| SYMBOL | DESCRIPTION | UNIT |
| channel thickness | cm | |
| effective Richardson constant | A |
|
| heat capacity | J |
|
|
|
electron, hole Auger coefficient | cm |
| electron, hole diffusivity | cm |
|
| electric field | V |
|
|
|
breakdown/critical electric field | V |
|
|
acceptor, donor energy | eV |
|
|
indirect bandgap | eV |
|
|
exciton energy gap | eV |
|
|
conduction, valence band energy | eV |
|
|
Fermi energy | eV |
|
|
electron, hole, trap energy | eV |
| intrinsic Fermi energy | eV | |
|
|
exciton binding energy | eV |
|
|
acceptor, donor ionization energy | eV |
| frequency | Hz | |
|
|
cutoff frequency | Hz |
|
|
maximum frequency | Hz |
| occupation probability of traps | 1 | |
| generation rate | cm
|
|
|
|
electron, hole impact ionization coefficients | cm |
|
|
conductance | A |
|
|
acceptor, donor degeneracy factor | 1 |
| SYMBOL | DESCRIPTION | UNIT |
|
|
electric current density | A |
| particle current density | cm |
|
| thermal conductivity | W |
|
|
|
gate length | cm |
| electron, hole diffusion length | cm | |
|
|
electron, hole effective mass | kg |
| carrier mobility | cm |
|
|
|
low field carrier mobility | cm |
|
|
high field carrier mobility | cm |
|
|
undoped material carrier mobility | cm |
|
|
highly doped material carrier mobility | cm |
|
|
number of minima in the conduction and valence band | 1 |
| electron density | cm |
|
| intrinsic density | cm |
|
| Shockley-Read-Hall parameter | cm |
|
|
|
blocking layer doping concentration | cm |
|
|
acceptor, donor doping concentration | cm |
|
|
effective density of states | cm |
|
|
ionized donor concentration | cm |
|
|
ionized acceptor concentration | cm |
| density of occupied traps | cm |
|
|
|
density of empty traps | cm |
|
|
doping concentrartion at (
|
cm |
| hole density | cm |
|
| Shockley-Read-Hall parameter | cm |
|
|
|
elementary electric charge | A |
|
|
electron, hole quasi-Fermi potential | V |
|
|
barrier height | V |
|
|
metal work function | V |
|
|
semiconductor work function | V |
|
|
work function difference | V |
| electrostatic potential | eV | |
|
|
built-in potential | eV |
|
|
relative dielectric constant | 1 |
| recombination rate | cm
|
|
|
|
specific on-resistance | V |
| electrical conductivity | A |
|
| resistivity | V |
|
| charge density | A |
|
| entropy density | eV |
|
|
|
electron, hole energy flux density | J |
| temperature | K |
| SYMBOL | DESCRIPTION | UNIT |
|
|
electron, hole, and lattice temperature | K |
| reference temperature (300 K) | K | |
|
|
elctron, hole energy relaxation times | s |
|
|
effective lifetime of recombination or generation process | s |
|
|
effective electron, hole minority carrier lifetime | s |
|
|
electron, hole minority carrier lifetime of impurity t |
s |
|
|
trap, acceptor, donor time constant | s |
|
|
space charge generation lifetime | s |
| total energy density | eV |
|
| substitute for electron or hole density | cm |
|
| carrier velocity | cm |
|
|
|
electrons, holes, saturation velocity | cm |
|
|
constant specifying how velocity goes into saturation | 1 |
|
|
breakdown voltage | V |
| built-in voltage | V | |
|
|
drain, gate, source voltage | V |
|
|
threshold voltage | V |
| depletion region width | cm | |
|
|
gate width | cm |
| angular frequency | Hz | |
| electron affinity | V | |
|
|
acceptor, donor ionization degree | 1 |
|
|
constant measure how mobility changes from
|
1 |
|
|
constant temperature coefficient for
|
1 |
|
|
constant temperature coefficient for
|
1 |
|
|
phonon energy | eV |
T. Ayalew: SiC Semiconductor Devices Technology, Modeling, and Simulation