Publications Rainer Sabelka
23 records
| 3. | C. Harlander, R. Sabelka, S. Selberherr: "Efficient Inductance Calculation in Interconnect Structures by Applying the Monte Carlo Method"; Microelectronics Journal, 34, (2003), 815 - 821 doi:10.1016/S0026-2692(03)00147-2. BibTeX |
| 2. | R. Sabelka, S. Selberherr: "A Finite Element Simulator for Three-Dimensional Analysis of Interconnect Structures"; Microelectronics Journal, 32, (2001), 163 - 171 doi:10.1016/S0026-2692(00)00113-0. BibTeX |
| 1. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "High-Precision Interconnect Analysis"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17, (1998), 1148 - 1159 doi:10.1109/43.736187. BibTeX |
| 1. | R. Sabelka, C. Harlander, S. Selberherr: "Interconnects and Propagation of High Frequency Signals"; in "Predictive Simulation of Semiconductor Processing, Springer Series in Materials Science", 72, J. Dabrowski, E. Weber (ed); Springer Berlin Heidelberg, 2004, ISBN: 3-540-20481-4, 357 - 385 doi:10.1007/978-3-662-09432-7. BibTeX |
| 16. | A. Nentchev, R. Sabelka, W. Wessner, S. Selberherr: "On Chip Interconnect Simulation of Parasitic Capacitances in Periodic Structures"; Talk: European Simulation and Modeling Conference (ESMC), Porto; 2005-10-24 - 2005-10-26; in "The 2005 European Simulation and Modelling Conference Proceedings", (2005), 420 - 424. BibTeX |
| 15. | A. Nentchev, R. Sabelka, S. Selberherr: "Simplification of Spacial Structures by Simulation with Periodic Boundary Conditions"; Talk: VLSI Multilevel Interconnection Conference (VMIC), Fremont; 2005-10-03 - 2005-10-06; in "2005 Proceedings Twenty Second International VLSI Multilevel Interconnection Conference", (2005), 547 - 552. BibTeX |
| 14. | H. Ceric, R. Sabelka, S. Holzer, W. Wessner, S. Wagner, T. Grasser, S. Selberherr: "The Evolution of the Resistance and Current Density During Electromigration"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2004), ISBN: 3211224688, 331 - 334 doi:10.1007/978-3-7091-0624-2_78. BibTeX |
| 13. | C. Harlander, R. Sabelka, S. Selberherr: "A Comparative Study of Two Numerical Techniques for Inductance Calculation in Interconnect Structures"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6, 254 - 257 doi:10.1007/978-3-7091-6244-6_56. BibTeX |
| 12. | C. Harlander, R. Sabelka, S. Selberherr: "Three-Dimensional Electro-Thermal Simulation of Interconnect Structures with Temperature-Dependent Permittivity"; Talk: International Intersociety, Electronic Packaging Technical Conference (InterPACK), Kauai; 2001-07-08 - 2001-07-13; in "The Pacific RIM/International Intersociety, Electronic Packaging Technical/Business Conference & Exhibition", (2001), 1 - 2. BibTeX |
| 11. | R. Sabelka, C. Harlander, S. Selberherr: "The State of the Art in Interconnect Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Seattle, WA, USA; (invited) 2000-09-06 - 2000-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2000), ISBN: 0-7803-6279-9, 6 - 11 doi:10.1109/SISPAD.2000.871194. BibTeX |
| 10. | R. Sabelka, C. Harlander, S. Selberherr: "Propagation of RF Signals in Microelectronic Structures"; Talk: International Workshop on Challenges in Predictive Process Simulation (ChiPPS), Wandlitz; (invited) 2000-05-14 - 2000-05-18; in "Abstracts Challenges in Predictive Process Simulation Meeting", (2000), 50 - 51. BibTeX |
| 9. | C. Harlander, R. Sabelka, S. Selberherr: "Inductance Calculation in Interconnect Structures"; Talk: International Conference on Modeling and Simulation of Microsystems (MSM), San Diego; 2000-03-26 - 2000-03-29; in "Proceedings Intl. Conf. on Modeling and Simulation of Microsystems", (2000), ISBN: 0-9666135-7-0, 416 - 419. BibTeX |
| 8. | C. Harlander, R. Sabelka, R. Minixhofer, S. Selberherr: "Three-Dimensional Transient Electro-Thermal Simulation"; Talk: Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Rome; 1999-10-03 - 1999-10-06; in "Proceedings THERMINIC Workshop", (1999), 169 - 172. BibTeX |
| 7. | R. Martins, R. Sabelka, W. Pyka, S. Selberherr: "Rigorous Capacitance Simulation of DRAM Cells"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4, 69 - 72 doi:10.1007/978-3-7091-6827-1_20. BibTeX |
| 6. | R. Sabelka, R. Martins, S. Selberherr: "Accurate Layout-Based Interconnect Analysis"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4, 336 - 339 doi:10.1007/978-3-7091-6827-1_84. BibTeX |
| 5. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "Modeling Integrated Circuit Interconnections"; Talk: International Conference on Microelectronics and Packaging, Curitiba; 1998-08-10 - 1998-08-14; in "Proceedings XIII SBMicro, Intl. Conf. on Microelectronics and Packaging", (1998), 144 - 151. BibTeX |
| 4. | R. Sabelka, S. Selberherr: "SAP - A Program Package for Three-Dimensional Interconnect Simulation"; Poster: IEEE International Interconnect Technology Conference (IITC), San Francisco; 1998-06-01 - 1998-06-03; in "Proceedings Intl. Interconnect Technology Conf.", (1998), ISBN: 0-7803-4286-0, 250 - 252. BibTeX |
| 3. | R. Sabelka, K. Koyama, S. Selberherr: "STAP - A Finite Element Simulator for Three-Dimensional Thermal Analysis of Interconnect Structures"; Talk: European Simulation Symposium (ESS), Passau; 1997-10-19 - 1997-10-22; in "Proceedings European Simulation Symposium", (1997), ISBN: 1-56555-125-7, 621 - 625. BibTeX |
| 2. | A. Stach, R. Sabelka, S. Selberherr: "Three-Dimensional Layout-Based Thermal and Capacitive Simulation of Interconnect Structures"; Talk: International Conference on Modelling, Identification and Control, Innsbruck; 1997-02-17 - 1997-02-19; in "Proceedings IASTED Intl. Conf. on Modelling, Identification and Control", (1997), ISBN: 0-88986-217-6, 16 - 19. BibTeX |
| 1. | P. Fleischmann, R. Sabelka, A. Stach, R. Strasser, S. Selberherr: "Grid Generation for Three-Dimensional Process and Device Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan; (invited) 1996-09-02 - 1996-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4, 161 - 166 doi:10.1109/SISPAD.1996.865321. BibTeX |
| 1. | R. Sabelka: "Dreidimensionale Finite Elemente Simulation von Verdrahtungsstrukturen auf Integrierten Schaltungen"; Reviewer: S. Selberherr, H. Haas; Institut für Mikroelektronik, 2001, oral examination: 2001-05-21. BibTeX |
| 1. | R. Sabelka: "Entwicklung einer X-Windows-Schnittstelle für das Programm OPERA"; Supervisor: S. Selberherr, H. Kosina; Institut für Mikroelektronik, 1994, . BibTeX |
| 1. | M. Knaipp, C. Pichler, G. Rieger, M. Rottinger, R. Sabelka, S. Selberherr, R. Strasser: "VISTA Status Report II"; (1995), 21 page(s) . BibTeX |