SAP
    t3kitt3kitt3kit
    • Home
    • TeachingOpen
      • Lehrveranstaltungen
      • Bachelorarbeiten
      • Masterarbeiten
      • Dissertationen
    • ResearchOpen
      • Activities
      • Computing Infrastructure
      • Characterization Lab
      • Annual Reviews
      • Public Projects
      • Conferences
    • PublicationsOpen
      • Books and Book Editorships
      • Papers in Journals
      • Contributions to Books
      • Conference Presentations
      • Scientific Reports
      • Patents
      • Habilitation Theses
      • PhD Theses
      • Master's Theses
    • SoftwareOpen
      • Software
      • Download
      • License Agreement
    • StaffOpen
      • Active Staff
      • Former Staff
    • About UsOpen
      • Contact Us
      • Join Us
      • Partners
      • Imprint
      • Corporate Design
      • Sitemap
    • News

    Software Information


    A two- and three-dimensional interconnect simulator

    Description

    The program package SAP is a finite element simulator, designed specifically for highly accurate analysis of multi-layer VLSI interconnect structures. It supports resistance, capacitance, and inductance extraction, coupled electro-thermal simulations, calculation of delay times and cross-talk. The package also includes preprocessors for two- and three-dimensional geometry construction (solid modeling) and automatic grid generation, as well as a visualization tool, which allows further investigation of the calculated results.

    New Features in this Release

    The SAP package contains the following simulators and auxiliary tools:

    • STAP (Smart Thermal Analysis Program) is a two- and three-dimensional finite element based program for resistance, capacitance and inductance extraction and stationary and transient electro-thermal simulations. Supported two-dimensional elements are triangles. For three dimensions tetrahedrons can be used. A global grid refinement is supported. Linear or quadratic shape functions can be used to calculate the potential and temperature distributions.
    • SCAP (Smart Capacitance Analysis Program) is a two- and three-dimensional finite element based program to extract linear capacitances of n-conductor problems.
    • CUTGRID is a two dimensional solid modeler and grid generator. It is used to generate the input for STAP and SCAP for two-dimensional simulations.
    • LAYGRID is 2 and 1/2 dimensional solid modeler and grid generator. It allows a layer-based input of interconnect wiring structures and generates a three dimensional simulation grid suitable for STAP and SCAP.
    • LAYCONV converts layouts in GDS2 or CIF format to input files for laygrid.
    • TRANSGRID (no longer supported) allows a geometry input based on hyper- patches.
    • SV and FEMPOST are two- and three-dimensional visualization programs.
    • COMPRESS_FLD, REMOVEMAT-SH, SHOWBDCOND-SH, and VSUB-SH are scripts for manipulation of SAP data files.

    How to obtain this Software

    This software can be obtained via our Download Portal.

    • Software
      • ViennaCL
      • ViennaData
      • ViennaFEM
      • ViennaGrid
      • ViennaIPD
      • ViennaMag
      • ViennaMath
      • ViennaMesh
      • ViennaMOS
      • ViennaProfiler
      • ViennaSHE
      • ViennaSiSpin
      • ViennaTS
      • ViennaWD
      • ViennaX
      • Simon
      • deLink 1.0
      • Minimos 6.1
      • Minimos 6.1 Win
      • Promis
      • SAP
      • VMC
      • VSP
    • Download
    • License Agreement

    Institute for Microelectronics
    Head: Univ. Prof. Dipl.-Ing. Dr. techn. Tibor Grasser
    Deputy Head: O. Univ. Prof. Dipl.-Ing. Dr. techn. Dr.h.c. Siegfried Selberherr
    Contact Us    |    Join Us    |    Imprint
    © E360 - Institute for Microelectronics 2018