We are proud to announce that our colleague Hajdin Ceric has been invited by the IEEE International Reliability Physics Symposium organizers to give a talk on “Electromigration in Gold: Challenges and Possibilities” on Wednesday, April 2nd 2025 at 9:30 at the IRPS Conference (Metallization/BEOL Reliability Topic).

Electromigration is a critical long-term reliability issue affecting metallic interconnects. To mitigate the risk of interconnect failure, various technological solutions have been investigated and implemented. The development of theoretical models and their application in predictive simulations of interconnect metal degradation due to electromigration have been crucial in this process. A thorough understanding of electromigration at a fundamental level has paved the way for its application in processing silicon surfaces and forming silicon nanowires. The invited talk at this year's IRPS conference will present recent results on the electromigration-controlled transformation of the shape and position of liquid gold droplets on silicon surfaces.