Publications Wolfhard Zisser
25 recordsPublications in Scientific Journals
| 3. | Papaleo, S., Zisser, W. H., Singulani, A. P., Ceric, H., Selberherr, S. (2016). Stress Evolution During Nanoindentation in Open TSVs. IEEE Transactions on Device and Materials Reliability, 16(4), 470–474. https://doi.org/10.1109/tdmr.2016.2622727 (reposiTUm) | |
| 2. | Zisser, W. H., Ceric, H., Weinbub, J., Selberherr, S. (2014). Electromigration Reliability of Open TSV Structures. Microelectronics Reliability, 54(9–10), 2133–2137. https://doi.org/10.1016/j.microrel.2014.07.099 (reposiTUm) | |
| 1. | Ceric, H., Orio, R., Zisser, W., Selberherr, S. (2014). Microstructural Impact on Electromigration: A TCAD Study. Facta Universitatis - Series: Electronics and Energetics, 27(1), 1–11. https://doi.org/10.2298/fuee1401001c (reposiTUm) | |
Talks and Poster Presentations (with Proceedings-Entry)
| 19. | Filipovic, L., de Orio, R., Zisser, W., Selberherr, S. (2017). Modeling Electromigration in Nanoscaled Copper Interconnects. In 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan. https://doi.org/10.23919/sispad.2017.8085289 (reposiTUm) | |
| 18. | Rovitto, M., Zisser, W., Ceric, H. (2015). Analysis of Electromigration Void Nucleation Failure Time in Open Copper TSVs. In Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. (reposiTUm) | |
| 17. | Papaleo, S., Zisser, W., Ceric, H. (2015). Effects of the Initial Stress at the Bottom of Open TSVs. In Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. (reposiTUm) | |
| 16. | Rovitto, M., Zisser, W., Ceric, H., Grasser, T. (2015). Electromigration Modelling of Void Nucleation in Open Cu-TSVs. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Ghent, Belgium. https://doi.org/10.1109/eurosime.2015.7103100 (reposiTUm) | |
| 15. | Papaleo, S., Zisser, W., Ceric, H. (2015). Factors That Influence Delamination at the Bottom of Open TSVs. In 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Washington, DC, United States. https://doi.org/10.1109/sispad.2015.7292350 (reposiTUm) | |
| 14. | Zisser, W., Ceric, H., Weinbub, J., Selberherr, S. (2014). Electromigration Reliability of Open TSV Structures. In Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) (p. 48), Maastricht. (reposiTUm) | |
| 13. | Ceric, H., Zisser, W., Rovitto, M., Selberherr, S. (2014). Electromigration in Solder Bumps: A Mean-Time-To-Failure TCAD Study. In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. https://doi.org/10.1109/sispad.2014.6931603 (reposiTUm) | |
| 12. | Zisser, W., Ceric, H., Weinbub, J., Selberherr, S. (2014). Electromigration Induced Resistance Increase in Open TSVs. In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. https://doi.org/10.1109/sispad.2014.6931610 (reposiTUm) | |
| 11. | Zisser, W., Ceric, H., Weinbub, J., Selberherr, S. (2014). Electromigration Reliability of Open TSV Structures. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. https://doi.org/10.1109/ipfa.2014.6898179 (reposiTUm) | |
| 10. | Ceric, H., Zisser, W., Selberherr, S. (2014). Quantum Mechanical Calculations of Electromigration Characteristics. In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 16), Kyoto, Japan. (reposiTUm) | |
| 9. | Papaleo, S., Zisser, W., Singulani, A., Ceric, H., Selberherr, S. (2014). Stress Analysis in Open TSVs After Nanoindentation. In Abstracts (pp. 39–40), Thun, Switzerland. (reposiTUm) | |
| 8. | Zisser, W., Ceric, H., Selberherr, S. (2014). Stress Development and Void Evolution in Open TSVs. In Abstracts (pp. 38–39), Thun, Switzerland. (reposiTUm) | |
| 7. | Papaleo, S., Zisser, W., Singulani, A., Ceric, H., Selberherr, S. (2014). Stress Evolution During the Nanoindentation in Open TSVs. In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 44), Kyoto, Japan. (reposiTUm) | |
| 6. | Zisser, W., Ceric, H., Selberherr, S. (2014). Void Evolution in Open TSVs. In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 58), Kyoto, Japan. (reposiTUm) | |
| 5. | Zisser, W., Ceric, H., de Orio, R., Selberherr, S. (2013). Electromigration Analyses of Open TSVs. In 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, United Kingdom. https://doi.org/10.1109/sispad.2013.6650620 (reposiTUm) | |
| 4. | Zisser, W., Ceric, H., de Orio, R., Selberherr, S. (2013). Electromigration Induced Stress in Open TSVs. In 2013 IEEE International Integrated Reliability Workshop Final Report, S. Lake Tahoe. https://doi.org/10.1109/iirw.2013.6804179 (reposiTUm) | |
| 3. | Ceric, H., De Orio, R., Zisser, W., Selberherr, S. (2012). Ab Initio Method for Electromigration Analysis. In 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, Singapore. https://doi.org/10.1109/ipfa.2012.6306306 (reposiTUm) | |
| 2. | Ceric, H., Orio, R., Zisser, W., Schnitzer, V., Selberherr, S. (2012). Modeling of Microstructural Effects on Electromigration Failure. In Abstracts of 12th International Workshop on Stress-Induced Phenomena in Microelectronics (pp. 50–51), Kyoto, Japan. (reposiTUm) | |
| 1. | Ceric, H., de Orio, R., Schanovsky, F., Zisser, W., Selberherr, S. (2011). Multilevel Simulation for the Investigation of Fast Diffusivity Paths. In 2011 International Conference on Simulation of Semiconductor Processes and Devices, Osaka, Japan. https://doi.org/10.1109/sispad.2011.6035068 (reposiTUm) | |
Talks and Poster Presentations (without Proceedings-Entry)
| 1. | Ullmann, B., Grill, A., Manstetten, P., Jech, M., Kampl, M., Zisser, W., Filipovic, L., Thesberg, M., Rudolf, F., Windbacher, T., Cervenka, J., Katterbauer, M., Weinbub, J. (2016). Ihr Smartphone - Ein Supercomputer Vor 20 Jahren. Ein Einblick in Die Mikro- Und Nanoelektronik. Lange Nacht der Forschung 2016, Wien, Austria. (reposiTUm) | |
Doctor's Theses (authored and supervised)
| 1. | Zisser, W. H. (2016). Electromigration in Interconnect Structures Technische Universität Wien. https://doi.org/10.34726/hss.2016.37905 (reposiTUm) | |
Diploma and Master Theses (authored and supervised)
| 1. | Zisser, W. H. (2011). Untersuchung an Kupferkristallen Unter Zuhilfenahme Von MD Simulationen Technische Universität Wien. (reposiTUm) | |