Staff Person Publications
  •  Intranet
t3kitt3kitt3kit
  • Home
  • TeachingOpen
    • Lehrveranstaltungen
    • Bachelorarbeiten
    • Masterarbeiten
    • Dissertationen
  • ResearchOpen
    • Activities
    • Computing Infrastructure
    • Characterization Lab
    • Annual Reviews
    • Public Projects
    • Conferences
  • PublicationsOpen
    • Books and Book Editorships
    • Papers in Journals
    • Contributions to Books
    • Conference Presentations
    • Scientific Reports
    • Patents
    • Habilitation Theses
    • PhD Theses
    • Master's Theses
  • SoftwareOpen
    • Software
    • Download
    • License Agreement
  • StaffOpen
    • Active Staff
    • Former Staff
  • About UsOpen
    • Contact Us
    • Join Us
    • Partners
    • Imprint
    • Corporate Design
    • Sitemap
  • News

Publications Alexander Scharinger

7 records


Contributions to Books


1. L.F. Aguinsky, G. Wachter, F. Rodrigues, A. Scharinger, A. Toifl, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Feature-Scale Modeling of Low-Bias SF6 Plasma Etching of Si";
in "Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", B. Cretu (ed); IEEE, 2021, 1 - 4 doi:10.1109/EuroSOI-ULIS53016.2021.9560685. BibTeX


Talks and Poster Presentations (with Proceedings-Entry)


6. F. Rodrigues, L.F. Aguinsky, A. Toifl, A. Scharinger, A. Hössinger, J. Weinbub:
"Surface Reaction and Topography Modeling of Fluorocarbon Plasma Etching";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 - 2021-09-29; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2021), . BibTeX

5. L.F. Aguinsky, G. Wachter, A. Scharinger, F. Rodrigues, A. Toifl, M. Trupke, U. Schmid, A. Hössinger, J. Weinbub:
"Feature-Scale Modeling of Isotropic SF6 Plasma Etching of Si";
Poster: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 - 2021-09-03; in "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2021), 54 - 55. BibTeX

4. C. Lenz, A. Scharinger, M. Quell, P. Manstetten, A. Hössinger, J. Weinbub:
"Evaluating Parallel Feature Detection Methods for Implicit Surfaces";
Talk: Austrian-Slovenian HPC Meeting (ASHPC), Maribor, Slovenia (Virtual); 2021-05-31 - 2021-06-02; in "Book of Abstracts of the Austrian-Slovenian HPC Meeting (ASHPC)", (2021), 31. BibTeX

3. A. Scharinger, P. Manstetten, A. Hössinger, J. Weinbub:
"Generative Model Based Adaptive Importance Sampling for Flux Calculations in Process TCAD";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 - 2020-10-06; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2020), 39 - 42 doi:10.23919/SISPAD49475.2020.9241615. BibTeX

2. C. Lenz, A. Scharinger, A. Hössinger, J. Weinbub:
"A Novel Surface Mesh Coarsening Method for Flux-Dependent Topography Simulations of Semiconductor Fabrication Processes";
Talk: International Conferences on Scientific Computing in Electrical Engineering (SCEE), Eindhoven, The Netherlands; 2020-02-16 - 2020-02-20; in "Book of Abstracts of the International Conferences on Scientific Computing in Electrical Engineering (SCEE)", (2020), 99 - 100. BibTeX

1. P. Manstetten, G. Diamantopoulos, L. Gnam, L.F. Aguinsky, M. Quell, A. Toifl, A. Scharinger, A. Hössinger, M. Ballicchia, M. Nedjalkov, J. Weinbub:
"High Performance TCAD: From Simulating Fabrication Processes to Wigner Quantum Transport";
Talk: Workshop on High Performance TCAD (WHPTCAD), Chicago, IL, USA; 2019-05-24 - 2019-05-25; in "Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD)", (2019), 13. BibTeX

  • Active Staff
  • Former Staff

Institute for Microelectronics
Head: Univ. Prof. Dipl.-Ing. Dr. techn. Tibor Grasser
Deputy Head: O. Univ. Prof. Dipl.-Ing. Dr. techn. Dr.h.c. Siegfried Selberherr
Contact Us    |    Join Us    |    Imprint
© E360 - Institute for Microelectronics 2018