Eigene Veröffentlichungen

[V1]
C. Harlander, R. Sabelka, R. Minixhofer, and S. Selberherr, ``Three-dimensional transient electro-thermal simulation,'' in Proc. 5th THERMINIC Workshop, pp. 169-172, Rome, Italy, Okt. 1999.

[V2]
C. Harlander, R. Sabelka, and S. Selberherr, ``Inductance calculation in interconnect structures,'' in Proc. 3rd Int. Conf. on Modeling and Simulation of Microsystems, pp. 416-419, San Diego, USA, März 2000.

[V3]
R. Sabelka, C. Harlander, and S. Selberherr, ``Propagation of RF signals in microelectronic structures,'' in Abstracts Challenges in Predictive Process Simulation, pp. 50-51, Wandlitz, Deutschland, Mai 2000, (eingeladen).

[V4]
R. Sabelka, C. Harlander, and S. Selberherr, ``The state of the art in interconnect simulation,'' in Proc. Simulation of Semiconductor Processes and Devices, pp. 6-11, Seattle, USA, Sep. 2000, (eingeladen).

[V5]
C. Harlander, R. Sabelka, and S. Selberherr, ``Three-dimensional electro-thermal simulation of interconnect structures with temperature-dependent permittivity,'' in Proc. The PACIFIC RIM/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, Hawaii, USA, Jul. 2001.

[V6]
C. Harlander, R. Sabelka, and S. Selberherr, ``A comparative study of two numerical techniques for inductance calculation in interconnect structures,'' in Proc. Simulation of Semiconductor Processes and Devices, pp. 254-257, Athen, Greece, Sep. 2001.

[V7]
C. Harlander, R. Sabelka, and S. Selberherr, ``Efficient inductance calculation in interconnect structures by applying the Monte Carlo method,'' Microelectronics Journal, eingereicht.

[V8]
C. Harlander, R. Sabelka, and S. Selberherr, ``Two efficient methods for calculating inductances in interconnect structures,'' IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, eingereicht.

C. Harlander: Numerische Berechnung von Induktivitšten in dreidimensionalen Verdrahtungsstrukturen