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THREE-DIMENSIONAL LAYOUT-BASED THERMAL AND CAPACITIVE SIMULATION OF INTERCONNECT STRUCTURES

A. STACH
Institute for Microelectronics
A-1040, Gusshausstrasse 27-29
Vienna, Austria
R. SABELKA
Institute for Microelectronics
A-1040, Gusshausstrasse 27-29
Vienna, Austria
S. SELBERHERR
Institute for Microelectronics
A-1040, Gusshausstrasse 27-29
Vienna, Austria



 

Rainer Sabelka
1998-01-30