Publications Christian Hollauer
25 recordsContributions to Books
2. | Ceric, H., Heinzl, R., Hollauer, C., Grasser, T., Selberherr, S. (2006). Microstructure and Stress Aspects of Electromigration Modeling. In Stress-Induced Phenomena in Metallization (pp. 262–268). American Institute of Physics. (reposiTUm) | |
1. | Hollauer, C., Ceric, H., Selberherr, S. (2005). Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress. In ECS Meeting Abstracts (pp. 734–734). ECS Transactions. https://doi.org/10.1149/ma2005-02/19/734 (reposiTUm) | |
Talks and Poster Presentations (with Proceedings-Entry)
15. | Hollauer, C., Ceric, H., van Barel, G., Witvrouw, A., Selberherr, S. (2007). Investigation of Intrinsic Stress Effects in Cantilever Structures. In Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (CD ROM) (p. 4), Bangkok, Thailand. (reposiTUm) | |
14. | Hollauer, C., Ceric, H., Selberherr, S. (2006). Modeling of Intrinsic Stress Effects in Deposited Thin Films. In Eurosensors 20th Anniversary Vol. 1 (pp. 324–325), Göteborg, Sweden. (reposiTUm) | |
13. | Ceric, H., Hollauer, C., Selberherr, S. (2006). Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines. In Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 359–363), Singapore. (reposiTUm) | |
12. | Ceric, H., Hollauer, C., Selberherr, S. (2006). Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films. In 2006 International Conference on Simulation of Semiconductor Processes and Devices, Monterey, California, United States. https://doi.org/10.1109/sispad.2006.282869 (reposiTUm) | |
11. | Holzer, S., Hollauer, C., Ceric, H., Karner, M., Grasser, T., Langer, E., Selberherr, S. (2006). Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress. In Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 154–157), Singapore. (reposiTUm) | |
10. | Ceric, H., Deshpande, V., Hollauer, C., Holzer, S., Grasser, T., Selberherr, S. (2005). Comprehensive Analysis of Vacancy Dynamics Due to Electromigration. In Proceedings of the 12th International Symposium on the Physical, Failure Analysis of Integrated Circuits (pp. 100–103), Singapore. (reposiTUm) | |
9. | Hollauer, C., Holzer, S., Ceric, H., Wagner, S., Grasser, T., Selberherr, S. (2005). Investigation of Thermo-Mechanical Stress in Modern Interconnect Layouts. In Proceedings of The Sixth International Congress on Thermal Stresses (pp. 637–640), Wien, Austria. (reposiTUm) | |
8. | Ceric, H., Hollauer, C., Selberherr, S. (2005). Microstructure and Stress Aspects of Electromigration Modeling. In 8th International Workshop on Stress-Induced Phenomena in Metallization (p. P 17), Dresden. (reposiTUm) | |
7. | Hollauer, C., Ceric, H., Selberherr, S. (2005). Three-Dimensional Simulation of Stress Dependent Thermal Oxidation. In 2005 International Conference On Simulation of Semiconductor Processes and Devices, Tokyo, Japan. https://doi.org/10.1109/sispad.2005.201503 (reposiTUm) | |
6. | Hollauer, C., Ceric, H., Selberherr, S. (2005). Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress. In 208th ECS Meeting (p. 1), Los Angeles. (reposiTUm) | |
5. | Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Entner, R., Langer, E., Grasser, T., Selberherr, S. (2005). Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis. In NSTI Nanotech Technical Proceedings (pp. 620–623), Anaheim, Austria. (reposiTUm) | |
4. | Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Langer, E., Grasser, T., Selberherr, S. (2005). Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress. In VLSI Circuits and Systems II (pp. 380–387), Sevilla, Spain. https://doi.org/10.1117/12.608414 (reposiTUm) | |
3. | W. Wessner, Ch. Hollauer, A. Hössinger, S. Selberherr: "Anisotropic Laplace Refinement for Three-Dimensional Oxidation Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (2004), ISBN: 3211224688; 165 - 168. https://doi.org/10.1007/978-3-7091-0624-2_39 | |
2. | Ch. Hollauer, H. Ceric, S. Selberherr: "Simulation of Thermal Oxidation: A Three-Dimensional Finite Element Approach"; Talk: European Solid-State Device Research Conference (ESSDERC), Estoril; 2003-09-16 - 2003-09-18; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2003), ISBN: 0-7803-7999-3; 383 - 386. | |
1. | Ch. Hollauer, H. Ceric, S. Selberherr: "Three-Dimensional Modeling of Thermal Oxidation of Silicon by Means of the Finite Element Method"; Talk: Industrial Simulation Conference (ISC), Valencia; 2003-06-09 - 2003-06-11; in: "Industrial Simulation Conference 2003", (2003), ISBN: 90-77381-03-1; 154 - 158. | |
Talks and Poster Presentations (without Proceedings-Entry)
2. | Wessner, W., Ceric, H., Hollauer, C., Langer, E., Selberherr, S. (2005). Electromigration Reliability TCAD Solutions. SEMICON Europa2005, München, Austria. (reposiTUm) | |
1. | Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Langer, E., Grasser, T., Selberherr, S. (2005). Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress. SPIE VLSI Circuits and Systems, Sevilla, Spain, Austria. (reposiTUm) | |
Doctor's Theses (authored and supervised)
2. | Hollauer, C. (2007). Modeling of Thermal Oxidation and Stress Effects Technische Universität Wien. https://resolver.obvsg.at/urn:nbn:at:at-ubtuw:1-17195 (reposiTUm) | |
1. | Ch. Hollauer: "Modelling of Thermal Oxidation and Stress Effects"; Supervisor, Reviewer: S. Selberherr, M. Vellekoop; Institut für Mikroelektronik, 2007; oral examination: 2007-04-18. | |
Diploma and Master Theses (authored and supervised)
2. | Ch. Hollauer: "Implementierung einer HDF5-Datenschnittstelle für den Wafer State Server"; Supervisor: E. Langer, T. Binder; Institut für Mikroelektronik, 2002. | |
1. | Hollauer, C. (2002). Implementierung Einer HDF5-Datenschnittstelle Für Den Wafer-State-Server Technische Universität Wien. (reposiTUm) | |
Scientific Reports
2. | Entner, R., Heinzl, R., Hollauer, C., Sheikholeslami, A., Wittmann, R., Selberherr, S. (2005). VISTA Status Report June 2005. (reposiTUm) | |
1. | Hollauer, C., Sheikholeslami, A., Palankovski, V., Wagner, S., Wittmann, R., Selberherr, S. (2003). VISTA Status Report June 2003. (reposiTUm) | |