Publications Bernhard Haindl
9 records
| 2. | R. Kosik, P. Fleischmann, B. Haindl, P. Pietra, S. Selberherr: "On the Interplay Between Meshing and Discretization in Three-Dimensional Diffusion Simulation"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 19, (2000), 1233 - 1240 doi:10.1109/43.892848. BibTeX |
| 1. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18, (1999), 1741 - 1749 doi:10.1109/43.811323. BibTeX |
| 5. | B. Haindl, J. Meser, S. Müller, H. Arthaber, T. Faseth, M. Zaisberger: "LDACS1 Conformance and Compatibility Assessment"; Talk: Digital Avionics Systems Conference, Colorado Springs, CO, USA; 2014-10-05 - 2014-10-09; in "33rd Digital Avionics Systems Conference proceedings", (2014), ISBN: 978-1-4799-5001-0, 3B3-1 - 3B3-11. BibTeX |
| 4. | P. Fleischmann, R. Kosik, B. Haindl, S. Selberherr: "Simple Mesh Examples to Illustrate Specific Finite Element Mesh Requirements"; Talk: International Meshing Roundtable, South Lake Tahoe; 1999-10-10 - 1999-10-13; in "Proceedings 8th Intl. Meshing Roundtable", (1999), 241 - 246. BibTeX |
| 3. | P. Fleischmann, B. Haindl, R. Kosik, S. Selberherr: "Investigation of a Mesh Criterion for Three-Dimensional Finite Element Diffusion Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 71 - 74 doi:10.1109/SISPAD.1999.799262. BibTeX |
| 2. | B. Haindl, R. Kosik, P. Fleischmann, S. Selberherr: "Comparison of Finite Element and Finite Box Discretization for Three-Dimensional Diffusion Modeling Using AMIGOS"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 131 - 134 doi:10.1109/SISPAD.1999.799278. BibTeX |
| 1. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 199 - 202 doi:10.1109/SISPAD.1999.799295. BibTeX |
| 1. | B. Haindl: "An Air Traffic Communication System based on Multi-Carrier and Spreading Techniques"; Reviewer: R. Eier, H. Weinrichter; Institut für Computertechnik, 2005, . BibTeX |
| 1. | H. Fink: "Implementation of a general Software Transceiver on a DSP"; Supervisor: B. Haindl; Institut für Computertechnik, 2002, . BibTeX |