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Publications Francio Rodrigues

8 records


Publications in Scientific Journals


4. L.F. Aguinsky, F. Rodrigues, G. Wachter, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Phenomenological Modeling of Low-Bias Sulfur Hexafluoride Plasma Etching of Silicon";
Solid-State Electronics, 191, (invited) (2022), 108262-1 - 108262-8 doi:10.1016/j.sse.2022.108262. BibTeX

3. C. Lenz, A. Toifl, M. Quell, F. Rodrigues, A. Hössinger, J. Weinbub:
"Curvature Based Feature Detection for Hierarchical Grid Refinement in TCAD Topography Simulations";
Solid-State Electronics, 191, (invited) (2022), 108258-1 - 108258-8 doi:10.1016/j.sse.2022.108258. BibTeX

2. L.F. Aguinsky, G. Wachter, P. Manstetten, F. Rodrigues, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Modeling and Analysis of Sulfur Hexafluoride Plasma Etching for Silicon Microcavity Resonators";
Journal of Micromechanics and Microengineering, 31, (2021), 125003-1 - 125003-9 doi:10.1088/1361-6439/ac2bad. BibTeX

1. A. Toifl, F. Rodrigues, L.F. Aguinsky, A. Hössinger, J. Weinbub:
"Continuum Level-Set Model for Anisotropic Wet Etching of Patterned Sapphire Substrates";
Semiconductor Science and Technology, 36, (2021), 045016-1 - 045016-12 doi:10.1088/1361-6641/abe49b. BibTeX


Contributions to Books


1. L.F. Aguinsky, G. Wachter, F. Rodrigues, A. Scharinger, A. Toifl, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si";
in "Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", B. Cretu (ed); IEEE, 2021, 1 - 4 doi:10.1109/EuroSOI-ULIS53016.2021.9560685. BibTeX


Talks and Poster Presentations (with Proceedings-Entry)


3. F. Rodrigues, L.F. Aguinsky, A. Toifl, A. Scharinger, A. Hössinger, J. Weinbub:
"Surface Reaction and Topography Modeling of Fluorocarbon Plasma Etching";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 - 2021-09-29; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2021), . BibTeX

2. L.F. Aguinsky, G. Wachter, A. Scharinger, F. Rodrigues, A. Toifl, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Feature-Scale Modeling of Isotropic SF6 Plasma Etching of Si";
Poster: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 - 2021-09-03; in "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2021), 54 - 55. BibTeX

1. F. Rodrigues, L.F. Aguinsky, A. Toifl, A. Hössinger, J. Weinbub:
"Feature Scale Modeling of Fluorocarbon Plasma Etching for Via Structures including Faceting Phenomena";
Talk: International Workshop on Computational Nanotechnology (IWCN), Daejeon, Korea (Virtual); 2021-05-24 - 2021-06-06; in "Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN)", (2021), ISBN: 978-89-89453-30-7, 101 - 102. BibTeX

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Institute for Microelectronics
Head: Univ. Prof. Dipl.-Ing. Dr. techn. Tibor Grasser
Deputy Head: O. Univ. Prof. Dipl.-Ing. Dr. techn. Dr.h.c. Siegfried Selberherr
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