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Publications Santo Papaleo

8 records

Publications in Scientific Journals

1.   Papaleo, S., Zisser, W. H., Singulani, A. P., Ceric, H., Selberherr, S. (2016).
Stress Evolution During Nanoindentation in Open TSVs.
IEEE Transactions on Device and Materials Reliability, 16(4), 470–474. https://doi.org/10.1109/tdmr.2016.2622727 (reposiTUm)

Talks and Poster Presentations (with Proceedings-Entry)

6.   Papaleo, S., Ceric, H. (2016).
A Finite Element Method Study of Delamination at the Interface of the TSV Interconnects.
In 2016 IEEE International Reliability Physics Symposium (IRPS), Phoenix. https://doi.org/10.1109/irps.2016.7574626 (reposiTUm)

5.   Papaleo, S., Rovitto, M., Ceric, H. (2016).
Mechanical Effects of the Volmer-Weber Growth in the TSV Sidewall.
In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA. https://doi.org/10.1109/ectc.2016.19 (reposiTUm)

4.   Papaleo, S., Zisser, W., Ceric, H. (2015).
Effects of the Initial Stress at the Bottom of Open TSVs.
In Proceedings of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore. (reposiTUm)

3.   Papaleo, S., Zisser, W., Ceric, H. (2015).
Factors That Influence Delamination at the Bottom of Open TSVs.
In 2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Washington, DC, United States. https://doi.org/10.1109/sispad.2015.7292350 (reposiTUm)

2.   Papaleo, S., Zisser, W., Singulani, A., Ceric, H., Selberherr, S. (2014).
Stress Analysis in Open TSVs After Nanoindentation.
In Abstracts (pp. 39–40), Thun, Switzerland. (reposiTUm)

1.   Papaleo, S., Zisser, W., Singulani, A., Ceric, H., Selberherr, S. (2014).
Stress Evolution During the Nanoindentation in Open TSVs.
In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 44), Kyoto, Japan. (reposiTUm)

Doctor's Theses (authored and supervised)