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Publications Peter Fleischmann

17 records

Publications in Scientific Journals

4.  R. Kosik, P. Fleischmann, B. Haindl, P. Pietra, S. Selberherr:
"On the Interplay Between Meshing and Discretization in Three-Dimensional Diffusion Simulation";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 19 (2000), 11; 1233 - 1240. https://doi.org/10.1109/43.892848

3.  P. Fleischmann, W. Pyka, S. Selberherr:
"Mesh Generation for Application in Technology CAD";
IEICE Transactions on Electronics (invited), E82-C (1999), 6; 937 - 947.

2.  W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18 (1999), 12; 1741 - 1749. https://doi.org/10.1109/43.811323

1.  P. Fleischmann, S. Selberherr:
"Fully Unstructured Delaunay Mesh Generation Using a Modified Advancing Front Approach for Applications in Technology CAD";
IEEE Journal of Technology Computer Aided Design, 1 (1997), 8; 1 - 38. https://doi.org/10.1109/TCAD.1996.6449165

Talks and Poster Presentations (with Proceedings-Entry)

11.  P. Fleischmann, S. Selberherr:
"Enhanced Advancing Front Delaunay Meshing in TCAD";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan; 2002-09-04 - 2002-09-06; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2002), ISBN: 4-89114-027-5; 99 - 102. https://doi.org/10.1109/SISPAD.2002.1034526

10.  J. Cervenka, P. Fleischmann, S. Selberherr, M. Knaipp, F. Unterleitner:
"Optimization of Industrial High Voltage Structures by Three-Dimensional Diffusion Simulation";
Talk: European Solid-State Device Research Conference (ESSDERC), Nürnberg; 2001-09-11 - 2001-09-13; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2001), ISBN: 2-914601-01-8; 227 - 230.

9.  B. Haindl, R. Kosik, P. Fleischmann, S. Selberherr:
"Comparison of Finite Element and Finite Box Discretization for Three-Dimensional Diffusion Modeling Using AMIGOS";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0; 131 - 134. https://doi.org/10.1109/SISPAD.1999.799278

8.  P. Fleischmann, B. Haindl, R. Kosik, S. Selberherr:
"Investigation of a Mesh Criterion for Three-Dimensional Finite Element Diffusion Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0; 71 - 74. https://doi.org/10.1109/SISPAD.1999.799262

7.  W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0; 199 - 202. https://doi.org/10.1109/SISPAD.1999.799295

6.  P. Fleischmann, R. Kosik, B. Haindl, S. Selberherr:
"Simple Mesh Examples to Illustrate Specific Finite Element Mesh Requirements";
Talk: International Meshing Roundtable, South Lake Tahoe; 1999-10-10 - 1999-10-13; in: "Proceedings 8th Intl. Meshing Roundtable", (1999), 241 - 246.

5.  P. Fleischmann, E. Leitner, S. Selberherr:
"Optimized Geometry Preprocessing for Three-Dimensional Semiconductor Process Simulation";
Talk: International Conference on Applied Modelling and Simulation, Honolulu; 1998-08-12 - 1998-08-14; in: "Proceedings IASTED Intl. Conf. on Applied Modelling and Simulation", (1998), ISBN: 0-88986-270-2; 317 - 321.

4.  P. Fleischmann, S. Selberherr:
"Three-Dimensional Delaunay Mesh Generation Using a Modified Advancing Front Approach";
Talk: International Meshing Roundtable, Park City; 1997-10-13 - 1997-10-15; in: "Proceedings 6th International Meshing Roundtable", (1997), 267 - 278.

3.  P. Fleischmann, S. Selberherr:
"A New Approach to Fully Unstructured Three-Dimensional Delaunay Mesh Generation with Improved Element Quality";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan; 1996-09-02 - 1996-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4; 129 - 130. https://doi.org/10.1109/SISPAD.1996.865308

2.  P. Fleischmann, R. Sabelka, A. Stach, R. Strasser, S. Selberherr:
"Grid Generation for Three-Dimensional Process and Device Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan (invited); 1996-09-02 - 1996-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4; 161 - 166. https://doi.org/10.1109/SISPAD.1996.865321

1.  E. Leitner, W. Bohmayr, P. Fleischmann, E. Strasser, S. Selberherr:
"3D TCAD at TU Vienna";
Talk: 3-Dimensional Process Simulation Workshop, Erlangen (invited); 1995-09-05; in: "Proceedings 3-Dimensional Process Simulation Workshop", (1995), ISBN: 3-211-82741-2; 136 - 161. https://doi.org/10.1007/978-3-7091-6905-6_7

Doctor's Theses (authored and supervised)

1.  P. Fleischmann:
"Mesh Generation for Technology CAD in Three Dimensions";
Supervisor, Reviewer: S. Selberherr, D. Dietrich; Institut für Mikroelektronik, 2000; oral examination: 2000-02-24. https://doi.org/10.34726/hss.1999.03012084

Diploma and Master Theses (authored and supervised)

1.  P. Fleischmann:
"Implementation of a Robust 3D Delaunay Grid Generator with Complexity O(n log n)";
Supervisor: S. Selberherr, F. Fasching; Institut für Mikroelektronik, 1994.