| ALD |
... | Atomic layer deposition |
| CAD |
... | Computer aided design |
| CNT |
... | Carbo-Nanotube |
| CORBA |
... | Common Object Request Broker Architecture |
| CPU |
... | Central processing unit |
| CVD |
... | Chemical vapour deposition |
| COO |
... | Cost of ownership |
| DD |
... | Drift Diffusion |
| DNA |
... | Deoxyribonucleic acid |
| ELK |
... | Extreme
low-
|
| ELSA |
... | Enhanced Level-Set Applications |
| EOT |
... | Effective oxide thickness |
| FET |
... | Field effect transistor |
| Gb |
... | Gigabit |
| GB |
... | Gigabyte |
| GHz |
... | Gigahertz |
| GUI |
... | Graphical user interface |
| ILD |
... | Interlayer dielectric |
| IPD |
... | Inputdeck language |
| IT |
... | Information Technoloy |
| ITRS |
... | International Technology Roadmap for Semiconductors |
| LPCVD |
... | Low pressure chemical vapour deposition |
| MC |
... | Monte Carlo |
| MTTF |
... | Mean time to failure |
| MILP |
... | Mixed integer linear programming |
| n-Si |
... | n-doped Silicon |
| NFS |
... | Network file system |
| NTC |
... | Negative temperature coefficient |
| OSG |
... | Organo-silcate glass |
| p-Si |
... | p-doped Silicon |
| poly |
... | polycrystalline |
|
... | polycrystalline Silicon |
| PTC |
... | Positive temperature coefficient |
| PTFE |
... | Polytetrafluoroethylene |
| PZT |
... | Lead Zirkonium Titanate
|
| RE |
... | Rare earth elements, member of the lanthanoide group {La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy,
Ho, Er, Tm, Yb, Lu} |
| RTD |
... | Resonant tunneling diode |
| SEILIB |
... | Simulation Environment Interaction Library |
| SEM |
... | Scanning electron microscopy |
| SIESTA |
... | Simulation Environment for Semiconductor Technology Analysis |
| TCAD |
... | Technology computer aided design |
| TEM |
... | Transmission electron microscopy |
| TEOS |
... | Tetra-ethoxy-silane, Tetra-ethyl-ortho-silicate:
|
| VLSI |
... | Very large scale integration |
| WSS |
... | Wafer-State-Server: File format for distributed quantities |
| XML |
... | Extensible markup language |