Publications Marco Rovitto

8 records

Talks and Poster Presentations (with Proceedings-Entry)

7.   Rovitto, M., Ceric, H. (2016).
Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper Through Silicon Vias.
In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.49 (reposiTUm)

6.   Papaleo, S., Rovitto, M., Ceric, H. (2016).
Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall.
In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.19 (reposiTUm)

5.   Ceric, H., Orio, R., Rovitto, M. (2016).
TCAD Approach for the Assessment of Interconnect Reliability.
In Abstracts of the International Conference Reliability and Stress-Related Phenomena in Nanoelectronics - Experiment and Simulation (IRSP) (p. T21), Bad Schandau, Germany. (reposiTUm)

4.   Rovitto, M., Zisser, W., Ceric, H. (2015).
Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs.
In Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. (reposiTUm)

3.   Rovitto, M., Zisser, W., Ceric, H., Grasser, T. (2015).
Electromigration Modelling of Void Nucleation in Open Cu-TSVs.
In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium. https://doi.org/10.1109/eurosime.2015.7103100 (reposiTUm)

2.   Ceric, H., Rovitto, M. (2015).
Impact of Microstructure and Current Crowding on Electromigration: A TCAD Study.
In 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Washington, DC, United States. https://doi.org/10.1109/sispad.2015.7292292 (reposiTUm)

1.   Ceric, H., Zisser, W., Rovitto, M., Selberherr, S. (2014).
Electromigration in Solder Bumps: A Mean-Time-To-Failure TCAD Study.
In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. https://doi.org/10.1109/sispad.2014.6931603 (reposiTUm)

Doctor's Theses (authored and supervised)