Publications Hannes Stippel

15 records

Books and Editorships

1.  S. Selberherr, H. Stippel, R. Strasser (ed.):
"Simulation of Semiconductor Devices and Processes, Vol.5";
Springer-Verlag, Wien - New York, 1993, ISBN: 978-3-7091-7372-5; 504 pages. https://doi.org/10.1007/978-3-7091-6657-4

Publications in Scientific Journals

3.  H. Stippel, E. Leitner, C. Pichler, H. Puchner, E. Strasser, S. Selberherr:
"Process Simulation for the 1990s";
Microelectronics Journal (invited), 26 (1995), 2-3; 203 - 215. https://doi.org/10.1016/0026-2692(95)98922-E

2.  S. Halama, F. Fasching, C. Fischer, H. Kosina, E. Leitner, P. Lindorfer, C. Pichler, H. Pimingstorfer, H. Puchner, G. Rieger, G. Schrom, T. Simlinger, M. Stiftinger, H. Stippel, E. Strasser, W. Tuppa, K. Wimmer, S. Selberherr:
"The Viennese Integrated System for Technology CAD Applications";
Microelectronics Journal, 26 (1995), 137 - 158. https://doi.org/10.1016/0026-2692(95)98918-H

1.  H. Stippel, S. Selberherr:
"Monte Carlo Simulation of Ion Implantation for Three-Dimensional Structures Using an Octree";
IEICE Transactions on Electronics, E77-C (1994), 2; 118 - 123.

Talks and Poster Presentations (with Proceedings-Entry)

9.  S. Halama, F. Fasching, C. Fischer, H. Kosina, E. Leitner, C. Pichler, H. Pimingstorfer, H. Puchner, G. Rieger, G. Schrom, T. Simlinger, M. Stiftinger, H. Stippel, E. Strasser, W. Tuppa, K. Wimmer, S. Selberherr:
"The Viennese Integrated System for Technology CAD Applications";
Talk: Workshop on Technology CAD Systems, Wien (invited); 1993-09-06; in: "Proceedings Technology CAD Systems Workshop", (1993), ISBN: 3-211-82505-3; 197 - 236. https://doi.org/10.1007/978-3-7091-9315-0_10

8.  H. Stippel, S. Selberherr:
"Three Dimensional Monte Carlo Simulation of Ion Implantation with Octree Based Point Location";
Poster: VLSI Process and Device Modeling Workshop (VPAD), Nara; 1993-05-14 - 1993-05-15; in: "Proceedings VPAD Workshop", (1993), ISBN: 0-7803-1338-0; 122 - 123.

7.  H. Stippel, S. Halama, G. Hobler, K. Wimmer, S. Selberherr:
"Adaptive Grid for Monte Carlo Simulation of Ion Implantation";
Talk: International Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits (NUPAD), Seattle; 1992-05-31 - 1992-06-01; in: "Proceedings NUPAD IV", (1992), ISBN: 0-7803-0516-7; 231 - 236.

6.  H. Stippel, F. Fasching, C. Fischer, S. Halama, H. Pimingstorfer, W. Tuppa, K. Wimmer, S. Selberherr:
"Implementation of a TCAD Framework";
Talk: European Simulation Multiconference (ESM), York; 1992-06-01 - 1992-06-03; in: "Proceedings European Simulation Multiconference", (1992), ISBN: 1-56555-013-7; 131 - 135.

5.  H. Stippel, G. Hobler, S. Selberherr:
"Three-Dimensional Simulation of Ion Implantation";
Talk: International Conference on Solid State and Integrated Circuit Technology (ICSICT), Peking; 1992-10-18 - 1992-10-24; in: "Proceedings Solid State and Integrated Circuit Technology 92 Conference", (1992), 703 - 705.

4.  F. Fasching, C. Fischer, S. Halama, H. Pimingstorfer, H. Read, S. Selberherr, H. Stippel, W. Tuppa, P. Verhas, K. Wimmer:
"A New Open Technology CAD System";
Talk: European Solid-State Device Research Conference (ESSDERC), Montreux; 1991-09-16 - 1991-09-19; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (1991), ISBN: 0-444-89066-1; 217 - 220. https://doi.org/10.1016/0167-9317(91)90216-Z

3.  F. Fasching, C. Fischer, S. Selberherr, H. Stippel, W. Tuppa, H. Read:
"A PIF Implementation for TCAD Purposes";
Talk: International Conference on the Simulation of Semiconductor Devices and Processes (SISDEP), Zürich; 1991-09-12 - 1991-09-14; in: "Proceedings SISDEP 91", (1991), ISBN: 3-89191-476-8; 477 - 482.

2.  F. Fasching, C. Fischer, S. Halama, H. Pimingstorfer, H. Read, S. Selberherr, H. Stippel, P. Verhas, K. Wimmer:
"An Integrated Technology CAD Environment";
Talk: VLSI Technology, Systems and Applications Symposium (VLSITSA), Taipeh; 1991-05-22 - 1991-05-24; in: "Proceedings VLSI Technology, Systems and Applications Symposium", (1991), ISBN: 0-7803-0036-x; 147 - 151.

1.  S. Selberherr, C. Fischer, S. Halama, H. Pimingstorfer, H. Read, H. Stippel, P. Verhas, K. Wimmer:
"The Viennese TCAD System";
Talk: VLSI Process and Device Modeling Workshop (VPAD), Oiso (invited); 1991-05-26 - 1991-05-27; in: "Proceedings VPAD Workshop", (1991), 32 - 35.

Doctor's Theses (authored and supervised)

1.  H. Stippel:
"Simulation der Ionen-Implantation";
Supervisor, Reviewer: S. Selberherr, W. Fallmann; Institut für Mikroelektronik, 1993; oral examination: 1993-11-17.

Scientific Reports

1.  S. Halama, C. Pichler, G. Rieger, S. Selberherr, T. Simlinger, H. Stippel, E. Strasser:
"VISTA Status Report December 1993";
1993; 19 pages.