Publications Marco Rovitto
8 recordsTalks and Poster Presentations (with Proceedings-Entry)
7. | Rovitto, M., Ceric, H. (2016). Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper Through Silicon Vias. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.49 (reposiTUm) | |
6. | Papaleo, S., Rovitto, M., Ceric, H. (2016). Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.19 (reposiTUm) | |
5. | Ceric, H., Orio, R., Rovitto, M. (2016). TCAD Approach for the Assessment of Interconnect Reliability. In Abstracts of the International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP) (p. T21), Bad Schandau, Germany. (reposiTUm) | |
4. | Rovitto, M., Zisser, W., Ceric, H. (2015). Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs. In Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. (reposiTUm) | |
3. | Rovitto, M., Zisser, W., Ceric, H., Grasser, T. (2015). Electromigration Modelling of Void Nucleation in Open Cu-TSVs. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium. https://doi.org/10.1109/eurosime.2015.7103100 (reposiTUm) | |
2. | Ceric, H., Rovitto, M. (2015). Impact of Microstructure and Current Crowding on Electromigration: A TCAD Study. In 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Washington, DC, United States. https://doi.org/10.1109/sispad.2015.7292292 (reposiTUm) | |
1. | Ceric, H., Zisser, W., Rovitto, M., Selberherr, S. (2014). Electromigration in Solder Bumps: A Mean-Time-To-Failure TCAD Study. In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. https://doi.org/10.1109/sispad.2014.6931603 (reposiTUm) | |
Doctor's Theses (authored and supervised)
1. | Rovitto, M. (2016). Electromigration Reliability Issue in Interconnects for Three-Dimensional Integration Technologies Technische Universität Wien. https://doi.org/10.34726/hss.2016.41221 (reposiTUm) | |