Publications Rainer Sabelka
23 recordsPublications in Scientific Journals
3. | C. Harlander, R. Sabelka, S. Selberherr: "Efficient Inductance Calculation in Interconnect Structures by Applying the Monte Carlo Method"; Microelectronics Journal, 34 (2003), 9; 815 - 821. https://doi.org/10.1016/S0026-2692(03)00147-2 | |
2. | R. Sabelka, S. Selberherr: "A Finite Element Simulator for Three-Dimensional Analysis of Interconnect Structures"; Microelectronics Journal, 32 (2001), 2; 163 - 171. https://doi.org/10.1016/S0026-2692(00)00113-0 | |
1. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "High-Precision Interconnect Analysis"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17 (1998), 11; 1148 - 1159. https://doi.org/10.1109/43.736187 | |
Contributions to Books
1. | R. Sabelka, C. Harlander, S. Selberherr: "Interconnects and Propagation of High Frequency Signals"; in: "Predictive Simulation of Semiconductor Processing, Springer Series in Materials Science", 72; J. Dabrowski, E. Weber (ed.); Springer Berlin Heidelberg, 2004, ISBN: 3-540-20481-4, 357 - 385. https://doi.org/10.1007/978-3-662-09432-7_9 | |
Talks and Poster Presentations (with Proceedings-Entry)
16. | A. Nentchev, R. Sabelka, W. Wessner, S. Selberherr: "On-Chip Interconnect Simulation of Parasitic Capacitances in Periodic Structures"; Talk: European Simulation and Modeling Conference (ESMC), Porto; 2005-10-24 - 2005-10-26; in: "The 2005 European Simulation and Modelling Conference Proceedings", (2005), 420 - 424. | |
15. | A. Nentchev, R. Sabelka, S. Selberherr: "Simplification of Spacial Structures by Simulation with Periodic Boundary Conditions"; Talk: VLSI Multilevel Interconnection Conference (VMIC), Fremont; 2005-10-03 - 2005-10-06; in: "2005 Proceedings Twenty Second International VLSI Multilevel Interconnection Conference", (2005), 547 - 552. | |
14. | H. Ceric, R. Sabelka, S. Holzer, W. Wessner, S. Wagner, T. Grasser, S. Selberherr: "The Evolution of the Resistance and Current Density During Electromigration"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (2004), ISBN: 3211224688; 331 - 334. https://doi.org/10.1007/978-3-7091-0624-2_78 | |
13. | C. Harlander, R. Sabelka, S. Selberherr: "A Comparative Study of Two Numerical Techniques for Inductance Calculation in Interconnect Structures"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6; 254 - 257. https://doi.org/10.1007/978-3-7091-6244-6_56 | |
12. | C. Harlander, R. Sabelka, S. Selberherr: "Three-Dimensional Electro-Thermal Simulation of Interconnect Structures with Temperature-Dependent Permittivity"; Talk: International Intersociety, Electronic Packaging Technical Conference (InterPACK), Kauai; 2001-07-08 - 2001-07-13; in: "The Pacific RIM/International Intersociety, Electronic Packaging Technical/Business Conference & Exhibition", (2001), 1 - 2. | |
11. | C. Harlander, R. Sabelka, S. Selberherr: "Inductance Calculation in Interconnect Structures"; Talk: International Conference on Modeling and Simulation of Microsystems (MSM), San Diego; 2000-03-26 - 2000-03-29; in: "Proceedings Intl. Conf. on Modeling and Simulation of Microsystems", (2000), ISBN: 0-9666135-7-0; 416 - 419. | |
10. | R. Sabelka, C. Harlander, S. Selberherr: "Propagation of RF Signals in Microelectronic Structures"; Talk: International Workshop on Challenges in Predictive Process Simulation (ChiPPS), Wandlitz (invited); 2000-05-14 - 2000-05-18; in: "Abstracts Challenges in Predictive Process Simulation Meeting", (2000), 50 - 51. | |
9. | R. Sabelka, C. Harlander, S. Selberherr: "The State of the Art in Interconnect Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Seattle, WA, USA (invited); 2000-09-06 - 2000-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2000), ISBN: 0-7803-6279-9; 6 - 11. https://doi.org/10.1109/SISPAD.2000.871194 | |
8. | C. Harlander, R. Sabelka, R. Minixhofer, S. Selberherr: "Three-Dimensional Transient Electro-Thermal Simulation"; Talk: Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Rome; 1999-10-03 - 1999-10-06; in: "Proceedings THERMINIC Workshop", (1999), 169 - 172. | |
7. | R. Sabelka, R. Martins, S. Selberherr: "Accurate Layout-Based Interconnect Analysis"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (1998), ISBN: 3-211-83208-4; 336 - 339. https://doi.org/10.1007/978-3-7091-6827-1_84 | |
6. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "Modeling Integrated Circuit Interconnections"; Talk: International Conference on Microelectronics and Packaging, Curitiba; 1998-08-10 - 1998-08-14; in: "Proceedings XIII SBMicro, Intl. Conf. on Microelectronics and Packaging", (1998), 144 - 151. | |
5. | R. Martins, R. Sabelka, W. Pyka, S. Selberherr: "Rigorous Capacitance Simulation of DRAM Cells"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4; 69 - 72. https://doi.org/10.1007/978-3-7091-6827-1_20 | |
4. | R. Sabelka, S. Selberherr: "SAP - A Program Package for Three-Dimensional Interconnect Simulation"; Poster: IEEE International Interconnect Technology Conference (IITC), San Francisco; 1998-06-01 - 1998-06-03; in: "Proceedings Intl. Interconnect Technology Conf.", (1998), ISBN: 0-7803-4286-0; 250 - 252. | |
3. | R. Sabelka, K. Koyama, S. Selberherr: "STAP - A Finite Element Simulator for Three-Dimensional Thermal Analysis of Interconnect Structures"; Talk: European Simulation Symposium (ESS), Passau; 1997-10-19 - 1997-10-22; in: "Proceedings European Simulation Symposium", (1997), ISBN: 1-56555-125-7; 621 - 625. | |
2. | A. Stach, R. Sabelka, S. Selberherr: "Three-Dimensional Layout-Based Thermal and Capacitive Simulation of Interconnect Structures"; Talk: International Conference on Modelling, Identification and Control, Innsbruck; 1997-02-17 - 1997-02-19; in: "Proceedings IASTED Intl. Conf. on Modelling, Identification and Control", (1997), ISBN: 0-88986-217-6; 16 - 19. | |
1. | P. Fleischmann, R. Sabelka, A. Stach, R. Strasser, S. Selberherr: "Grid Generation for Three-Dimensional Process and Device Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan (invited); 1996-09-02 - 1996-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4; 161 - 166. https://doi.org/10.1109/SISPAD.1996.865321 | |
Doctor's Theses (authored and supervised)
1. | R. Sabelka: "Dreidimensionale Finite Elemente Simulation von Verdrahtungsstrukturen auf Integrierten Schaltungen"; Supervisor, Reviewer: S. Selberherr, H. Haas; Institut für Mikroelektronik, 2001; oral examination: 2001-05-21. https://doi.org/10.34726/hss.2001.03227950 | |
Diploma and Master Theses (authored and supervised)
1. | R. Sabelka: "Entwicklung einer X-Windows-Schnittstelle für das Programm OPERA"; Supervisor: S. Selberherr, H. Kosina; Institut für Mikroelektronik, 1994. | |
Scientific Reports
1. | M. Knaipp, C. Pichler, G. Rieger, M. Rottinger, R. Sabelka, S. Selberherr, R. Strasser: "VISTA Status Report December 1995"; 1995; 21 pages. | |