Publications Rainer Sabelka

23 records

Publications in Scientific Journals

3.  C. Harlander, R. Sabelka, S. Selberherr:
"Efficient Inductance Calculation in Interconnect Structures by Applying the Monte Carlo Method";
Microelectronics Journal, 34 (2003), 9; 815 - 821. https://doi.org/10.1016/S0026-2692(03)00147-2

2.  R. Sabelka, S. Selberherr:
"A Finite Element Simulator for Three-Dimensional Analysis of Interconnect Structures";
Microelectronics Journal, 32 (2001), 2; 163 - 171. https://doi.org/10.1016/S0026-2692(00)00113-0

1.  R. Martins, W. Pyka, R. Sabelka, S. Selberherr:
"High-Precision Interconnect Analysis";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17 (1998), 11; 1148 - 1159. https://doi.org/10.1109/43.736187

Contributions to Books

1.  R. Sabelka, C. Harlander, S. Selberherr:
"Interconnects and Propagation of High Frequency Signals";
in: "Predictive Simulation of Semiconductor Processing, Springer Series in Materials Science", 72; J. Dabrowski, E. Weber (ed.); Springer Berlin Heidelberg, 2004, ISBN: 3-540-20481-4, 357 - 385. https://doi.org/10.1007/978-3-662-09432-7_9

Talks and Poster Presentations (with Proceedings-Entry)

16.  A. Nentchev, R. Sabelka, W. Wessner, S. Selberherr:
"On-Chip Interconnect Simulation of Parasitic Capacitances in Periodic Structures";
Talk: European Simulation and Modeling Conference (ESMC), Porto; 2005-10-24 - 2005-10-26; in: "The 2005 European Simulation and Modelling Conference Proceedings", (2005), 420 - 424.

15.  A. Nentchev, R. Sabelka, S. Selberherr:
"Simplification of Spacial Structures by Simulation with Periodic Boundary Conditions";
Talk: VLSI Multilevel Interconnection Conference (VMIC), Fremont; 2005-10-03 - 2005-10-06; in: "2005 Proceedings Twenty Second International VLSI Multilevel Interconnection Conference", (2005), 547 - 552.

14.  H. Ceric, R. Sabelka, S. Holzer, W. Wessner, S. Wagner, T. Grasser, S. Selberherr:
"The Evolution of the Resistance and Current Density During Electromigration";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Munich, Germany; 2004-09-02 - 2004-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (2004), ISBN: 3211224688; 331 - 334. https://doi.org/10.1007/978-3-7091-0624-2_78

13.  C. Harlander, R. Sabelka, S. Selberherr:
"A Comparative Study of Two Numerical Techniques for Inductance Calculation in Interconnect Structures";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6; 254 - 257. https://doi.org/10.1007/978-3-7091-6244-6_56

12.  C. Harlander, R. Sabelka, S. Selberherr:
"Three-Dimensional Electro-Thermal Simulation of Interconnect Structures with Temperature-Dependent Permittivity";
Talk: International Intersociety, Electronic Packaging Technical Conference (InterPACK), Kauai; 2001-07-08 - 2001-07-13; in: "The Pacific RIM/International Intersociety, Electronic Packaging Technical/Business Conference & Exhibition", (2001), 1 - 2.

11.  C. Harlander, R. Sabelka, S. Selberherr:
"Inductance Calculation in Interconnect Structures";
Talk: International Conference on Modeling and Simulation of Microsystems (MSM), San Diego; 2000-03-26 - 2000-03-29; in: "Proceedings Intl. Conf. on Modeling and Simulation of Microsystems", (2000), ISBN: 0-9666135-7-0; 416 - 419.

10.  R. Sabelka, C. Harlander, S. Selberherr:
"Propagation of RF Signals in Microelectronic Structures";
Talk: International Workshop on Challenges in Predictive Process Simulation (ChiPPS), Wandlitz (invited); 2000-05-14 - 2000-05-18; in: "Abstracts Challenges in Predictive Process Simulation Meeting", (2000), 50 - 51.

9.  R. Sabelka, C. Harlander, S. Selberherr:
"The State of the Art in Interconnect Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Seattle, WA, USA (invited); 2000-09-06 - 2000-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2000), ISBN: 0-7803-6279-9; 6 - 11. https://doi.org/10.1109/SISPAD.2000.871194

8.  C. Harlander, R. Sabelka, R. Minixhofer, S. Selberherr:
"Three-Dimensional Transient Electro-Thermal Simulation";
Talk: Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Rome; 1999-10-03 - 1999-10-06; in: "Proceedings THERMINIC Workshop", (1999), 169 - 172.

7.  R. Sabelka, R. Martins, S. Selberherr:
"Accurate Layout-Based Interconnect Analysis";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", Springer, (1998), ISBN: 3-211-83208-4; 336 - 339. https://doi.org/10.1007/978-3-7091-6827-1_84

6.  R. Martins, W. Pyka, R. Sabelka, S. Selberherr:
"Modeling Integrated Circuit Interconnections";
Talk: International Conference on Microelectronics and Packaging, Curitiba; 1998-08-10 - 1998-08-14; in: "Proceedings XIII SBMicro, Intl. Conf. on Microelectronics and Packaging", (1998), 144 - 151.

5.  R. Martins, R. Sabelka, W. Pyka, S. Selberherr:
"Rigorous Capacitance Simulation of DRAM Cells";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4; 69 - 72. https://doi.org/10.1007/978-3-7091-6827-1_20

4.  R. Sabelka, S. Selberherr:
"SAP - A Program Package for Three-Dimensional Interconnect Simulation";
Poster: IEEE International Interconnect Technology Conference (IITC), San Francisco; 1998-06-01 - 1998-06-03; in: "Proceedings Intl. Interconnect Technology Conf.", (1998), ISBN: 0-7803-4286-0; 250 - 252.

3.  R. Sabelka, K. Koyama, S. Selberherr:
"STAP - A Finite Element Simulator for Three-Dimensional Thermal Analysis of Interconnect Structures";
Talk: European Simulation Symposium (ESS), Passau; 1997-10-19 - 1997-10-22; in: "Proceedings European Simulation Symposium", (1997), ISBN: 1-56555-125-7; 621 - 625.

2.  A. Stach, R. Sabelka, S. Selberherr:
"Three-Dimensional Layout-Based Thermal and Capacitive Simulation of Interconnect Structures";
Talk: International Conference on Modelling, Identification and Control, Innsbruck; 1997-02-17 - 1997-02-19; in: "Proceedings IASTED Intl. Conf. on Modelling, Identification and Control", (1997), ISBN: 0-88986-217-6; 16 - 19.

1.  P. Fleischmann, R. Sabelka, A. Stach, R. Strasser, S. Selberherr:
"Grid Generation for Three-Dimensional Process and Device Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan (invited); 1996-09-02 - 1996-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1996), ISBN: 0-7803-2745-4; 161 - 166. https://doi.org/10.1109/SISPAD.1996.865321

Doctor's Theses (authored and supervised)

1.  R. Sabelka:
"Dreidimensionale Finite Elemente Simulation von Verdrahtungsstrukturen auf Integrierten Schaltungen";
Supervisor, Reviewer: S. Selberherr, H. Haas; Institut für Mikroelektronik, 2001; oral examination: 2001-05-21. https://doi.org/10.34726/hss.2001.03227950

Diploma and Master Theses (authored and supervised)

1.  R. Sabelka:
"Entwicklung einer X-Windows-Schnittstelle für das Programm OPERA";
Supervisor: S. Selberherr, H. Kosina; Institut für Mikroelektronik, 1994.

Scientific Reports

1.  M. Knaipp, C. Pichler, G. Rieger, M. Rottinger, R. Sabelka, S. Selberherr, R. Strasser:
"VISTA Status Report December 1995";
1995; 21 pages.