Publications Lado Filipovic

126 records

Books and Editorships

4.   Filipovic, L., Grasser, T. (Eds.). (2022).
Miniaturized Transistors, Volume II.
MDPI. https://doi.org/10.3390/books978-3-0365-4170-9 (reposiTUm)

3.   Filipovic, L., Grasser, T. (2022).
Special Issue on Miniaturized Transistors, Volume II.
Micromachines, Vol.13 (p. 603). https://doi.org/10.3390/mi13040603 (reposiTUm)

2.   Filipovic, L., Grasser, T. (2019).
Editorial for the Special Issue on Miniaturized Transistors.
Micromachines, Vol.10 (p. 300). https://doi.org/10.3390/mi10050300 (reposiTUm)

1.   Filipovic, L., Grasser, T. (Eds.). (2019).
Miniaturized Transistors.
MDPI. https://doi.org/10.3390/books978-3-03921-011-4 (reposiTUm)

Publications in Scientific Journals

34.   Reiter, T., Aguinsky, L. F., Souza Berti Rodrigues, F., Weinbub, J., Hössinger, A., Filipovic, L. (2024).
Modeling the Impact of Incomplete Conformality During Atomic Layer Processing.
Solid-State Electronics, 211, Article 108816. https://doi.org/10.1016/j.sse.2023.108816 (reposiTUm)

33.   Filipovic, L., Baumgartner, O., Klemenschits, X., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., Karner, M. (2023).
DTCO Flow for Air Spacer Generation and Its Impact on Power and Performance at N7.
Solid-State Electronics, 199, Article 108527. https://doi.org/10.1016/j.sse.2022.108527 (reposiTUm)

32.   Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L. (2023).
Effect of Mask Geometry Variation on Plasma Etching Profiles.
Micromachines, 14(3), Article 665. https://doi.org/10.3390/mi14030665 (reposiTUm)

31.   Aguinsky, L. F., Souza Berti Rodrigues, F., Reiter, T., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J. (2023).
Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio Structures.
Solid-State Electronics, 201, Article 108584. https://doi.org/10.1016/j.sse.2022.108584 (reposiTUm)

30.   Garcia-Barrientos, A., Nikolova, N., Filipovic, L., Gutierez-D., E. A., Serrano, V., Macias-Velasquez, S., Zarate-Galvez, S. (2023).
Numerical Simulations of Space Charge Waves Amplification Using Negative Differential Conductance in Strained Si/SiGe at 4.2 K.
Crystals, 13(9), Article 1398. https://doi.org/10.3390/cryst13091398 (reposiTUm)

29.   Zarate-Galvez, S., Garcia-Barrientos, A., Lastras-Martinez, L. F., Cardenas-Juarez, M., Macias-Velasquez, S., Filipovic, L., Arce-Casas, A. (2023).
Optimization of Doping Concentration to Obtain High Internal Quantum Efficiency and Wavelength Stability in an InGaN/GaN Blue Light-Emitting Diode.
ECS Journal of Solid State Science and Technology, 12(7), Article 076014. https://doi.org/10.1149/2162-8777/ace7c4 (reposiTUm)

28.   Faber, T., Filipovic, L., Koster, L. J. A. (2023).
The Role of Thermalization in the Cooling Dynamics of Hot Carrier Solar Cells.
Solar RRL, 7(13), 1–9. https://doi.org/10.1002/solr.202300140 (reposiTUm)

27.   Filipovic, L., Selberherr, S. (2022).
Application of Two-Dimensional Materials Towards CMOS-integrated Gas Sensors.
Nanomaterials, 12(20), Article 3651. https://doi.org/10.3390/nano12203651 (reposiTUm)

26.   Reiter, T., Klemenschits, X., Filipovic, L. (2022).
Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory.
Solid-State Electronics, 192(108261), 108261. https://doi.org/10.1016/j.sse.2022.108261 (reposiTUm)

25.   Knobloch, T., Uzlu, B., Illarionov, Y., Wang, Z., Otto, M., Filipovic, L., Waltl, M., Neumaier, D., Lemme, M. C., Grasser, T. (2022).
Improving Stability in Two-Dimensional Transistors With Amorphous Gate Oxides by Fermi-Level Tuning.
Nature Electronics, 5(6), 356–366. https://doi.org/10.1038/s41928-022-00768-0 (reposiTUm)

24.   Waltl, M., Knobloch, T., Tselios, K., Filipovic, L., Stampfer, B., Hernandez, Y., Waldhör, D., Illarionov, Y., Kaczer, B., Grasser, T. (2022).
Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology?
Advanced Materials, 34(48), 2201082. https://doi.org/10.1002/adma.202201082 (reposiTUm)

23.   Klemenschits, X., Selberherr, S., Filipovic, L. (2021).
Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures.
Computer Methods in Applied Mechanics and Engineering, 386(114196), 114196. https://doi.org/10.1016/j.cma.2021.114196 (reposiTUm)

22.   Filipovic, L., Selberherr, S. (2021).
Microstructure and Granularity Effects in Electromigration.
IEEE Journal of the Electron Devices Society, 9, 476–483. https://doi.org/10.1109/jeds.2020.3044112 (reposiTUm)

21.   Fatemeh, S., Moradinasab, M., Schwalke, U., Filipovic, L. (2021).
Superior Sensitivity and Optical Response of Blue Phosphorene and Its Doped Systems for Gas Sensing Applications.
ACS Omega, 6(29), 18770–18781. https://doi.org/10.1021/acsomega.1c01898 (reposiTUm)

20.   Filipovic, L. (2021).
Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters.
Microelectronics Reliability, 123(114219), 114219. https://doi.org/10.1016/j.microrel.2021.114219 (reposiTUm)

19.   Filipovic, L. (2021).
Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters.
Microelectronics Reliability, 123, 1–14. https://doi.org/10.1016/j.microrel.2021.114219 (reposiTUm)

18.   Filipovic, L. (2019).
A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration.
Microelectronics Reliability, 97, 38–52. https://doi.org/10.1016/j.microrel.2019.04.005 (reposiTUm)

17.   Lahlalia, A., Le Neel, O., Shankar, R., Selberherr, S., Filipovic, L. (2019).
Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices.
Sensors, 19(2), 374. https://doi.org/10.3390/s19020374 (reposiTUm)

16.   Filipovic, L., Selberherr, S. (2019).
Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors.
Materials, 12(15), 2410. https://doi.org/10.3390/ma12152410 (reposiTUm)

15.   Lahlalia, A., Le Neel, O., Shankar, R., Kam, S. Y., Filipovic, L. (2018).
Electro-Thermal Simulation, Characterization of a Microheater for SMO Gas Sensors.
Journal of Microelectromechanical Systems, 27(3), 529–537. https://doi.org/10.1109/jmems.2018.2822942 (reposiTUm)

14.   Lahlalia, A., Filipovic, L., Selberherr, S. (2018).
Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices.
IEEE Sensors Journal, 18(5), 1960–1970. https://doi.org/10.1109/jsen.2018.2790001 (reposiTUm)

13.   Klemenschits, X., Selberherr, S., Filipovic, L. (2018).
Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review.
Micromachines, 9(12), 631. https://doi.org/10.3390/mi9120631 (reposiTUm)

12.   Filipovic, L., Lahlalia, A. (2018).
Review—System-On-Chip SMO Gas Sensor Integration in Advanced CMOS Technology.
Journal of The Electrochemical Society, 165(16), 862–879. https://doi.org/10.1149/2.0731816jes (reposiTUm)

11.   Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S. (2017).
Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures Using One-Dimensional Radiosity.
Solid-State Electronics, 128, 141–147. https://doi.org/10.1016/j.sse.2016.10.029 (reposiTUm)

10.   Filipovic, L., Selberherr, S. (2016).
Stress Considerations for System-On-Chip Gas Sensor Integration in CMOS Technology.
IEEE Transactions on Device and Materials Reliability, 16(4), 483–495. https://doi.org/10.1109/tdmr.2016.2625461 (reposiTUm)

9.   Filipovic, L., Selberherr, S. (2016).
Stress in Three-Dimensionally Integrated Sensor Systems.
Microelectronics Reliability, 61, 3–10. https://doi.org/10.1016/j.microrel.2015.09.013 (reposiTUm)

8.   Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., de Orio, R. L., Selberherr, S. (2015).
Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias.
Microelectronic Engineering, 137, 141–145. https://doi.org/10.1016/j.mee.2014.11.014 (reposiTUm)

7.   Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., Selberherr, S. (2015).
Intrinsic Stress Analysis of Tungsten-Lined Open TSVs.
Microelectronics Reliability, 55(9–10), 1843–1848. https://doi.org/10.1016/j.microrel.2015.06.014 (reposiTUm)

6.   Filipovic, L., Selberherr, S. (2015).
Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors.
Sensors, 15(4), 7206–7227. https://doi.org/10.3390/s150407206 (reposiTUm)

5.   Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F. (2014).
Methods of Simulating Thin Film Deposition Using Spray Pyrolysis Techniques.
Microelectronic Engineering, 117, 57–66. https://doi.org/10.1016/j.mee.2013.12.025 (reposiTUm)

4.   Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W. (2014).
Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications.
IEEE Transactions on Semiconductor Manufacturing, 27(2), 269–277. https://doi.org/10.1109/tsm.2014.2298883 (reposiTUm)

3.   Filipovic, L., Selberherr, S. (2014).
The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias.
Microelectronics Reliability, 54(9–10), 1953–1958. https://doi.org/10.1016/j.microrel.2014.07.014 (reposiTUm)

2.   Filipovic, L., Selberherr, S. (2013).
A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework.
Microelectronic Engineering, 107, 23–32. https://doi.org/10.1016/j.mee.2013.02.083 (reposiTUm)

1.   Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Seinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W. (2013).
A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework.
Engineering Letters, 21(4), 224–240. (reposiTUm)

Contributions to Books

7.   Filipovic, L., Selberherr, S. (2021).
Electro-Thermo-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors.
In M. I. Khan (Ed.), Prime Archives in Material Science (pp. 1–38). Vide Leaf. (reposiTUm)

6.   Coppeta, R., Lahlalia, A., Kozic, D., Hammer, R., Riedler, J., Toschkoff, G., Singulani, A., Ali, Z., Sagmeister, M., Carniello, S., Selberherr, S., Filipovic, L. (2020).
Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates.
In W. D. van Driel, O. Pyper, C. Schumann (Eds.), Sensor Systems Simulations (pp. 17–72). Springer International Publishing. https://doi.org/10.1007/978-3-030-16577-2_2 (reposiTUm)

5.   Klemenschits, X., Selberherr, S., Filipovic, L. (2019).
Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review.
In L. Filipovic, T. Grasser (Eds.), Miniaturized Transistors (pp. 105–135). MDPI. https://doi.org/10.3390/mi9120631 (reposiTUm)

4.   Filipovic, L., Lahlalia, A. (2018). (Invited)<i />
System-On-Chip Sensor Integration in Advanced CMOS Technology.
In J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen, A. Yoshino (Eds.), ECS Transactions (pp. 151–162). ECS Transactions. https://doi.org/10.1149/08508.0151ecst (reposiTUm)

3.   Filipovic, L., Selberherr, S. (2015).
Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors.
In Y. Omura, J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen (Eds.), ECS Transactions (pp. 243–250). ECS Transactions. https://doi.org/10.1149/06605.0243ecst (reposiTUm)

2.   Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W. (2014).
Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors.
In G.-C. Yang, S.-L. Ao, L. Gelman (Eds.), Transactions on Engineering Technologies (pp. 295–310). Springer. https://doi.org/10.1007/978-94-017-8832-8_22 (reposiTUm)

1.   Filipovic, L., Selberherr, S. (2012).
Chapter 11. A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator.
In K. K. Sabelfeld, I. Dimov (Eds.), Monte Carlo Methods and Applications (pp. 97–104). De Gruyter. https://doi.org/10.1515/9783110293586.97 (reposiTUm)

Talks and Poster Presentations (with Proceedings-Entry)

70.   Reiter, T., Filipovic, L. (2023).
Fast 3D Flux Calculation Using Monte Carlo Ray Tracing on GPUs.
In Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT '2023)) (pp. 67–72), Funchal, Portugal. https://doi.org/10.13140/RG.2.2.13265.71524 (reposiTUm)

69.   Reiter, T., Toifl, A., Hössinger, A., Filipovic, L. (2023).
Modeling Oxide Regrowth During Selective Etching in Vertical 3D NAND Structures.
In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 85–88), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319506 (reposiTUm)

68.   Leroch, S., Stella, R., Hössinger, A., Filipovic, L. (2023).
Molecular Dynamics Study of Al Implantation in 4h-SiC.
In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 185–188), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319554 (reposiTUm)

67.   Filipovic, L., Bobinac, J., Piso, J., Reiter, T. (2023).
Physics-Informed Compact Model for SF6/O2 Plasma Etching.
In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 73–76), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319479 (reposiTUm)

66.   Filipovic, L., Reiter, T., Klemenschits, X., Leroch, S., Stella, R., Baumgartner, O., Hössinger, A. (2023).
Process Simulation in Micro- And Nano-Electronics.
In Book of abstracts of the International Workshop on Computational Nanotechnology 2023 (pp. 38–39), Barcelona, Spain. (reposiTUm)

65.   Filipovic, L., Baumgartner, O., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., Karner, M. (2022).
DTCO Flow for Air Spacer Generation and Its Impact on Power and Performance at N7.
In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 34–35), Granada, Spain. (reposiTUm)

64.   Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L. (2022).
Impact of Mask Tapering on SF6/O2 Plasma Etching.
In Microelectronic Devices and Technologies: Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT '2022) (pp. 90–94), Corfu, Greece. (reposiTUm)

63.   Aguinsky, L., Rodrigues, F., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J. (2022).
Modeling Non-Ideal Conformality During Atomic Layer Deposition in High Aspect Ratio Structures.
In Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) (pp. 40–41), Granada, Spain. (reposiTUm)

62.   Reiter, T., Klemenschits, X., Filipovic, L. (2022).
Modeling Plasma-Induced Damage During the Dry Etching of Silicon.
In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–5), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW56459.2022.10032764 (reposiTUm)

61.   Filipovic, L. (2022).
Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors.
In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–6), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW56459.2022.10032744 (reposiTUm)

60.   Gollner, L., Steiner, R., Filipovic, L. (2022).
Study of Phonon-Limited Electron Transport in Monolayer MoS2.
In Microelectronic Devices and Technologies Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT 2022) (pp. 74–78), Corfu, Greece. (reposiTUm)

59.   Klemenschits, X., Selberherr, S., Filipovic, L. (2021).
Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node.
In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States. https://doi.org/10.1109/sispad54002.2021.9592605 (reposiTUm)

58.   Filipovic, L., Klemenschits, X. (2021).
Fast Model for Deposition in Trenches Using Geometric Advection.
In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States. https://doi.org/10.1109/sispad54002.2021.9592595 (reposiTUm)

57.   Filipovic, L., Selberherr, S. (2021).
Gas Sensing With Two-Dimensional Materials Beyond Graphene.
In 2021 IEEE 32nd International Conference on Microelectronics (MIEL), Beograd. https://doi.org/10.1109/miel52794.2021.9569088 (reposiTUm)

56.   Reiter, T., Klemenschits, X., Filipovic, L. (2021).
Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory.
In 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS'2021), Caen, France. https://doi.org/10.1109/eurosoi-ulis53016.2021.9560693 (reposiTUm)

55.   Filipovic, L. (2021).
Modeling and Simulation of Atomic Layer Deposition.
In Proceedings of the EFDS Workshop on Simulation for ALD 2021 (p. 9), virtual. (reposiTUm)

54.   Filipovic, L. (2021).
Reliability and Stability of MEMS Microheaters for Gas Sensors.
In 2021 IEEE International Integrated Reliability Workshop (IIRW), South Lake Tahoe, CA, USA. https://doi.org/10.1109/iirw53245.2021.9635162 (reposiTUm)

53.   Filipovic, L. (2020).
Electromigration Model for Platinum Hotplates.
In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. https://doi.org/10.23919/sispad49475.2020.9241645 (reposiTUm)

52.   Klemenschits, X., Selberherr, S., Filipovic, L. (2020).
Geometric Advection Algorithm for Process Emulation.
In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. https://doi.org/10.23919/sispad49475.2020.9241678 (reposiTUm)

51.   Filipovic, L., Selberher, S. (2020).
Granularity Effects in Electromigration.
In 2020 IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica. https://doi.org/10.1109/laedc49063.2020.9072963 (reposiTUm)

50.   Filipovic, L., Selberherr, S. (2020).
Integration of Gas Sensors With CMOS Technology.
In 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), Toyama, Japan. https://doi.org/10.1109/edtm47692.2020.9117828 (reposiTUm)

49.   Selberherr, S., Filipovic, L. (2019).
CMOS Compatible Gas Sensors.
In Book of Abstracts of the International Conference on Materials Science and Engineering (p. 1), San Francisco, CA, USA. (reposiTUm)

48.   Filipovic, L., Selberherr, S. (2019).
CMOS-Compatible Gas Sensors.
In 2019 IEEE 31st International Conference on Microelectronics (MIEL), Beograd. https://doi.org/10.1109/miel.2019.8889585 (reposiTUm)

47.   Filipovic, L., Orio, R. (2019).
Electromigration in Nano-Interconnects.
In Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD) (p. 2), Chicago, IL, USA. (reposiTUm)

46.   Klemenschits, X., Selberherr, S., Filipovic, L. (2019).
Fast Volume Evaluation on Sparse Level Sets.
In Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN 2019) (pp. 113–114), Evanston, IL, United States. (reposiTUm)

45.   Filipovic, L. (2019).
Modeling and Simulation of Atomic Layer Deposition.
In 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy. https://doi.org/10.1109/sispad.2019.8870462 (reposiTUm)

44.   Klemenschits, X., Manstetten, P., Filipovic, L., Selberherr, S. (2019).
Process Simulation in the Browser: Porting ViennaTS Using WebAssembly.
In 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy. https://doi.org/10.1109/sispad.2019.8870374 (reposiTUm)

43.   Filipovic, L. (2018).
CMOS-Compatible Semiconductor-Based Gas Sensors.
In Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors, Montreal, QC, Canada. (reposiTUm)

42.   Lahlalia, A., Neel, O., Shankar, R., Selberherr, S., Filipovic, L. (2018).
Enhanced Sensing Performance of Integrated Gas Sensor Devices.
In EUROSENSORS 2018, Dresden, D. https://doi.org/10.3390/proceedings2131508 (reposiTUm)

41.   Filipovic, L., de Orio, R. (2018).
Modeling the Influence of Grains and Material Interfaces on Electromigration.
In 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, TX, United States. https://doi.org/10.1109/sispad.2018.8551746 (reposiTUm)

40.   Filipovic, L., Lahlalia, A., Selberherr, S. (2018).
System-On-Chip Sensor Integration in Advanced CMOS Technology.
In Proceedings of the 233rd ECS Meeting (ECS), Seattle, Washington, USA. (reposiTUm)

39.   Klemenschits, X., Selberherr, S., Filipovic, L. (2018).
Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries.
In Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (pp. 65–66), Bologna, Italy. (reposiTUm)

38.   Filipovic, L., de Orio, R., Zisser, W., Selberherr, S. (2017).
Modeling Electromigration in Nanoscaled Copper Interconnects.
In 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan. https://doi.org/10.23919/sispad.2017.8085289 (reposiTUm)

37.   Cervenka, J., Filipovic, L. (2017).
Numerical Aspects of the Deterministic Solution of the Wigner Equation.
In Book of Abstracts of the International Wigner Workshop (IW2) (pp. 42–43), Waikoloa, Hawaii, USA. (reposiTUm)

36.   Filipovic, L., Selberherr, S. (2016).
Effects of the Deposition Process Variation on the Performance of Open TSVs.
In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.177 (reposiTUm)

35.   Filipovic, L., Singulani, A., Roger, F., Carniello, S., Selberherr, S. (2016).
Impact of Across-Wafer Variation on the Electrical Performance of TSVs.
In 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), San Jose, USA. https://doi.org/10.1109/iitc-amc.2016.7507707 (reposiTUm)

34.   Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S. (2016).
Modeling Neutral Particle Flux in High Aspect Ratio Holes Using a One-Dimensional Radiosity Approach.
In Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (pp. 68–69), Bologna, Italy. (reposiTUm)

33.   Filipovic, L., Selberherr, S. (2016).
Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors.
In Proceedings of the BIT's 2nd Annual World Congress of Smart Materials 2016 (p. 517), Singapore. (reposiTUm)

32.   Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S. (2016).
Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes.
In 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS). https://doi.org/10.1109/ulis.2016.7440067 (reposiTUm)

31.   Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S. (2016).
Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures.
In 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nuremberg, Germany. https://doi.org/10.1109/sispad.2016.7605198 (reposiTUm)

30.   Roger, F., Singulani, A., Carniello, S., Filipovic, L., Selberherr, S. (2015).
Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation.
In 2015 International Workshop on CMOS Variability (VARI), Salvador, Brazil. https://doi.org/10.1109/vari.2015.7456561 (reposiTUm)

29.   Filipovic, L., Singulani, A., Roger, F., Carniello, S., Selberherr, S. (2015).
Intrinsic Stress Analysis of Tungsten-Lined Open TSVs.
In Abstracts of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (p. 71), Maastricht. (reposiTUm)

28.   Filipovic, L., Selberherr, S. (2015).
Kinetics of Droplet Motion During Spray Pyrolysis.
In Abstracts of the Energy-Materials-Nanotechnology Meeting on Droplets (EMN) (pp. 127–128), Phuket, Thailand. (reposiTUm)

27.   Filipovic, L., Selberherr, S. (2015).
Processing of Integrated Gas Sensor Devices.
In TENCON 2015 - 2015 IEEE Region 10 Conference, Macau, China. https://doi.org/10.1109/tencon.2015.7372781 (reposiTUm)

26.   Filipovic, L., Selberherr, S. (2015).
Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors.
In Proceedings of the 227th ECS Meeting (ECS) (p. 2), Honolulu, Austria. (reposiTUm)

25.   Filipovic, L., Selberherr, S. (2015).
Stress in Three-Dimensionally Integrated Sensor Systems.
In Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT) (p. 342), Singapore. (reposiTUm)

24.   Filipovic, L., Selberherr, S. (2014).
About Processes and Performance of Integrated Gas Sensor Components.
In Abstracts of the Energy-Materials-Nanotechnology Fall Meeting (EMN) (pp. 96–97), Orlando, USA. (reposiTUm)

23.   Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., Orio, R., Selberherr, S. (2014).
Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAs.
In Book of Abstracts (p. 2), Chemnitz, Germany. (reposiTUm)

22.   Filipovic, L., de Orio, R., Selberherr, S., Singulani, A., Roger, F., Minixhofer, R. (2014).
Effects of Sidewall Scallops on Open Tungsten TSVs.
In 2014 IEEE International Reliability Physics Symposium, Phoenix. https://doi.org/10.1109/irps.2014.6860633 (reposiTUm)

21.   Filipovic, L., de Orio, R., Selberherr, S. (2014).
Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs.
In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. https://doi.org/10.1109/ipfa.2014.6898137 (reposiTUm)

20.   Filipovic, L., Orio, R., Selberherr, S. (2014).
Process and Performance of Copper TSVs.
In Conference Proceedings of the Tenth Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits (pp. 1–2), Granada, Austria. (reposiTUm)

19.   Filipovic, L., de Orio, R., Selberherr, S. (2014).
Process and Reliability of SF<inf>6</inf>/O<inf>2</inf> Plasma Etched Copper TSVs.
In 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium. https://doi.org/10.1109/eurosime.2014.6813768 (reposiTUm)

18.   Filipovic, L., Selberherr, S. (2014).
Spray Pyrolysis Deposition for Gas Sensor Integration in the Backend of Standard CMOS Processes.
In 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), Peking, Austria. https://doi.org/10.1109/icsict.2014.7021507 (reposiTUm)

17.   Filipovic, L., Selberherr, S. (2014).
Stress Considerations for System-On-Chip Gas Sensor Integration in CMOS Technology.
In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 41), Kyoto, Japan. (reposiTUm)

16.   Filipovic, L., Selberherr, S. (2014).
The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias.
In Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) (p. 36), Maastricht. (reposiTUm)

15.   Filipovic, L., Rudolf, F., Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Singulani, A., Minixhofer, R., Selberherr, S. (2014).
Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias.
In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. https://doi.org/10.1109/sispad.2014.6931633 (reposiTUm)

14.   Singulani, A., Ceric, H., Filipovic, L., Langer, E. (2013).
Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon via Technology.
In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Poland. https://doi.org/10.1109/eurosime.2013.6529938 (reposiTUm)

13.   Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F. (2013).
Modeling Spray Pyrolysis Deposition.
In Proceedings of the World Congress on Engineering (WCE) Vol II (pp. 987–992), London, UK. (reposiTUm)

12.   Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W. (2013).
Modeling the Growth of Thin SnO2 Films Using Spray Pyrolysis Deposition.
In 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, UK. https://doi.org/10.1109/sispad.2013.6650611 (reposiTUm)

11.   Filipovic, L., Selberherr, S. (2012).
A Monte Carlo Simulator for Non-Contact Mode Atomic Force Microscopy.
In Large-Scale Scientific Computing: 8th International Conference, LSSC 2011 (pp. 447–454), Sozopol, Bulgaria. https://doi.org/10.1007/978-3-642-29843-1_50 (reposiTUm)

10.   Filipovic, L., Selberherr, S. (2012).
Electric Field Based Simulations of Local Oxidation Nanolithography Using Atomic Force Microscopy in a Level Set Environment.
In ECS Transactions (pp. 265–272), Ouro Preto. https://doi.org/10.1149/04901.0265ecst (reposiTUm)

9.   Filipovic, L., Selberherr, S. (2012).
Simulation of Silicon Nanopatterning Using Nc-Afm.
In Abstracts 15th International Conference on non-contact Atomic Force Microscopy (nc-AFM) (p. 108), Cesky Krumlov. (reposiTUm)

8.   Filipovic, L., Selberherr, S. (2012).
Simulations of Local Oxidation Nanolithography by AFM Based on the Generated Electric Field.
In 2012 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 189–192), Denver, Colorado, United States. (reposiTUm)

7.   Weinbub, J., Rupp, K., Filipovic, L., Makarov, A., Selberherr, S. (2012).
Towards a Free Open Source Process and Device Simulation Framework.
In 2012 15th International Workshop on Computational Electronics. https://doi.org/10.1109/iwce.2012.6242867 (reposiTUm)

6.   Filipovic, L., Selberherr, S. (2011).
A Level Set Simulator for Nanooxidation Using Non-Contact Atomic Force Microscopy.
In 2011 International Conference on Simulation of Semiconductor Processes and Devices, Osaka, Japan. https://doi.org/10.1109/sispad.2011.6035031 (reposiTUm)

5.   Filipovic, L., Nedjalkov, M., Selberherr, S. (2011).
A Monte Carlo Simulator for Non-Contact Atomic Force Microscopy.
In Abstracts Intl. Conf. on Large-Scale Scientific Computations (pp. 42–43), Sozopol, Bulgaria. (reposiTUm)

4.   Filipovic, L., Selberherr, S. (2011).
A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator.
In Abstracts IMACS Seminar on Monte Carlo Methods (MCM) (p. 30), Reading. (reposiTUm)

3.   Filipovic, L., Ceric, H., Cervenka, J., Selberherr, S. (2011).
A Simulator for Local Anodic Oxidation of Silicon Surfaces.
In 2011 24th Canadian Conference on Electrical and Computer Engineering(CCECE), Saskatoon, SK, Canada. https://doi.org/10.1109/ccece.2011.6030543 (reposiTUm)

2.   Filipovic, L., Ertl, O., Selberherr, S. (2011).
Parallelization Strategy for Hierarchical Run Length Encoded Data Structures.
In Proceedings of the IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011) (pp. 131–138), Innsbruck. (reposiTUm)

1.   Ertl, O., Filipovic, L., Selberherr, S. (2010).
Three-Dimensional Simulation of Focused Ion Beam Processing Using the Level Set Method.
In 2010 International Conference on Simulation of Semiconductor Processes and Devices, Bologna, Italy. https://doi.org/10.1109/sispad.2010.5604573 (reposiTUm)

Talks and Poster Presentations (without Proceedings-Entry)

3.   Filipovic, L. (2022, September 5).
ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework
Workshop WS1 - Monte Carlo Simulation: Beyond Moore’s LAW 2022, Granada, Spain. (reposiTUm)

2.   Filipovic, L., Kampl, M., Knobloch, T., Rzepa, G., Weinbub, J. (2018).
Ihr Smartphone - Ein Supercomputer Vor 20 Jahren. Ein Einblick in Die Mikro- Und Nanoelektronik (Mit Virtual Reality).
Lange Nacht der Forschung 2018, Wien, Austria. (reposiTUm)

1.   Ullmann, B., Grill, A., Manstetten, P., Jech, M., Kampl, M., Zisser, W., Filipovic, L., Thesberg, M., Rudolf, F., Windbacher, T., Cervenka, J., Katterbauer, M., Weinbub, J. (2016).
Ihr Smartphone - Ein Supercomputer Vor 20 Jahren. Ein Einblick in Die Mikro- Und Nanoelektronik.
Lange Nacht der Forschung 2016, Wien, Austria. (reposiTUm)

Habilitation Theses

1.   Filipovic, L. (2019).
Semiconductor Based Integrated Sensors
Technische Universität Wien. (reposiTUm)

Doctor's Theses (authored and supervised)

2.   Klemenschits, X. (2022).
Emulation and Simulation of Microelectronic Fabrication Processes
Technische Universität Wien. https://doi.org/10.34726/hss.2022.89324 (reposiTUm)

1.  L. Filipovic:
"Topography Simulation of Novel Processing Techniques";
Supervisor, Reviewer: S. Selberherr, D. Vasileska; Institut für Mikroelektronik, 2012; oral examination: 2012-12-17.

Diploma and Master Theses (authored and supervised)

5.   Skënderaj, E. (2023).
Automated FEM Model Generation for the Simulation of Microheaters
Technische Universität Wien. https://doi.org/10.34726/hss.2023.111425 (reposiTUm)

4.   Benzer, A. (2023).
Density Functional Theory (DFT) Iinvestigation of Novel Materials for Application in Sensing
Technische Universität Wien. https://doi.org/10.34726/hss.2023.103762 (reposiTUm)

3.   Gollner, L. (2023).
Development and Application of an Ensemble Monte Carlo Framework
Technische Universität Wien. https://doi.org/10.34726/hss.2023.95902 (reposiTUm)

2.   Bobinac, J. (2023).
Process Simulation and Model Development in ViennaPS
Technische Universität Wien. https://doi.org/10.34726/hss.2023.95903 (reposiTUm)

1.   Balla, C. (2023).
Tetrahedral Mesh Cleaving of Level Set Surfaces
Technische Universität Wien. https://doi.org/10.34726/hss.2023.106905 (reposiTUm)