Publications Christian Hollauer

25 records

Contributions to Books

2.   Ceric, H., Heinzl, R., Hollauer, C., Grasser, T., Selberherr, S. (2006).
Microstructure and Stress Aspects of Electromigration Modeling.
In Stress-Induced Phenomena in Metallization (pp. 262–268). American Institute of Physics. (reposiTUm)

1.   Hollauer, C., Ceric, H., Selberherr, S. (2005).
Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress.
In ECS Meeting Abstracts (pp. 734–734). ECS Transactions. https://doi.org/10.1149/ma2005-02/19/734 (reposiTUm)

Talks and Poster Presentations (with Proceedings-Entry)

15.   Hollauer, C., Ceric, H., van Barel, G., Witvrouw, A., Selberherr, S. (2007).
Investigation of Intrinsic Stress Effects in Cantilever Structures.
In Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (CD ROM) (p. 4), Bangkok, Thailand. (reposiTUm)

14.   Hollauer, C., Ceric, H., Selberherr, S. (2006).
Modeling of Intrinsic Stress Effects in Deposited Thin Films.
In Eurosensors 20th Anniversary Vol. 1 (pp. 324–325), Göteborg, Sweden. (reposiTUm)

13.   Ceric, H., Hollauer, C., Selberherr, S. (2006).
Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines.
In Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp. 359–363), Singapore. (reposiTUm)

12.   Ceric, H., Hollauer, C., Selberherr, S. (2006).
Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films.
In 2006 International Conference on Simulation of Semiconductor Processes and Devices, Monterey, California, United States. https://doi.org/10.1109/sispad.2006.282869 (reposiTUm)

11.   Holzer, S., Hollauer, C., Ceric, H., Karner, M., Grasser, T., Langer, E., Selberherr, S. (2006).
Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress.
In Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 154–157), Singapore. (reposiTUm)

10.   Ceric, H., Deshpande, V., Hollauer, C., Holzer, S., Grasser, T., Selberherr, S. (2005).
Comprehensive Analysis of Vacancy Dynamics Due to Electromigration.
In Proceedings of the 12th International Symposium on the Physical, Failure Analysis of Integrated Circuits (pp. 100–103), Singapore. (reposiTUm)

9.   Hollauer, C., Holzer, S., Ceric, H., Wagner, S., Grasser, T., Selberherr, S. (2005).
Investigation of Thermo-Mechanical Stress in Modern Interconnect Layouts.
In Proceedings of The Sixth International Congress on Thermal Stresses (pp. 637–640), Wien, Austria. (reposiTUm)

8.   Ceric, H., Hollauer, C., Selberherr, S. (2005).
Microstructure and Stress Aspects of Electromigration Modeling.
In 8th International Workshop on Stress-Induced Phenomena in Metallization (p. P 17), Dresden. (reposiTUm)

7.   Hollauer, C., Ceric, H., Selberherr, S. (2005).
Three-Dimensional Simulation of Stress Dependent Thermal Oxidation.
In 2005 International Conference On Simulation of Semiconductor Processes and Devices, Tokyo, Japan. https://doi.org/10.1109/sispad.2005.201503 (reposiTUm)

6.   Hollauer, C., Ceric, H., Selberherr, S. (2005).
Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress.
In 208th ECS Meeting (p. 1), Los Angeles. (reposiTUm)

5.   Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Entner, R., Langer, E., Grasser, T., Selberherr, S. (2005).
Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis.
In NSTI Nanotech Technical Proceedings (pp. 620–623), Anaheim, Austria. (reposiTUm)

4.   Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Langer, E., Grasser, T., Selberherr, S. (2005).
Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress.
In VLSI Circuits and Systems II (pp. 380–387), Sevilla, Spain. https://doi.org/10.1117/12.608414 (reposiTUm)

3.  W. Wessner, Ch. Hollauer, A. Hössinger, S. Selberherr:
"Anisotropic Laplace Refinement for Three-Dimensional Oxidation Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (2004), ISBN: 3211224688; 165 - 168. https://doi.org/10.1007/978-3-7091-0624-2_39

2.  Ch. Hollauer, H. Ceric, S. Selberherr:
"Simulation of Thermal Oxidation: A Three-Dimensional Finite Element Approach";
Talk: European Solid-State Device Research Conference (ESSDERC), Estoril; 2003-09-16 - 2003-09-18; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2003), ISBN: 0-7803-7999-3; 383 - 386.

1.  Ch. Hollauer, H. Ceric, S. Selberherr:
"Three-Dimensional Modeling of Thermal Oxidation of Silicon by Means of the Finite Element Method";
Talk: Industrial Simulation Conference (ISC), Valencia; 2003-06-09 - 2003-06-11; in: "Industrial Simulation Conference 2003", (2003), ISBN: 90-77381-03-1; 154 - 158.

Talks and Poster Presentations (without Proceedings-Entry)

2.   Wessner, W., Ceric, H., Hollauer, C., Langer, E., Selberherr, S. (2005).
Electromigration Reliability TCAD Solutions.
SEMICON Europa2005, München, Austria. (reposiTUm)

1.   Holzer, S., Hollauer, C., Ceric, H., Wagner, S., Langer, E., Grasser, T., Selberherr, S. (2005).
Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress.
SPIE VLSI Circuits and Systems, Sevilla, Spain, Austria. (reposiTUm)

Doctor's Theses (authored and supervised)

2.   Hollauer, C. (2007).
Modeling of Thermal Oxidation and Stress Effects
Technische Universität Wien. https://resolver.obvsg.at/urn:nbn:at:at-ubtuw:1-17195 (reposiTUm)

1.  Ch. Hollauer:
"Modelling of Thermal Oxidation and Stress Effects";
Supervisor, Reviewer: S. Selberherr, M. Vellekoop; Institut für Mikroelektronik, 2007; oral examination: 2007-04-18.

Diploma and Master Theses (authored and supervised)

2.  Ch. Hollauer:
"Implementierung einer HDF5-Datenschnittstelle für den Wafer State Server";
Supervisor: E. Langer, T. Binder; Institut für Mikroelektronik, 2002.

1.   Hollauer, C. (2002).
Implementierung Einer HDF5-Datenschnittstelle Für Den Wafer-State-Server
Technische Universität Wien. (reposiTUm)

Scientific Reports

2.   Entner, R., Heinzl, R., Hollauer, C., Sheikholeslami, A., Wittmann, R., Selberherr, S. (2005).
VISTA Status Report June 2005.
(reposiTUm)

1.   Hollauer, C., Sheikholeslami, A., Palankovski, V., Wagner, S., Wittmann, R., Selberherr, S. (2003).
VISTA Status Report June 2003.
(reposiTUm)