Staff Person Publications

Publications Xaver Klemenschits

21 records

Publications in Scientific Journals

7.		Filipovic, L., Baumgartner, O., Klemenschits, X., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., Karner, M. (2023). DTCO Flow for Air Spacer Generation and Its Impact on Power and Performance at N7. Solid-State Electronics, 199, Article 108527. https://doi.org/10.1016/j.sse.2022.108527 (reposiTUm)

6.		Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L. (2023). Effect of Mask Geometry Variation on Plasma Etching Profiles. Micromachines, 14(3), Article 665. https://doi.org/10.3390/mi14030665 (reposiTUm)

5.		Aguinsky, L. F., Souza Berti Rodrigues, F., Reiter, T., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J. (2023). Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio Structures. Solid-State Electronics, 201, Article 108584. https://doi.org/10.1016/j.sse.2022.108584 (reposiTUm)

4.		Reiter, T., Klemenschits, X., Filipovic, L. (2022). Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory. Solid-State Electronics, 192(108261), 108261. https://doi.org/10.1016/j.sse.2022.108261 (reposiTUm)

3.		Klemenschits, X., Selberherr, S., Filipovic, L. (2021). Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures. Computer Methods in Applied Mechanics and Engineering, 386(114196), 114196. https://doi.org/10.1016/j.cma.2021.114196 (reposiTUm)

2.		Toifl, A., Quell, M., Klemenschits, X., Manstetten, P., Hössinger, A., Selberherr, S., Weinbub, J. (2020). The Level-Set Method for Multi-Material Wet Etching and Non-Planar Selective Epitaxy. IEEE Access, 8, 115406–115422. https://doi.org/10.1109/access.2020.3004136 (reposiTUm)

1.		Klemenschits, X., Selberherr, S., Filipovic, L. (2018). Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review. Micromachines, 9(12), 631. https://doi.org/10.3390/mi9120631 (reposiTUm)

Contributions to Books

1.		Klemenschits, X., Selberherr, S., Filipovic, L. (2019). Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review. In L. Filipovic, T. Grasser (Eds.), Miniaturized Transistors (pp. 105–135). MDPI. https://doi.org/10.3390/mi9120631 (reposiTUm)

Talks and Poster Presentations (with Proceedings-Entry)

11.		Filipovic, L., Reiter, T., Klemenschits, X., Leroch, S., Stella, R., Baumgartner, O., Hössinger, A. (2023). Process Simulation in Micro- And Nano-Electronics. In Book of abstracts of the International Workshop on Computational Nanotechnology 2023 (pp. 38–39), Barcelona, Spain. (reposiTUm)

10.		Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L. (2022). Impact of Mask Tapering on SF6/O2 Plasma Etching. In Microelectronic Devices and Technologies: Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT '2022) (pp. 90–94), Corfu, Greece. (reposiTUm)

9.		Aguinsky, L., Rodrigues, F., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J. (2022). Modeling Non-Ideal Conformality During Atomic Layer Deposition in High Aspect Ratio Structures. In Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) (pp. 40–41), Granada, Spain. (reposiTUm)

8.		Reiter, T., Klemenschits, X., Filipovic, L. (2022). Modeling Plasma-Induced Damage During the Dry Etching of Silicon. In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–5), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW56459.2022.10032764 (reposiTUm)

7.		Klemenschits, X., Selberherr, S., Filipovic, L. (2021). Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node. In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States. https://doi.org/10.1109/sispad54002.2021.9592605 (reposiTUm)

6.		Filipovic, L., Klemenschits, X. (2021). Fast Model for Deposition in Trenches Using Geometric Advection. In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States. https://doi.org/10.1109/sispad54002.2021.9592595 (reposiTUm)

5.		Reiter, T., Klemenschits, X., Filipovic, L. (2021). Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory. In 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS'2021), Caen, France. https://doi.org/10.1109/eurosoi-ulis53016.2021.9560693 (reposiTUm)

4.		Klemenschits, X., Selberherr, S., Filipovic, L. (2020). Geometric Advection Algorithm for Process Emulation. In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. https://doi.org/10.23919/sispad49475.2020.9241678 (reposiTUm)

3.		Klemenschits, X., Selberherr, S., Filipovic, L. (2019). Fast Volume Evaluation on Sparse Level Sets. In Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN 2019) (pp. 113–114), Evanston, IL, United States. (reposiTUm)

2.		Klemenschits, X., Manstetten, P., Filipovic, L., Selberherr, S. (2019). Process Simulation in the Browser: Porting ViennaTS Using WebAssembly. In 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy. https://doi.org/10.1109/sispad.2019.8870374 (reposiTUm)

1.		Klemenschits, X., Selberherr, S., Filipovic, L. (2018). Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries. In Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (pp. 65–66), Bologna, Italy. (reposiTUm)

Doctor's Theses (authored and supervised)

1.		Klemenschits, X. (2022). Emulation and Simulation of Microelectronic Fabrication Processes Technische Universität Wien. https://doi.org/10.34726/hss.2022.89324 (reposiTUm)

Diploma and Master Theses (authored and supervised)

1.		Balla, C. (2023). Tetrahedral Mesh Cleaving of Level Set Surfaces Technische Universität Wien. https://doi.org/10.34726/hss.2023.106905 (reposiTUm)