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Publications Bernhard Haindl

9 records


Publications in Scientific Journals


2. R. Kosik, P. Fleischmann, B. Haindl, P. Pietra, S. Selberherr:
"On the Interplay Between Meshing and Discretization in Three-Dimensional Diffusion Simulation";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 19, (2000), 1233 - 1240 doi:10.1109/43.892848. BibTeX

1. W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18, (1999), 1741 - 1749 doi:10.1109/43.811323. BibTeX


Talks and Poster Presentations (with Proceedings-Entry)


5. B. Haindl, J. Meser, S. Müller, H. Arthaber, T. Faseth, M. Zaisberger:
"LDACS1 Conformance and Compatibility Assessment";
Talk: Digital Avionics Systems Conference, Colorado Springs, CO, USA; 2014-10-05 - 2014-10-09; in "33rd Digital Avionics Systems Conference proceedings", (2014), ISBN: 978-1-4799-5001-0, 3B3-1 - 3B3-11. BibTeX

4. P. Fleischmann, R. Kosik, B. Haindl, S. Selberherr:
"Simple Mesh Examples to Illustrate Specific Finite Element Mesh Requirements";
Talk: International Meshing Roundtable, South Lake Tahoe; 1999-10-10 - 1999-10-13; in "Proceedings 8th Intl. Meshing Roundtable", (1999), 241 - 246. BibTeX

3. P. Fleischmann, B. Haindl, R. Kosik, S. Selberherr:
"Investigation of a Mesh Criterion for Three-Dimensional Finite Element Diffusion Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 71 - 74 doi:10.1109/SISPAD.1999.799262. BibTeX

2. B. Haindl, R. Kosik, P. Fleischmann, S. Selberherr:
"Comparison of Finite Element and Finite Box Discretization for Three-Dimensional Diffusion Modeling Using AMIGOS";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 131 - 134 doi:10.1109/SISPAD.1999.799278. BibTeX

1. W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 199 - 202 doi:10.1109/SISPAD.1999.799295. BibTeX


Doctor's Theses (authored and supervised)


1. B. Haindl:
"An Air Traffic Communication System based on Multi-Carrier and Spreading Techniques";
Reviewer: R. Eier, H. Weinrichter; Institut für Computertechnik, 2005, . BibTeX


Diploma and Master Theses (authored and supervised)


1. H. Fink:
"Implementation of a general Software Transceiver on a DSP";
Supervisor: B. Haindl; Institut für Computertechnik, 2002, . BibTeX

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Institute for Microelectronics
Head: Univ. Prof. Dipl.-Ing. Dr. techn. Tibor Grasser
Deputy Head: O. Univ. Prof. Dipl.-Ing. Dr. techn. Dr.h.c. Siegfried Selberherr
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