Publications Christian Hollauer
23 records
| 1. | S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, E. Langer, T. Grasser, S. Selberherr: "Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress"; Proceedings of SPIE, 5837, (2005), 380 - 387 doi:10.1117/12.608414. BibTeX |
| 2. | H. Ceric, R. Heinzl, Ch. Hollauer, T. Grasser, S. Selberherr: "Microstructure and Stress Aspects of Electromigration Modeling"; in "Stress-Induced Phenomena in Metallization", American Institute of Physics, Melville, 2006, ISBN: 0-7354-03104, 262 - 268. BibTeX |
| 1. | Ch. Hollauer, H. Ceric, S. Selberherr: "Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress"; in "Physics and Chemistry of SiO2 and the Si-SiO2 Interface-5, Vol. 1 No. 1", issued by H.Z. Massoud, J.H. Stathis, T. Hattori, D. Misra, I. Baumvol; ECS Transactions, Pennington, 2005, ISBN: 1-56677-430-6, 103 - 113 doi:10.1149/ma2005-02/19/734. BibTeX |
| 14. | Ch. Hollauer, H. Ceric, G. van Barel, A. Witvrouw, S. Selberherr: "Investigation of Intrinsic Stress Effects in Cantilever Structures"; Talk: IEEE Nano/Micro Engineered and Molecular Systems, Bangkok, Thailand; 2007-01-16 - 2007-01-19; in "Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems (CD ROM)", (2007), ISBN: 1-4244-0610-2, 4 page(s) . BibTeX |
| 13. | Ch. Hollauer, H. Ceric, S. Selberherr: "Modeling of Intrinsic Stress Effects in Deposited Thin Films"; Talk: EUROSENSORS XX, Göteborg; 2006-09-17 - 2006-09-20; in "Eurosensors 20th Anniversary Vol. 1", (2006), ISBN: 91-631-9280-2, 324 - 325. BibTeX |
| 12. | H. Ceric, Ch. Hollauer, S. Selberherr: "Three-Dimensional Simulation of Intrinsic Stress Build-Up in Thin Films"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Monterey, CA, USA; 2006-09-06 - 2006-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2006), ISBN: 1-4244-0404-5, 192 - 195 doi:10.1109/SISPAD.2006.282869. BibTeX |
| 11. | H. Ceric, Ch. Hollauer, S. Selberherr: "Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines"; Talk: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore; 2006-07-03 - 2006-07-07; in "Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits", (2006), ISBN: 1-4244-0206-9, 359 - 363. BibTeX |
| 10. | S. Holzer, Ch. Hollauer, H. Ceric, M. Karner, T. Grasser, E. Langer, S. Selberherr: "Three-Dimensional Transient Interconnect Analysis With Regard to Mechanical Stress"; Poster: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore; 2006-07-03 - 2006-07-07; in "Proceedings 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)", (2006), ISBN: 1-4244-0206-9, 154 - 157. BibTeX |
| 9. | Ch. Hollauer, H. Ceric, S. Selberherr: "Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress"; Talk: Meeting of the Electrochemical Society, Physics and Chemistry of SiO2 and the Si-SiO2 Interface, Los Angeles; 2005-10-16 - 2005-10-21; in "208th ECS Meeting", (2005), ISSN: 1091-8213, 1 page(s) . BibTeX |
| 8. | H. Ceric, Ch. Hollauer, S. Selberherr: "Microstructure and Stress Aspects of Electromigration Modeling"; Poster: International Workshop on Stress-Induced Phenomena in Metallization, Dresden; 2005-09-12 - 2005-09-14; in "8th International Workshop on Stress-Induced Phenomena in Metallization", (2005), P 17. BibTeX |
| 7. | Ch. Hollauer, H. Ceric, S. Selberherr: "Three-Dimensional Simulation of Stress Dependent Thermal Oxidation"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan; 2005-09-01 - 2005-09-03; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2005), ISBN: 4-9902762-0-5, 183 - 186 doi:10.1109/SISPAD.2005.201503. BibTeX |
| 6. | H. Ceric, V. Deshpande, Ch. Hollauer, S. Holzer, T. Grasser, S. Selberherr: "Comprehensive Analysis of Vacancy Dynamics Due to Electromigration"; Talk: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore; 2005-06-27 - 2005-07-01; in "Proceedings of the 12th International Symposium on the Physical & Failure Analysis of Integrated Circuits", (2005), ISBN: 0-7803-9301-5, 100 - 103. BibTeX |
| 5. | Ch. Hollauer, S. Holzer, H. Ceric, S. Wagner, T. Grasser, S. Selberherr: "Investigation of Thermo-Mechanical Stress in Modern Interconnect Layouts"; Talk: International Congress on Thermal Stresses (TS), Wien; 2005-05-26 - 2005-05-29; in "Proceedings of The Sixth International Congress on Thermal Stresses", (2005), Vol. 2, ISBN: 3-901167-12-9, 637 - 640. BibTeX |
| 4. | S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, R. Entner, E. Langer, T. Grasser, S. Selberherr: "Three-Dimensional Transient Electro-Thermal Interconnect Simulation for Stress and Electromigration Analysis"; Poster: The Nanotechnology Conference and Trade Show, Anaheim; 2005-05-08 - 2005-05-12; in "NSTI Nanotech Technical Proceedings", (2005), Vol. 3 (CDROM ISBN: 0-9767985-4-9), ISBN: 0-9767985-2-2, 620 - 623. BibTeX |
| 3. | W. Wessner, Ch. Hollauer, A. Hössinger, S. Selberherr: "Anisotropic Laplace Refinement for Three-Dimensional Oxidation Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2004), ISBN: 3211224688, 165 - 168 doi:10.1007/978-3-7091-0624-2_39. BibTeX |
| 2. | Ch. Hollauer, H. Ceric, S. Selberherr: "Simulation of Thermal Oxidation: A Three-Dimensional Finite Element Approach"; Talk: European Solid-State Device Research Conference (ESSDERC), Estoril; 2003-09-16 - 2003-09-18; in "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2003), ISBN: 0-7803-7999-3, 383 - 386. BibTeX |
| 1. | Ch. Hollauer, H. Ceric, S. Selberherr: "Three-Dimensional Modeling of Thermal Oxidation of Silicon by Means of the Finite Element Method"; Talk: Industrial Simulation Conference (ISC), Valencia; 2003-06-09 - 2003-06-11; in "Industrial Simulation Conference 2003", (2003), ISBN: 90-77381-03-1, 154 - 158. BibTeX |
| 2. | S. Holzer, Ch. Hollauer, H. Ceric, S. Wagner, E. Langer, T. Grasser, S. Selberherr: "Transient Electro-Thermal Investigations of Interconnect Structures Exposed to Mechanical Stress"; Talk: SPIE VLSI Circuits and Systems, Sevilla, Spain; 2005-05-09 - 2005-05-11; . BibTeX |
| 1. | W. Wessner, H. Ceric, Ch. Hollauer, E. Langer, S. Selberherr: "Electromigration Reliability TCAD Solutions"; Talk: SEMICON Europa2005, München; (invited) 2005-04-12 - 2005-04-14; . BibTeX |
| 1. | Ch. Hollauer: "Modelling of Thermal Oxidation and Stress Effects"; Reviewer: S. Selberherr, M. Vellekoop; Institut für Mikroelektronik, 2007, oral examination: 2007-04-18. BibTeX |
| 1. | Ch. Hollauer: "Implementierung einer HDF5-Datenschnittstelle für den Wafer State Server"; Supervisor: E. Langer, T. Binder; Institut für Mikroelektronik, 2002, . BibTeX |
| 2. | R. Entner, R. Heinzl, Ch. Hollauer, A. Sheikholeslami, R. Wittmann, S. Selberherr: "VISTA Status Report June 2005"; (2005), 29 page(s) . BibTeX |
| 1. | Ch. Hollauer, A. Sheikholeslami, V. Palankovski, S. Wagner, R. Wittmann, S. Selberherr: "VISTA Status Report June 2003"; (2003), 36 page(s) . BibTeX |