Staff Person Publications

Publications A. Singulani

22 records

Publications in Scientific Journals

3.	S. Papaleo, W. H. Zisser, A.P. Singulani, H. Ceric, S. Selberherr: "Stress Evolution During Nanoindentation in Open TSVs"; IEEE Transactions on Device and Materials Reliability, 16, (2016), 470 - 474 doi:10.1109/TDMR.2016.2622727. BibTeX
2.	L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr: "Intrinsic Stress Analysis of Tungsten-Lined Open TSVs"; Microelectronics Reliability, 55, (2015), 1843 - 1848 doi:10.1016/j.microrel.2015.06.014. BibTeX
1.	A. P. Singulani, H. Ceric, S. Selberherr: "Stress Evolution in the Metal Layers of TSVs with Bosch Scallops"; Microelectronics Reliability, 53, (2013), 1602 - 1605 doi:10.1016/j.microrel.2013.07.132. BibTeX

Contributions to Books

R. Coppeta, A. Lahlalia, D. Kozic, R. Hammer, J. Riedler, G. Toschkoff, A.P. Singulani, Z. Ali, M. Sagmeister, S. Carniello, S. Selberherr, L. Filipovic:
"Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates";
in "Sensor Systems Simulations", W. van Driel, O. Pyper, C. Schumann (ed); Springer International Publishing, 2020, ISBN: 978-3-030-16577-2, 17 - 72 doi:10.1007/978-3-030-16577-2_2. BibTeX

Talks and Poster Presentations (with Proceedings-Entry)

16.	L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr: "Impact of Across-Wafer Variation on the Electrical Performance of TSVs"; Talk: IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 - 2016-05-26; in "Proceedings of the IEEE International Interconnect Technology Conference (IITC)", (2016), ISBN: 978-1-5090-0386-0, 130 - 132 doi:10.1109/IITC-AMC.2016.7507707. BibTeX
15.	L. Filipovic, A. P. Singulani, F. Roger, S. Carniello, S. Selberherr: "Intrinsic Stress Analysis of Tungsten-Lined Open TSVs"; Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 - 2015-10-09; in "Abstracts of the 26^th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis", (2015), 71. BibTeX
14.	F. Roger, A. P. Singulani, S. Carniello, L. Filipovic, S. Selberherr: "Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation"; Talk: International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 - 2015-09-04; in "Proceedings of the 6^th International Workshop on CMOS Variability (VARI)", (2015), ISBN: 978-1-5090-0071-5, 39 - 44 doi:10.1109/VARI.2015.7456561. BibTeX
13.	S. Papaleo, W. H. Zisser, A. P. Singulani, H. Ceric, S. Selberherr: "Stress Evolution During the Nanoindentation in Open TSVs"; Poster: International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 - 2014-10-17; in "Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics", (2014), 52. BibTeX
12.	L. Filipovic, F. Rudolf, E. Baer, P. Evanschitzky, J. Lorenz, F. Roger, A. P. Singulani, R. Minixhofer, S. Selberherr: "Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 - 2014-09-11; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2014), ISBN: 978-1-4799-5285-4, 341 - 344 doi:10.1109/SISPAD.2014.6931633. BibTeX
11.	S. Papaleo, W. H. Zisser, A. P. Singulani, H. Ceric, S. Selberherr: "Stress Analysis in Open TSVs after Nanoindentation"; Talk: GDRI CNRS Mecano General Meeting on the Mechanics of Nano-objects, Thun, Switzerland; 2014-09-04 - 2014-09-05; in "Abstracts", (2014), 39 - 40. BibTeX
10.	L. Filipovic, R. Orio, S. Selberherr, A. P. Singulani, F. Roger, R. Minixhofer: "Effects of Sidewall Scallops on Open Tungsten TSVs"; Talk: International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 - 2014-06-05; in "Proceedings of the International Reliability Physics Symposium (IRPS)", (2014), ISBN: 978-1-4799-3317-4, 3E.3.1 - 3E.3.6 doi:10.1109/IRPS.2014.6860633. BibTeX
9.	H. Ceric, R. Orio, A. P. Singulani, S. Selberherr: "3D Technology Interconnect Reliability TCAD"; Talk: Pan Pacific Microelectronics Symposium, Big Island of Hawaii, USA; 2014-02-11 - 2014-02-13; in "Proceedings of the 2014 Pan Pacific Microelectronics Symposium", (2014), ISBN: 978-0-9888873-3-6, 1 - 8. BibTeX
8.	H. Ceric, A. P. Singulani, R. Orio, S. Selberherr: "Electromigration Enhanced Growth of Intermetallic Compound in Solder Bumps"; Talk: IEEE International Reliability Workshop (IIRW), South Lake Tahoe, USA; 2013-10-13 - 2013-10-17; in "Final Report of the IEEE International Integrated Reliability Workshop (IIRW)", (2013), ISBN: 978-1-4799-0350-4, 166 - 169 doi:10.1109/IIRW.2013.6804185. BibTeX
7.	H. Ceric, A. P. Singulani, R. Orio, S. Selberherr: "Impact of Intermetallic Compound on Solder Bump Electromigration Reliability"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3, 73 - 76 doi:10.1109/SISPAD.2013.6650577. BibTeX
6.	A. P. Singulani, H. Ceric, S. Selberherr: "Stress Estimation in Open Tungsten TSV"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3, 65 - 68 doi:10.1109/SISPAD.2013.6650575. BibTeX
5.	A. P. Singulani, H. Ceric, E. Langer: "Stress Evolution on Tungsten Thin-Film of an Open Through Silicon Via Technology"; Poster: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Suzhou, China; 2013-07-15 - 2013-07-19; in "Proceedings of the 20th International Symposium on the Physical & Failure Analysis of Integrated Circuits", (2013), ISBN: 978-1-4799-0478-5, 216 - 220 doi:10.1109/IPFA.2013.6599155. BibTeX
4.	A. P. Singulani, H. Ceric, E. Langer: "Stress reduction induced by Bosch scallops on an open TSV technology"; Poster: IEEE International Interconnect Technology Conference (IITC), Kyoto, Japan; 2013-06-13 - 2013-06-15; in "Proceedings of the International Interconnect Techonology Conference (IITC)", (2013), ISBN: 978-1-4799-0438-9, 1 - 2 doi:10.1109/IITC.2013.6615578. BibTeX
3.	A. P. Singulani, H. Ceric, L. Filipovic, E. Langer: "Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology"; Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland; 2013-04-14 - 2013-04-17; in "Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE)", (2013), ISBN: 978-1-4673-6137-8, 6 page(s) doi:10.1109/EuroSimE.2013.6529938. BibTeX
2.	A. P. Singulani, H. Ceric, E. Langer, S. Carniello: "Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology"; Poster: International Reliability Physics Symposium (IRPS), Monterey, CA, USA; 2013-04-14 - 2013-04-18; in "Proceedings of the International Reliability Physics Symposium (IRPS)", (2013), ISBN: 978-1-4799-0112-8, CP.2.1 - CP.2.5 doi:10.1109/IRPS.2013.6532066. BibTeX
1.	A. P. Singulani, H. Ceric, S. Selberherr: "Thermo-mechanical Simulations of an Open Tungsten TSV"; Talk: IEEE Electronics Packaging Technology Conference (EPTC), Singapore; 2012-12-05 - 2012-12-07; in "Proceedings of the IEEE 14th Electronics Packaging Technology Conference (EPTC)", (2012), ISBN: 978-1-4673-4551-4, 110 - 114 doi:10.1109/EPTC.2012.6507061. BibTeX

Talks and Poster Presentations (without Proceedings-Entry)

1.	A. P. Singulani, H. Ceric, S. Selberherr: "Stress Evolution in the Metal Layers of TSVs with Bosch Scallops"; Poster: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Arcachon, France; 2013-09-30 - 2013-10-04; . BibTeX

Doctor's Theses (authored and supervised)

1.	A. P. Singulani: "Advanced Methods for Mechanical Analysis and Simulation of Through Silicon Vias"; Reviewer: S. Selberherr, O. Thomas; Institut für Mikroelektronik, 2014, oral examination: 2014-07-07 doi:10.34726/hss.2014.24806. BibTeX