A two- and three-dimensional interconnect simulator
The program package SAP is a finite element simulator, designed specifically for highly accurate analysis of multi-layer VLSI interconnect structures. It supports resistance, capacitance, and inductance extraction, coupled electro-thermal simulations, calculation of delay times and cross-talk. The package also includes preprocessors for two- and three-dimensional geometry construction (solid modeling) and automatic grid generation, as well as a visualization tool, which allows further investigation of the calculated results.
The SAP package contains the following simulators and auxiliary tools:
This software can be obtained via our Download Portal.