Publications Peter Fleischmann
17 records
| 4. | R. Kosik, P. Fleischmann, B. Haindl, P. Pietra, S. Selberherr: "On the Interplay Between Meshing and Discretization in Three-Dimensional Diffusion Simulation"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 19, (2000), 1233 - 1240 doi:10.1109/43.892848. BibTeX |
| 3. | P. Fleischmann, W. Pyka, S. Selberherr: "Mesh Generation for Application in Technology CAD"; IEICE Transactions on Electronics, E82-C, (invited) (1999), 937 - 947. BibTeX |
| 2. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18, (1999), 1741 - 1749 doi:10.1109/43.811323. BibTeX |
| 1. | P. Fleischmann, S. Selberherr: "Fully Unstructured Delaunay Mesh Generation Using a Modified Advancing Front Approach for Applications in Technology CAD"; IEEE Journal of Technology Computer Aided Design, 1, (1997), 1 - 38 doi:10.1109/TCAD.1996.6449165. BibTeX |
| 11. | P. Fleischmann, S. Selberherr: "Enhanced Advancing Front Delaunay Meshing in TCAD"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan; 2002-09-04 - 2002-09-06; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2002), ISBN: 4-89114-027-5, 99 - 102 doi:10.1109/SISPAD.2002.1034526. BibTeX |
| 10. | J. Cervenka, P. Fleischmann, S. Selberherr, M. Knaipp, F. Unterleitner: "Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation"; Talk: European Solid-State Device Research Conference (ESSDERC), Nürnberg; 2001-09-11 - 2001-09-13; in "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2001), ISBN: 2-914601-01-8, 227 - 230. BibTeX |
| 9. | P. Fleischmann, R. Kosik, B. Haindl, S. Selberherr: "Simple Mesh Examples to Illustrate Specific Finite Element Mesh Requirements"; Talk: International Meshing Roundtable, South Lake Tahoe; 1999-10-10 - 1999-10-13; in "Proceedings 8th Intl. Meshing Roundtable", (1999), 241 - 246. BibTeX |
| 8. | P. Fleischmann, B. Haindl, R. Kosik, S. Selberherr: "Investigation of a Mesh Criterion for Three-Dimensional Finite Element Diffusion Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 71 - 74 doi:10.1109/SISPAD.1999.799262. BibTeX |
| 7. | B. Haindl, R. Kosik, P. Fleischmann, S. Selberherr: "Comparison of Finite Element and Finite Box Discretization for Three-Dimensional Diffusion Modeling Using AMIGOS"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 131 - 134 doi:10.1109/SISPAD.1999.799278. BibTeX |
| 6. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 199 - 202 doi:10.1109/SISPAD.1999.799295. BibTeX |
| 5. | P. Fleischmann, E. Leitner, S. Selberherr: "Optimized Geometry Preprocessing for Three-Dimensional Semiconductor Process Simulation"; Talk: International Conference on Applied Modelling and Simulation, Honolulu; 1998-08-12 - 1998-08-14; in "Proceedings IASTED Intl. Conf. on Applied Modelling and Simulation", (1998), ISBN: 0-88986-270-2, 317 - 321. BibTeX |
| 4. | P. Fleischmann, S. Selberherr: "Three-Dimensional Delaunay Mesh Generation Using a Modified Advancing Front Approach"; Talk: International Meshing Roundtable, Park City; 1997-10-13 - 1997-10-15; in "Proceedings 6th International Meshing Roundtable", (1997), 267 - 278. BibTeX |
| 3. | P. Fleischmann, R. Sabelka, A. Stach, R. Strasser, S. Selberherr: "Grid Generation for Three-Dimensional Process and Device Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan; (invited) 1996-09-02 - 1996-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4, 161 - 166 doi:10.1109/SISPAD.1996.865321. BibTeX |
| 2. | P. Fleischmann, S. Selberherr: "A New Approach to Fully Unstructured Three-Dimensional Delaunay Mesh Generation with Improved Element Quality"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan; 1996-09-02 - 1996-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4, 129 - 130 doi:10.1109/SISPAD.1996.865308. BibTeX |
| 1. | E. Leitner, W. Bohmayr, P. Fleischmann, E. Strasser, S. Selberherr: "3D TCAD at TU Vienna"; Talk: 3-Dimensional Process Simulation Workshop, Erlangen; (invited) 1995-09-05 in "Proceedings 3-Dimensional Process Simulation Workshop", (1995), ISBN: 3-211-82741-2, 136 - 161 doi:10.1007/978-3-7091-6905-6_7. BibTeX |
| 1. | P. Fleischmann: "Mesh Generation for Technology CAD in Three Dimensions"; Reviewer: S. Selberherr, D. Dietrich; Institut für Mikroelektronik, 2000, oral examination: 2000-02-24 doi:10.34726/hss.1999.03012084. BibTeX |
| 1. | P. Fleischmann: "Implementation of a Robust 3D Delaunay Grid Generator with Complexity O(n log n)"; Supervisor: S. Selberherr, F. Fasching; Institut für Mikroelektronik, 1994, . BibTeX |