simulation, the Spherical Harmonic Method, and Higher Moments Models.
In Abstracts of the International Conference on Large-Scale Scientific Computations (LSSC) (p. 93), Sozopol, Bulgaria. (reposiTUm)

18.   Cervenka, J., Selberherr, S. (2008).
Analysis of Microstructure Impact on Electromigration.
In 2008 International Conference on Simulation of Semiconductor Processes and Devices, Kanagawa, Japan. https://doi.org/10.1109/sispad.2008.4648282 (reposiTUm)

17.   Vasicek, M., Cervenka, J., Karner, M., Grasser, T. (2008).
Consistent Higher-Order Transport Models for SOI MOSFETs.
In 2008 International Conference on Simulation of Semiconductor Processes and Devices, Kanagawa, Japan. https://doi.org/10.1109/sispad.2008.4648254 (reposiTUm)

16.   Ceric, H., Orio, R., Cervenka, J., Selberherr, S. (2008).
Stress-Induced Anisotropy of Electromigration in Copper Interconnects.
In Proceedings of the Stress-Induced Phenomena in Metallization: 10th International Workshop (pp. 56–62), Dresden. (reposiTUm)

15.   Ceric, H., Orio, R., Cervenka, J., Selberherr, S. (2008).
TCAD Solutions for Submicron Copper Interconnect.
In Proceedings 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 78–81), Singapore. (reposiTUm)

14.   Vasicek, M., Cervenka, J., Wagner, M., Karner, M., Grasser, T. (2007).
A 2d-Non-Parabolic Six Moments Model.
In 2007 International Semiconductor Device Research Symposium (p. 2), College Park, MD, USA. (reposiTUm)

13.   Vasicek, M., Cervenka, J., Karner, M., Wagner, M., Grasser, T. (2007).
Parameter Modeling for Higher-Order Transport Models in UTB SOI MOSFETs.
In Book of Abstracts of the International Workshop on Computational Electronics (IWCE) (pp. 96–97), Urbana-Champaign, IL, USA. (reposiTUm)

12.   Cervenka, J., Ceric, H., Ertl, O., Selberherr, S. (2007).
Three-Dimensional Sacrificial Etching.
In Simulation of Semiconductor Processes and Devices 2007 (pp. 433–436), Vienna, Austria. https://doi.org/10.1007/978-3-211-72861-1_105 (reposiTUm)

11.   Cervenka, J., Ceric, H., Selberherr, S. (2007).
Three-Dimensional Simulation of Sacrificial Etching.
In Smart Sensors, Actuators, and MEMS III (pp. 452–460), Gran Canaria, Spain. https://doi.org/10.1117/12.721979 (reposiTUm)

10.   Wittmann, R., Uppal, S., Hössinger, A., Cervenka, J., Selberherr, S. (2006).
A Study of Boron Implantation Into High Ge Content SiGe Alloys.
In 210th ECS Meeting (p. 1), Cancun. (reposiTUm)

9.   Nentchev, A., Cervenka, J., Marnaus, G., Enichlmair, H., Selberherr, S. (2006).
Heatring - Smart Investigation of Temperature Impact on Integrated Circuit Devices.
In Collection of Papers Presented at the 12th International Workshop on Thermal Investigation of ICs and Systems (pp. 235–238), Nice. (reposiTUm)

8.   Wittmann, R., Hössinger, A., Cervenka, J., Uppal, S., Selberherr, S. (2006).
Monte Carlo Simulation of Boron Implantation Into (100) Germanium.
In 2006 International Conference on Simulation of Semiconductor Processes and Devices, Monterey, California, United States. https://doi.org/10.1109/sispad.2006.282914 (reposiTUm)

7.   Ceric, H., Cervenka, J., Langer, E., Selberherr, S. (2006).
Moving Boundary Applications in Process and Interconnect TCAD.
In Proceedings Mini-Workshop on Anisotropic Motion Laws (pp. 13–16), Oberwolfach. (reposiTUm)

6.   Wessner, W., Ceric, H., Cervenka, J., Selberherr, S. (2005).
Dynamic Mesh Adaptation for Three-Dimensional Electromigration Simulation.
In 2005 International Conference On Simulation of Semiconductor Processes and Devices, Tokyo, Japan. https://doi.org/10.1109/sispad.2005.201494 (reposiTUm)

5.  A. Hössinger, J. Cervenka, S. Selberherr:
"A Multistage Smoothing Algorithm for Coupling Cellular and Polygonal Datastructures";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Cambridge, MA, USA; 2003-09-03 - 2003-09-05; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2003), ISBN: 0-7803-7826-1; 259 - 262. https://doi.org/10.1109/SISPAD.2003.1233686

4.  J. Cervenka, A. Hössinger, R. Minixhofer, T. Grasser, S. Selberherr:
"Dreidimensionale Modellierung Elektronischer Bauteile";
Poster: Informationstagung Mikroelektronik (ME), Wien; 2003-10-01 - 2003-10-02; in: "Beiträge der Informationstagung Mikroelektronik 2003", (2003), ISBN: 3-85133-030-7; 377 - 382.

3.  J. Cervenka, M. Knaipp, A. Hössinger, S. Selberherr:
"Green's Function Approach for Three-Dimensional Diffusion Simulation of Industrial High Voltage Applications";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6; 408 - 411. https://doi.org/10.1007/978-3-7091-6244-6_94

2.  V. Palankovski, G. Röhrer, E. Wachmann, J. Kraft, B. Löffler, J. Cervenka, R. Quay, T. Grasser, S. Selberherr:
"Optimization of High-Speed SiGe HBTs";
Talk: International Symposium on Electron Devices for Microwave and Optoelectronic Applications (EDMO), Wien; 2001-11-15 - 2001-11-16; in: "Proceedings Intl. Symposium on Electron Devices for Microwave and Optoelectronic Applications", (2001), ISBN: 0-7803-7049-x; 187 - 191. https://doi.org/10.1109/EDMO.2001.974305

1.  J. Cervenka, P. Fleischmann, S. Selberherr, M. Knaipp, F. Unterleitner:
"Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation";
Talk: European Solid-State Device Research Conference (ESSDERC), Nürnberg; 2001-09-11 - 2001-09-13; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2001), ISBN: 2-914601-01-8; 227 - 230.

Talks and Poster Presentations (without Proceedings-Entry)

2.   Ullmann, B., Grill, A., Manstetten, P., Jech, M., Kampl, M., Zisser, W., Filipovic, L., Thesberg, M., Rudolf, F., Windbacher, T., Cervenka, J., Katterbauer, M., Weinbub, J. (2016).
Ihr Smartphone - Ein Supercomputer Vor 20 Jahren. Ein Einblick in Die Mikro- Und Nanoelektronik.
Lange Nacht der Forschung 2016, Wien, Austria. (reposiTUm)

1.   Cervenka, J., Ceric, H., Selberherr, S. (2007).
Three-Dimensional Simulation of Sacrificial Etching.
SPIE Smart Sensors, Actuators, and MEMS, Masapalomas, Spain, EU. (reposiTUm)

Doctor's Theses (authored and supervised)

Diploma and Master Theses (authored and supervised)

1.  J. Cervenka:
"Generation of Geometry Conforming Triangular Grids";
Supervisor: S. Selberherr, E. Langer; Institut für Mikroelektronik, 1999.

Scientific Reports

4.   Lorenz, J., Clees, T., Bär, E., Jancke, R., Paschen, U., Lang, P., Salzig, C., Klaaßen, B., Hauser, M., Cervenka, J. (2011).
Hierarchische Simulation Nanoelektronischer Systeme Zur Beherrschung Von Prozessschwankungen.
(reposiTUm)

3.   Lorenz, J., Clees, T., Bär, E., Jancke, R., Paschen, U., Lang, P., Salzig, C., Klaaßen, B., Hauser, M., Cervenka, J. (2010).
Hierarchische Simulation Nanoelektronischer Systeme Zur Beherrschung Von Prozessschwankungen
 (No. M5). (reposiTUm)

2.   Kosina, H., Cervenka, J. (2010).
MOdeling and DEsign of Reliable, Process Variation-Aware Nanoelectronic Devices, Circuits and Systems.
(reposiTUm)

1.   Binder, T., Cervenka, J., Gehring, A., Harlander, C., Heitzinger, C., Selberherr, S. (2001).
VISTA Status Report June 2001.
(reposiTUm)