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Publications Anderson Singulani

22 records

Publications in Scientific Journals

3.  S. Papaleo, W. H. Zisser, A.P. Singulani, H. Ceric, S. Selberherr:
"Stress Evolution During Nanoindentation in Open TSVs";
IEEE Transactions on Device and Materials Reliability, 16 (2016), 4; 470 - 474. https://doi.org/10.1109/TDMR.2016.2622727

2.  L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Intrinsic Stress Analysis of Tungsten-Lined Open TSVs";
Microelectronics Reliability, 55 (2015), 9-10; 1843 - 1848. https://doi.org/10.1016/j.microrel.2015.06.014

1.  A. P. Singulani, H. Ceric, S. Selberherr:
"Stress Evolution in the Metal Layers of TSVs with Bosch Scallops";
Microelectronics Reliability, 53 (2013), 1602 - 1605. https://doi.org/10.1016/j.microrel.2013.07.132

Contributions to Books

1.  R. Coppeta, A. Lahlalia, D. Kozic, R. Hammer, J. Riedler, G. Toschkoff, A.P. Singulani, Z. Ali, M. Sagmeister, S. Carniello, S. Selberherr, L. Filipovic:
"Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates";
in: "Sensor Systems Simulations", W. van Driel, O. Pyper, C. Schumann (ed.); Springer International Publishing, 2020, ISBN: 978-3-030-16577-2, 17 - 72. https://doi.org/10.1007/978-3-030-16577-2_2

Talks and Poster Presentations (with Proceedings-Entry)

16.  L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Impact of Across-Wafer Variation on the Electrical Performance of TSVs";
Talk: IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 - 2016-05-26; in: "Proceedings of the IEEE International Interconnect Technology Conference (IITC)", (2016), ISBN: 978-1-5090-0386-0; 130 - 132. https://doi.org/10.1109/IITC-AMC.2016.7507707

15.  F. Roger, A. P. Singulani, S. Carniello, L. Filipovic, S. Selberherr:
"Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation";
Talk: International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 - 2015-09-04; in: "Proceedings of the 6th International Workshop on CMOS Variability (VARI)", (2015), ISBN: 978-1-5090-0071-5; 39 - 44. https://doi.org/10.1109/VARI.2015.7456561

14.  L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr:
"Intrinsic Stress Analysis of Tungsten-Lined Open TSVs";
Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 - 2015-10-09; in: "Abstracts of the 26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis", (2015), 71.

13.  H. Ceric, R. Orio, A. P. Singulani, S. Selberherr:
"3D Technology Interconnect Reliability TCAD";
Talk: Pan Pacific Microelectronics Symposium, Big Island of Hawaii, USA; 2014-02-11 - 2014-02-13; in: "Proceedings of the 2014 Pan Pacific Microelectronics Symposium", (2014), ISBN: 978-0-9888873-3-6; 1 - 8.

12.  L. Filipovic, R. Orio, S. Selberherr, A. P. Singulani, F. Roger, R. Minixhofer:
"Effects of Sidewall Scallops on Open Tungsten TSVs";
Talk: International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 - 2014-06-05; in: "Proceedings of the International Reliability Physics Symposium (IRPS)", (2014), ISBN: 978-1-4799-3317-4; 3E.3.1 - 3E.3.6. https://doi.org/10.1109/IRPS.2014.6860633

11.  S. Papaleo, W. H. Zisser, A. P. Singulani, H. Ceric, S. Selberherr:
"Stress Analysis in Open TSVs after Nanoindentation";
Talk: GDRI CNRS Mecano General Meeting on the Mechanics of Nano-objects, Thun, Switzerland; 2014-09-04 - 2014-09-05; in: "Abstracts", (2014), 39 - 40.

10.  S. Papaleo, W. H. Zisser, A. P. Singulani, H. Ceric, S. Selberherr:
"Stress Evolution During the Nanoindentation in Open TSVs";
Poster: International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 - 2014-10-17; in: "Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics", (2014), 52.

9.  L. Filipovic, F. Rudolf, E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, A. P. Singulani, R. Minixhofer, S. Selberherr:
"Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 - 2014-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2014), ISBN: 978-1-4799-5285-4; 341 - 344. https://doi.org/10.1109/SISPAD.2014.6931633

8.  A. P. Singulani, H. Ceric, E. Langer, S. Carniello:
"Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology";
Poster: International Reliability Physics Symposium (IRPS), Monterey, CA, USA; 2013-04-14 - 2013-04-18; in: "Proceedings of the International Reliability Physics Symposium (IRPS)", (2013), ISBN: 978-1-4799-0112-8; CP.2.1 - CP.2.5. https://doi.org/10.1109/IRPS.2013.6532066

7.  H. Ceric, A. P. Singulani, R. Orio, S. Selberherr:
"Electromigration Enhanced Growth of Intermetallic Compound in Solder Bumps";
Talk: IEEE International Reliability Workshop (IIRW), South Lake Tahoe, USA; 2013-10-13 - 2013-10-17; in: "Final Report of the IEEE International Integrated Reliability Workshop (IIRW)", (2013), ISBN: 978-1-4799-0350-4; 166 - 169. https://doi.org/10.1109/IIRW.2013.6804185

6.  A. P. Singulani, H. Ceric, L. Filipovic, E. Langer:
"Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology";
Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland; 2013-04-14 - 2013-04-17; in: "Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE)", (2013), ISBN: 978-1-4673-6137-8; 6 pages. https://doi.org/10.1109/EuroSimE.2013.6529938

5.  H. Ceric, A. P. Singulani, R. Orio, S. Selberherr:
"Impact of Intermetallic Compound on Solder Bump Electromigration Reliability";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3; 73 - 76. https://doi.org/10.1109/SISPAD.2013.6650577

4.  A. P. Singulani, H. Ceric, S. Selberherr:
"Stress Estimation in Open Tungsten TSV";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3; 65 - 68. https://doi.org/10.1109/SISPAD.2013.6650575

3.  A. P. Singulani, H. Ceric, E. Langer:
"Stress Evolution on Tungsten Thin-Film of an Open Through Silicon Via Technology";
Poster: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Suzhou, China; 2013-07-15 - 2013-07-19; in: "Proceedings of the 20th International Symposium on the Physical & Failure Analysis of Integrated Circuits", (2013), ISBN: 978-1-4799-0478-5; 216 - 220. https://doi.org/10.1109/IPFA.2013.6599155

2.  A. P. Singulani, H. Ceric, E. Langer:
"Stress reduction induced by Bosch scallops on an open TSV technology";
Poster: IEEE International Interconnect Technology Conference (IITC), Kyoto, Japan; 2013-06-13 - 2013-06-15; in: "Proceedings of the International Interconnect Techonology Conference (IITC)", (2013), ISBN: 978-1-4799-0438-9; 1 - 2. https://doi.org/10.1109/IITC.2013.6615578

1.  A. P. Singulani, H. Ceric, S. Selberherr:
"Thermo-mechanical Simulations of an Open Tungsten TSV";
Talk: IEEE Electronics Packaging Technology Conference (EPTC), Singapore; 2012-12-05 - 2012-12-07; in: "Proceedings of the IEEE 14th Electronics Packaging Technology Conference (EPTC)", (2012), ISBN: 978-1-4673-4551-4; 110 - 114. https://doi.org/10.1109/EPTC.2012.6507061

Talks and Poster Presentations (without Proceedings-Entry)

1.  A. P. Singulani, H. Ceric, S. Selberherr:
"Stress Evolution in the Metal Layers of TSVs with Bosch Scallops";
Poster: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Arcachon, France; 2013-09-30 - 2013-10-04.

Doctor's Theses (authored and supervised)

1.  A. P. Singulani:
"Advanced Methods for Mechanical Analysis and Simulation of Through Silicon Vias";
Supervisor, Reviewer: S. Selberherr, O. Thomas; Institut für Mikroelektronik, 2014; oral examination: 2014-07-07. https://doi.org/10.34726/hss.2014.24806