| Symbol |
|
Unit |
|
Description |
 |
|
1 |
|
Engineering strain component  |
 |
|
1 |
|
Component of the strain tensor |
 |
|
GPa |
|
Component of the stress tensor |
 |
|
GPa |
|
Component of the elastic stiffness tensor |
 |
|
GPa |
|
Component of the contracted stiffness tensor |
 |
|
GPa |
|
Component of the elastic compliance tensor |
 |
|
GPa |
|
Component of the contracted compliance tensor |
 |
|
eV |
|
Electron affinity of the semiconductor |
 |
|
m s |
|
Electron diffusion coefficient |
 |
|
m s |
|
Hole diffusion coefficient |
 |
|
Vm |
|
Electric field |
 |
|
eV |
|
Energy |
 |
|
eV |
|
Conduction band edge energy |
 |
|
eV |
|
Valence band edge energy |
 |
|
eV |
|
Band gap energy |
 |
|
V |
|
Potential |
 |
|
eV |
|
Work function difference between metal and semiconductor |
 |
|
m eV |
|
Density of states |
 |
|
eV |
|
Phonon energy |
 |
|
Am |
|
Electron current density |
 |
|
Am |
|
Hole current density |
 |
|
m |
|
Wave number |
 |
|
m |
|
Wave number vector |
 |
|
1 |
|
Relative dielectric permittivity |
 |
|
1 |
|
Relative magnetic permeability |
 |
|
m V s |
|
Electron mobility |
 |
|
m V s |
|
Hole mobility |
 |
|
m V s |
|
Effective electron mobility |
 |
|
kg |
|
Mass |
 |
|
kg |
|
Carrier effective mass in the semiconductor |