Staff Person Publications

Publications Lado Filipovic

178 records

Books and Editorships

4.		Filipovic, L., Grasser, T. (Eds.): "Miniaturized Transistors, Volume II"; MDPI, Basel, 2022, ISBN: 978-3-0365-4169-3; 352 pages. https://doi.org/10.3390/books978-3-0365-4170-9

3.		Filipovic, L., Grasser, T.: Special Issue on Miniaturized Transistors, Volume II Micromachines, 13 (2022), 4; 1 - 4. https://doi.org/10.3390/mi13040603

2.		Filipovic, L., Grasser, T.: Editorial for the Special Issue on Miniaturized Transistors Micromachines, 10 (2019), 5; 1 - 3. https://doi.org/10.3390/mi10050300

1.		Filipovic, L., Grasser, T. (Eds.): Miniaturized Transistors MDPI, 2019, ISBN: 978-3-03921-010-7; 202 pages. https://doi.org/10.3390/books978-3-03921-011-4

Publications in Scientific Journals

46.		Speckmann, C., Angeletti, A., Kývala, L., Lamprecht, D., Herterich, F., Mangler, C., Filipovic, L., Dellago, C., Franchini, C., Kotakoski, J. (2025). Electron‐Beam‐Induced Adatom‐Vacancy‐Complexes in Mono‐ and Bilayer Phosphorene. Advanced Materials Interfaces, Article 2400784. https://doi.org/10.1002/admi.202400784 (reposiTUm)

45.		Bui, T. A., Lamprecht, D., Madsen, J., Kurpas, M., Kotrusz, P., Markevich, A., Mangler, C., Kotakoski, J., Filipovic, L., Meyer, J. C., Pennycook, T. J., Skákalová, V., Mustonen, K. (2025). Hexatic Phase in Covalent Two-Dimensional Silver Iodide. Science, 390(6777), 1033–1037. https://doi.org/10.1126/science.adv7915 (reposiTUm)

44.		Hu, Z., Lai, P., Ge, R., Shao, H., Zhai, Y., Tong, Y.-K., Feng, Z., Shang, D., Li, J., Chen, R., Filipovic, L. (2025). Improvement of Selective Quasi Atomic Layer Etching of SiGe/Si by Plasma Surface Modification for Fishbone FET Fabrication. Advanced Materials Technologies, 10(18), Article e02192. https://doi.org/10.1002/admt.202402192 (reposiTUm)

43.		Zhai, Y., Ge, R., Hu, Z., Li, J., Shao, H., Cheng, J., Filipovic, L., Chen, R. (2025). Modeling the Charging Effect of the Hardmask and Silicon Substrate During Plasma Etching in Advanced Nodes. Journal of Applied Physics, 137(6), Article 063302. https://doi.org/10.1063/5.0243470 (reposiTUm)

42.		Lamprecht, D., Benzer, A., Längle, M., Capin, M., Mangler, C., Susi, T., Filipovic, L., Kotakoski, J. (2025). Uncovering the Atomic Structure of Substitutional Platinum Dopants in MoS₂ With Single-Sideband Ptychography. Nano Letters, 25(22), 8931–8938. https://doi.org/10.1021/acs.nanolett.5c00919 (reposiTUm)

41.		Reiter, T., Filipovic, L. (2025). ViennaPS: A Flexible Framework for Semiconductor Process Simulation. SoftwareX, 32, Article 102453. https://doi.org/10.1016/j.softx.2025.102453 (reposiTUm)

40.		Hu, Z., Li, J., Chen, R., Shang, D., Wei, Y., Wang, Z., Li, L., Filipovic, L. (2024). A Two-Step Dry Etching Model for Non-Uniform Etching Profile in Gate-All-Around Field-Effect Transistor Manufacturing. Small, 20(51), Article 2405574. https://doi.org/10.1002/smll.202405574 (reposiTUm)

39.		Propst, D., Joudi, W., Längle, M., Madsen, J., Kofler, C., Mayer, B., Lamprecht, D., Mangler, C., Filipovic, L., Susi, T., Kotakoski, J. (2024). Automated Image Acquisition and Analysis of Graphene and Hexagonal Boron Nitride From Pristine to Highly Defective and Amorphous Structures. Scientific Reports, 14(1), Article 26939. https://doi.org/10.1038/s41598-024-77740-9 (reposiTUm)

38.		Shao, H., Reiter, T., Chen, R., Li, J., Hu, Z., Wei, Y., Li, L., Filipovic, L. (2024). Loading Effect During SiGe/Si Stack Selective Isotropic Etching for Gate-All-Around Transistors. ACS Applied Electronic Materials, 6(11), 8124–8133. https://doi.org/10.1021/acsaelm.4c01462 (reposiTUm)

37.		Reiter, T., Aguinsky, L. F., Souza Berti Rodrigues, F., Weinbub, J., Hössinger, A., Filipovic, L. (2024). Modeling the Impact of Incomplete Conformality During Atomic Layer Processing. Solid-State Electronics, 211, Article 108816. https://doi.org/10.1016/j.sse.2023.108816 (reposiTUm)

36.		Faber, T., Filipovic, L., Koster, L. J. A. (2024). The Hot Phonon Bottleneck Effect in Metal Halide Perovskites. Journal of Physical Chemistry Letters, 15, 12601–12607. https://doi.org/10.1021/acs.jpclett.4c03133 (reposiTUm)

35.		Yazdanpanah Goharrizi, A., Mojarani Barzoki, A., Selberherr, S., Filipovic, L. (2023). A Theoretical Study of Armchair Antimonene Nanoribbons in the Presence of Uniaxial Strain Based on First-Principles Calculations. ACS Applied Electronic Materials, 5(8), 4514–4522. https://doi.org/10.1021/acsaelm.3c00686 (reposiTUm)

34.		Filipovic, L., Baumgartner, O., Klemenschits, X., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., Karner, M. (2023). DTCO Flow for Air Spacer Generation and Its Impact on Power and Performance at N7. Solid-State Electronics, 199, Article 108527. https://doi.org/10.1016/j.sse.2022.108527 (reposiTUm)

33.		Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L. (2023). Effect of Mask Geometry Variation on Plasma Etching Profiles. Micromachines, 14(3), Article 665. https://doi.org/10.3390/mi14030665 (reposiTUm)

32.		Aguinsky, L. F., Souza Berti Rodrigues, F., Reiter, T., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J. (2023). Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio Structures. Solid-State Electronics, 201, Article 108584. https://doi.org/10.1016/j.sse.2022.108584 (reposiTUm)

31.		Garcia-Barrientos, A., Nikolova, N., Filipovic, L., Gutierez-D., E. A., Serrano, V., Macias-Velasquez, S., Zarate-Galvez, S. (2023). Numerical Simulations of Space Charge Waves Amplification Using Negative Differential Conductance in Strained Si/SiGe at 4.2 K. Crystals, 13(9), Article 1398. https://doi.org/10.3390/cryst13091398 (reposiTUm)

30.		Zarate-Galvez, S., Garcia-Barrientos, A., Lastras-Martinez, L. F., Cardenas-Juarez, M., Macias-Velasquez, S., Filipovic, L., Arce-Casas, A. (2023). Optimization of Doping Concentration to Obtain High Internal Quantum Efficiency and Wavelength Stability in an InGaN/GaN Blue Light-Emitting Diode. ECS Journal of Solid State Science and Technology, 12(7), Article 076014. https://doi.org/10.1149/2162-8777/ace7c4 (reposiTUm)

29.		Faber, T., Filipovic, L., Koster, L. J. A. (2023). The Role of Thermalization in the Cooling Dynamics of Hot Carrier Solar Cells. Solar RRL, 7(13), 1–9. https://doi.org/10.1002/solr.202300140 (reposiTUm)

28.		Filipovic, L., Selberherr, S. (2022). Application of Two-Dimensional Materials Towards CMOS-integrated Gas Sensors. Nanomaterials, 12(20), Article 3651. https://doi.org/10.3390/nano12203651 (reposiTUm)

27.		Reiter, T., Klemenschits, X., Filipovic, L.: Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory Solid-State Electronics (invited), 192 (2022), 108261-1 - 108261-9. https://doi.org/10.1016/j.sse.2022.108261

26.		Knobloch, T., Burkay, U., Illarionov, Yu., Wang, Z., Otto, M., Filipovic, L., Waltl, M., Neumaier, D., Lemme, M., Grasser, T.: Improving Stability in Two-Dimensional Transistors with Amorphous Gate Oxides by Fermi-Level Tuning Nature Electronics, 5 (2022), 356 - 366. https://doi.org/10.1038/s41928-022-00768-0

25.		Knobloch, T., Uzlu, B., Illarionov, Y., Wang, Z., Otto, M., Filipovic, L., Waltl, M., Neumaier, D., Lemme, M. C., Grasser, T. (2022). Improving Stability in Two-Dimensional Transistors With Amorphous Gate Oxides by Fermi-Level Tuning. Nature Electronics, 5(6), 356–366. https://doi.org/10.1038/s41928-022-00768-0 (reposiTUm)

24.		Waltl, M., Knobloch, T., Tselios, K., Filipovic, L., Stampfer, B., Hernandez, Y., Waldhör, D., Illarionov, Y., Kaczer, B., Grasser, T.: Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology? Advanced Materials (invited), n/a (2022), 2201082-1 - 2201082-23. https://doi.org/10.1002/adma.202201082

23.		Klemenschits, X., Selberherr, S., Filipovic, L.: Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures Computer Methods in Applied Mechanics and Engineering, 386 (2021), 114196-1 - 114196-22. https://doi.org/10.1016/j.cma.2021.114196

22.		Filipovic, L., Selberherr, S.: Microstructure and Granularity Effects in Electromigration IEEE Journal of the Electron Devices Society (invited), 9 (2021), 476 - 483. https://doi.org/10.1109/JEDS.2020.3044112

21.		Fatemeh, S., Moradinasab, M., Schwalke, U., Filipovic, L.: Superior Sensitivity and Optical Response of Blue Phosphorene and Its Doped Systems for Gas Sensing Applications ACS Omega, 6 (2021), 29; 18770 - 18781. https://doi.org/10.1021/acsomega.1c01898

20.		Filipovic, L.: Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters Microelectronics Reliability, 123 (2021), 114219-1 - 114219-14. https://doi.org/10.1016/j.microrel.2021.114219

19.		Filipovic, L. (2021). Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters. Microelectronics Reliability, 123, 1–14. https://doi.org/10.1016/j.microrel.2021.114219 (reposiTUm)

18.		Filipovic, L.: A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration Microelectronics Reliability, 97 (2019), 38 - 52. https://doi.org/10.1016/j.microrel.2019.04.005

17.		Lahlalia, A., Le Neel, O., Shankar, R., Selberherr, S., Filipovic, L.: Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices Sensors, 19 (2019), 2; 374-1 - 374-14. https://doi.org/10.3390/s19020374

16.		Filipovic, L., Selberherr, S.: Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors Materials (invited), 12 (2019), 15; 2410-1 - 2410-37. https://doi.org/10.3390/ma12152410

15.		Lahlalia, A., Le Neel, O., Shankar, R., Kam, S.-Y., Filipovic, L.: Electro-Thermal Simulation & Characterization of a Microheater for SMO Gas Sensors Journal Of Microelectromechanical Systems, 27 (2018), 3; 529 - 537. https://doi.org/10.1109/JMEMS.2018.2822942

14.		Lahlalia, A., Filipovic, L., Selberherr, S.: Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices IEEE Sensors Journal, 18 (2018), 5; 1960 - 1970. https://doi.org/10.1109/JSEN.2018.2790001

13.		Klemenschits, X., Selberherr, S., Filipovic, L.: Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review Micromachines (invited), 9 (2018), 12; 631-1 - 631-31. https://doi.org/10.3390/mi9120631

12.		Filipovic, L., Lahlalia, A.: Review-System-on-Chip SMO Gas Sensor Integration in Advanced CMOS Technology Journal of the Electrochemical Society, 165 (2018), 16; 862 - 879. https://doi.org/10.1149/2.0731816jes

11.		Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S.: Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures using One-Dimensional Radiosity Solid-State Electronics (invited), 128 (2017), 2; 141 - 147. https://doi.org/10.1016/j.sse.2016.10.029

10.		Filipovic, L., Selberherr, S.: Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology IEEE Transactions on Device and Materials Reliability, 16 (2016), 4; 483 - 495. https://doi.org/10.1109/TDMR.2016.2625461

9.		Filipovic, L., Selberherr, S.: Stress in Three-Dimensionally Integrated Sensor Systems Microelectronics Reliability, 61 (2016), 3 - 10. https://doi.org/10.1016/j.microrel.2015.09.013

8.		Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., Orio, R., Selberherr, S.: Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias Microelectronic Engineering, 137 (2015), 141 - 145. https://doi.org/10.1016/j.mee.2014.11.014

7.		Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., Selberherr, S.: Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Microelectronics Reliability, 55 (2015), 9-10; 1843 - 1848. https://doi.org/10.1016/j.microrel.2015.06.014

6.		Filipovic, L., Selberherr, S.: Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors Sensors, 15 (2015), 4; 7206 - 7227. https://doi.org/10.3390/s150407206

5.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Seinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F.: Methods of Simulating Thin Film Deposition Using Spray Pyrolysis Techniques Microelectronic Engineering, 117 (2014), 57 - 66. https://doi.org/10.1016/j.mee.2013.12.025

4.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W.: Modeling the Growth of Tin Dioxide using Spray Pyrolysis Deposition for Gas Sensor Applications IEEE Transactions on Semiconductor Manufacturing, 27 (2014), 2; 269 - 277. https://doi.org/10.1109/TSM.2014.2298883

3.		Filipovic, L., Selberherr, S.: The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Microelectronics Reliability, 54 (2014), 9-10; 1953 - 1958. https://doi.org/10.1016/j.microrel.2014.07.014

2.		Filipovic, L., Selberherr, S.: A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework Microelectronic Engineering, 107 (2013), 23 - 32. https://doi.org/10.1016/j.mee.2013.02.083

1.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Seinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W.: A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework Engineering Letters (invited), 21 (2013), 4; 224 - 240.

Contributions to Books

13.		Filipovic, L., Selberherr, S.: Electro-Thermo-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors in: "Prime Archives in Material Science", 3; M. Khan (Eds.); Vide Leaf, 2021, (invited), ISBN: 978-81-953047-9-0, 1 - 38.

12.		Reiter, T., Klemenschits, X., Filipovic, L.: Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory in: "Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", B. Cretu (Eds.); IEEE, 2021, ISBN: 978-1-6654-3745-5, 1 - 4. https://doi.org/10.1109/EuroSOI-ULIS53016.2021.9560693

11.		Coppeta, R., Lahlalia, A., Kozic, D., Hammer, R., Riedler, J., Toschkoff, G., Singulani, A.P., Ali, Z., Sagmeister, M., Carniello, S., Selberherr, S., Filipovic, L.: Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates in: "Sensor Systems Simulations", W. van Driel, O. Pyper, C. Schumann (Eds.); Springer International Publishing, 2020, ISBN: 978-3-030-16577-2, 17 - 72. https://doi.org/10.1007/978-3-030-16577-2_2

10.		Gnam, L., Manstetten, P., Hössinger, A., Selberherr, S., Weinbub, J. (2019). Accelerating Flux Calculations Using Sparse Sampling. In L. Filipovic, T. Grasser (Eds.), Miniaturized Transistors (pp. 176–192). MDPI. (reposiTUm)

9.		Klemenschits, X., Selberherr, S., Filipovic, L.: Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review in: "Miniaturized Transistors", L. Filipovic, T. Grasser (Eds.); MDPI, 2019, (invited), ISBN: 978-3-03921-010-7, 105 - 135. https://doi.org/10.3390/books978-3-03921-011-4

8.		Filipovic, L., Lahlalia, A.: System-on-Chip Sensor Integration in Advanced CMOS Technology in: "Advanced CMOS-Compatible Semiconductor Devices 18, Vol. 85, No. 8", J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen, A. Yoshino (Eds.); issued by: The Electrochemical Society; ECS Transactions, 2018, (invited), ISBN: 978-1-62332-488-9, 151 - 162. https://doi.org/10.1149/08508.0151ecst

7.		Klemenschits, X., Selberherr, S., Filipovic, L.: Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries in: "Proceedings of the 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", F. Gamiz, V. Sverdlov, C. Sampedro, L. Donetti (Eds.); IEEE, 2018, ISBN: 978-1-5386-4812-4, 177 - 180. https://doi.org/10.1109/ULIS.2018.8354763

6.		Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S.: Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes in: "Proceedings of the 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", V. Sverdlov, S. Selberherr (Eds.); IEEE, 2016, ISBN: 978-1-4673-8608-1, 120 - 123. https://doi.org/10.1109/ULIS.2016.7440067

5.		Filipovic, L., Selberherr, S.: Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors in: "Advanced CMOS-Compatible Semiconductor Devices 17, Vol.66, No.5", Y. Omura, J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen (Eds.); issued by: The Electrochemical Society; ECS Transactions, 2015, ISBN: 978-1-62332-238-0, 243 - 250. https://doi.org/10.1149/06605.0243ecst

4.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W.: Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors in: "Transactions on Engineering Technologies", G.-C. Yang, S.-L. Ao, L. Gelman (Eds.); Springer, 2014, ISBN: 978-94-017-8831-1, 295 - 310. https://doi.org/10.1007/978-94-017-8832-8_22

3.		Filipovic, L., Selberherr, S.: A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy in: "Large-Scale Scientific Computing, Lecture Notes in Computer Science", 7116; I. Lirkov, S. Margenov, J. Wasniewski (Eds.); Springer Berlin Heidelberg, 2012, ISBN: 978-3-642-29842-4, 447 - 454. https://doi.org/10.1007/978-3-642-29843-1_50

2.		Filipovic, L., Selberherr, S.: A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator in: "Monte Carlo Methods and Applications", K. K. Sabelfeld, I. Dimov (Eds.); De Gruyter, 2012, ISBN: 978-3-11-029347-0, 97 - 104. https://doi.org/10.1515/9783110293586.97

1.		Weinbub, J., Rupp, K., Filipovic, L., Makarov, A., Selberherr, S.: Towards a Free Open Source Process and Device Simulation Framework in: "The 15th International Workshop on Computational Electronics (IWCE)", IEEE Xplore, 2012, ISBN: 978-1-4673-0705-5, 1 - 4. https://doi.org/10.1109/IWCE.2012.6242867

Talks and Poster Presentations (with Proceedings-Entry)

95.		Kostal, R., Reiter, T., Filipovic, L. (2025). A New Module for Automated Optimization of Process TCAD Model Parameters. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11186325 (reposiTUm)

94.		Gull, J., Filipovic, L., Kosina, H. (2025). Accurate Carrier Dynamics for a Kane Dispersion Relation. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11185959 (reposiTUm)

93.		Fu, Y., Shao, H., Xia, L., Ge, R., Bai, L., He, X., Junjie Li, Chen, R., Wei, Y., Li, L., Filipovic, L. (2025). Atomic-Level Monte Carlo Modeling of SiN Deposition by PECVD. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11186393 (reposiTUm)

92.		Yuki, O., Stella, R., Filipovic, L. (2025). Development of a Gaussian Approximation Potential for Gan With Point Defects and Mg Impurities. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11185965 (reposiTUm)

91.		Filipovic, L. (2025). From Atoms to Reactors: Multi-Scale Modeling for Semiconductor Fabrication. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11186356 (reposiTUm)

90.		Reiter, T., Manstetten, P., Filipovic, L. (2025). GPU-based Monte Carlo Ray Tracing for Flux Calculation in Process Simulation. In IWCN International Workshop on Computational Nanotechnology : Book of Abstracts, Salt Lake City, United States. (reposiTUm)

89.		Stella, R., Leroch, S., Reiter, T., Hössinger, A., Filipovic, L. (2025). Physics-Based Multi-Scale Modeling of Angled Reactive Ion Etching. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11186317 (reposiTUm)

88.		Hu, Z., Junjie Li, Shao, H., Chen, R., Filipovic, L., Li, L. (2025). Physics-Informed Bayesian Optimization Framework for Etching Rate and Surface Roughness Co-Optimization. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11185960 (reposiTUm)

87.		Reiter, T., Toifl, A., Hossinger, A., Filipovic, L. (2025). Simulation of a Polymer-Free Drie Process Using SF₆/O₂ Plasma Etching. In 2025 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), Grenoble, France. https://doi.org/10.1109/SISPAD66650.2025.11186394 (reposiTUm)

86.		Filipovic, L., Baranowski, I., Faber, T., Nedjalkov, M., Koster, L., Vasileska, D., Goodnick, S. (2025). Theoretical Insights Into Next-Generation Hot Carrier Solar Cells. In 2025 Photonics North (PN) (pp. 1–2), Ottawa, Canada. https://doi.org/10.1109/PN66844.2025.11097145 (reposiTUm)

85.		Stella, R., Leroch, S., Hössinger, A., Waldhör, D., Filipovic, L. (2024). Atomistic Study of 4h-SiC Using Ab Initio and Machine Learning Techniques. In PRiME 2024 October 6, 2024 - October 11, 2024 Honolulu, USA, Honolulu, HI, United States. https://doi.org/10.1149/MA2024-02201801mtgabs (reposiTUm)

84.		Bamer, B., Leroch, S., Hossinger, A., Filipovic, L. (2024). Cluster-Based Semi-Empirical Model for Dopant Activation in Silicon Carbide. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10732978 (reposiTUm)

83.		Bamer, B., Hoessinger, A., Filipovic, L. (2024). Cluster-Based Model for Dopant Activation in SiC. In MESS24: Microelectronic Systems Symposium (p. 47), Vienna, Austria. (reposiTUm)

82.		Bamer, B., Leroch, S., Hoessinger, A., Filipovic, L. (2024). Cluster-Based Multivariate Spline Model for Dopant Activation in SiC. In AMaSiS 2024: Applied Mathematics and Simulation for Semiconductor Devices (p. 20), Berlin, Germany. (reposiTUm)

81.		Filipovic, L. (2024). Efficient Multi-Scale Modeling of Semiconductor Device Fabrication. In The 5th International Congress on Advanced Materials Sciences and Engineering: Abstract Book (p. 40), Lovran, Croatia. (reposiTUm)

80.		Gull, J., Filipovic, L., Kosina, H. (2024). Electron-Electron Scattering in Non-Parabolic Transport Models. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10733120 (reposiTUm)

79.		Filipovic, L., Reiter, T., Piso, J., Kostal, R. (2024). Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching Model. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10733099 (reposiTUm)

78.		Reiter, T., Toifl, A., Kong, S., Hoessinger, A., Filipovic, L. (2024). Impact of Ion Energy and Yield in Oblique Ion Beam Etching Process for Blazed Gratings. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10733316 (reposiTUm)

77.		Leroch, S., Stella, R., Hössinger, A., Filipovic, L. (2024). MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4h-SiC. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10733052 (reposiTUm)

76.		Filipovic, L. (2024). Merging Reactor and Feature Scales for Plasma Etch Modeling. In IEEE NANO 2024 Book of Abstracts (p. 120), Gijon, Spain. (reposiTUm)

75.		Hu, Z., Filipovic, L., Li, J., Wang, L., Wu, Z., Chen, R., Wei, Y., Li, L. (2024). Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETs. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4), San Jose, CA, United States. https://doi.org/10.1109/SISPAD62626.2024.10733200 (reposiTUm)

74.		Filipovic, L. (2024). Modeling and Simulation of ALD in a Level Set Framework. In EFDS: Program Booklet: ALD for Industry (p. 24), Dresden, Germany. (reposiTUm)

73.		Filipovic, L., Reiter, T. (2024). Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl₂/Ar Inductively Coupled Plasma. In SICT 2024, Plasma Tech 2024 and Tribology 2024 Joint International Conferences: Book of Abstracts (p. 67), Vienna, Austria. (reposiTUm)

72.		Filipovic, L., Bamer, B., Leroch, S., Reiter, T., Stella, R., Hoessinger, A. (2024). Multi-Scale Process TCAD for Advanced Semiconductor Fabrication. In MESS24: Microelectronic Systems Symposium (p. 37), Vienna, Austria. (reposiTUm)

71.		Lamprecht, D., Capin, M., Benzer, A., Längle, M., Mangler, C., Kotakoski, J., Filipovic, L. (2024). Room Temperature Gas Sensing Based on Substitutional Atom Doped MoS₂. In XXXVIth International Winterschool on Electronic Properties of Novel Materials: Molecular Nanostructures: Program (p. 31), Kirchberg, Austria. (reposiTUm)

70.		Filipovic, L., Reiter, T. (2024). Spline Interpolation-Based Multi-Scale Model for Etching in a Chlorine-Argon Inductively Coupled Plasma. In 2024 Winter Simulation Conference (WSC) (pp. 1907–1918), Orlando, FL, United States. https://doi.org/10.1109/WSC63780.2024.10838987 (reposiTUm)

69.		Filipovic, L., Lacerda de Orio, R. (2023). Electromigration Reliability of Buried Power Rails in Vertically Stacked Devices. In 2023 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–6), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW59383.2023.10477689 (reposiTUm)

68.		Reiter, T., Filipovic, L. (2023). Fast 3D Flux Calculation Using Monte Carlo Ray Tracing on GPUs. In Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT '2023)) (pp. 67–72), Funchal, Portugal. https://doi.org/10.13140/RG.2.2.13265.71524 (reposiTUm)

67.		Reiter, T., Toifl, A., Hössinger, A., Filipovic, L. (2023). Modeling Oxide Regrowth During Selective Etching in Vertical 3D NAND Structures. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 85–88), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319506 (reposiTUm)

66.		Leroch, S., Stella, R., Hössinger, A., Filipovic, L. (2023). Molecular Dynamics Study of Al Implantation in 4h-SiC. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 185–188), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319554 (reposiTUm)

65.		Filipovic, L., Bobinac, J., Piso, J., Reiter, T. (2023). Physics-Informed Compact Model for SF6/O2 Plasma Etching. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 73–76), Kobe, Japan. https://doi.org/10.23919/SISPAD57422.2023.10319479 (reposiTUm)

64.		Filipovic, L., Reiter, T., Klemenschits, X., Leroch, S., Stella, R., Baumgartner, O., Hössinger, A. (2023). Process Simulation in Micro- And Nano-Electronics. In Book of abstracts of the International Workshop on Computational Nanotechnology 2023 (pp. 38–39), Barcelona, Spain. (reposiTUm)

63.		Filipovic, L., Baumgartner, O., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., Karner, M.: "DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022), Granada, Spain; 2022-09-06 - 2022-09-08; in: "SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet", (2022), 34 - 35.

62.		Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., Filipovic, L.: "Impact of Mask Tapering on SF6/O2 Plasma Etching"; Talk: Fourth International Conference on Microelectronic Devices and Technologies (MicDAT '2022), Corfu, Greece; 2022-09-21 - 2022-09-23; in: "Microelectronic Devices and Technologies: Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT '2022)", (2022), ISBN: 978-84-09-43856-3; 90 - 94.

61.		Aguinsky, L.F., Rodrigues, F., Klemenschits, X., Filipovic, L., Hössinger, A., Weinbub, J.: "Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022), Granada, Spain; 2022-09-06 - 2022-09-08; in: "SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet", (2022), 40 - 41.

60.		Reiter, T., Klemenschits, X., Filipovic, L. (2022). Modeling Plasma-Induced Damage During the Dry Etching of Silicon. In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–5), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW56459.2022.10032764 (reposiTUm)

59.		Filipovic, L. (2022). Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors. In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–6), South Lake Tahoe, CA, United States. https://doi.org/10.1109/IIRW56459.2022.10032744 (reposiTUm)

58.		Gollner, L., Steiner, R., Filipovic, L.: "Study of Phonon-limited Electron Transport in Monolayer MoS2"; Talk: Fourth International Conference on Microelectronic Devices and Technologies (MicDAT '2022), Corfu, Greece; 2022-09-21 - 2022-09-23; in: "Microelectronic Devices and Technologies Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT 2022)", (2022), ISBN: 978-84-09-43856-3; 74 - 78.

57.		Klemenschits, X., Selberherr, S., Filipovic, L.: Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 - 2021-09-29; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2021), 23 - 27. https://doi.org/10.1109/SISPAD54002.2021.9592605

56.		Filipovic, L., Klemenschits, X.: Fast Model for Deposition in Trenches using Geometric Advection Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, Texas (USA); 2021-09-27 - 2021-09-29; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2021), 224 - 228. https://doi.org/10.1109/SISPAD54002.2021.9592595

55.		Filipovic, L., Selberherr, S.: Gas Sensing with Two-Dimensional Materials Beyond Graphene Talk: International Conference on Microelectronics (MIEL), Nis, Serbia (invited); 2021-09-12 - 2021-09-14; in: "Proceedings of the International Conference on Microelectronics (MIEL)", (2021), ISBN: 978-1-6654-4526-9; 29 - 36. https://doi.org/10.1109/MIEL52794.2021.9569088

54.		Reiter, T., Klemenschits, X., Filipovic, L.: Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory Poster: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 - 2021-09-03; in: "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2021), 34 - 35.

53.		Filipovic, L.: Modeling and Simulation of ALD in a Level Set Framework Talk: EFDS Workshop on Simulation for ALD, virtual (invited); 2021-03-25; in: "Proceedings of the EFDS Workshop on Simulation for ALD", (2021), 9.

52.		Filipovic, L.: "Reliability and Stability of MEMS Microheaters for Gas Sensors"; Talk: IEEE International Integrated Reliability Workshop (IIRW), online (invited); 2021-10-04 - 2021-10-28; in: "2021 IEEE International Integrated Reliability Workshop (IIRW)", (2021), ISBN: 978-1-6654-1794-5. https://doi.org/10.1109/IIRW53245.2021.9635162

51.		Filipovic, L.: Electromigration Model for Platinum Hotplates Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 - 2020-10-06; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2020), 315 - 318. https://doi.org/10.23919/SISPAD49475.2020.9241645

50.		Klemenschits, X., Selberherr, S., Filipovic, L.: Geometric Advection Algorithm for Process Emulation Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kobe, Japan - virtual; 2020-09-23 - 2020-10-06; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2020), 59 - 62. https://doi.org/10.23919/SISPAD49475.2020.9241678

49.		Filipovic, L., Selberherr, S.: Granularity Effects in Electromigration Talk: IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica (invited); 2020-02-25 - 2020-02-28; in: "Proceedings of the IEEE Latin America Electron Devices Conference (LAEDC)", (2020), ISBN: 978-1-7281-1044-8. https://doi.org/10.1109/LAEDC49063.2020.9072963

48.		Filipovic, L., Selberherr, S.: Integration of Gas Sensors with CMOS Technology Talk: IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Penang, Malaysia - virtual (invited); 2020-03-16 - 2020-03-18; in: "Proceedings of the IEEE Electron Devices Technology and Manufacturing Conference (EDTM)", (2020), ISBN: 978-1-7281-2539-8; 294 - 297. https://doi.org/10.1109/EDTM47692.2020.9117828

47.		Selberherr, S., Filipovic, L.: CMOS Compatible Gas Sensors Talk: International Conference on Materials Science and Engineering, San Francisco, CA, USA (invited); 2019-02-18 - 2019-02-20; in: "Book of Abstracts of the International Conference on Materials Science and Engineering", (2019), 1 pages.

46.		Filipovic, L., Selberherr, S.: CMOS-Compatible Gas Sensors Talk: International Conference on Microelectronics (MIEL), Nis, Serbia (invited); 2019-09-16 - 2019-09-18; in: "Proceedings of the International Conference on Microelectronics (MIEL)", (2019), 9 - 16. https://doi.org/10.1109/MIEL.2019.8889585

45.		Filipovic, L., Orio, R.: Electromigration in Nano-Interconnects Talk: Workshop on High Performance TCAD (WHPTCAD), Chicago, IL, USA (invited); 2019-05-24 - 2019-05-25; in: "Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD)", (2019), 2.

44.		Klemenschits, X., Selberherr, S., Filipovic, L.: Fast Volume Evaluation on Sparse Level Sets Poster: International Workshop on Computational Nanotechnology (IWCN), Chicago, IL, USA; 2019-05-20 - 2019-05-24; in: "Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN)", (2019), ISBN: 978-3-9504738-0-3; 113 - 114.

43.		Filipovic, L.: Modeling and Simulation of Atomic Layer Deposition Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 - 2019-09-06; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2019), ISBN: 978-1-7281-0938-1; 323 - 326. https://doi.org/10.1109/SISPAD.2019.8870462

42.		Klemenschits, X., Manstetten, P., Filipovic, L., Selberherr, S.: Process Simulation in the Browser: Porting ViennaTS using WebAssembly Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy; 2019-09-04 - 2019-09-06; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2019), ISBN: 978-1-7281-0938-1; 339 - 342. https://doi.org/10.1109/SISPAD.2019.8870374

41.		Filipovic, L.: CMOS-Compatible Semiconductor-Based Gas Sensors Talk: Emerging Technologies Communication Microsystems Optoelectronics Sensing (ETCMOS), Whistler, British Columbia, Canada (invited); 2018-05-09 - 2018-05-11; in: "Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors", (2018).

40.		Lahlalia, A., Le Neel, O., Shankar, R., Selberherr, S., Filipovic, L.: Enhanced Sensing Performance of Integrated Gas Sensor Devices Poster: EUROSENSORS, Graz, Austria; 2018-09-09 - 2018-09-12; in: "Proceedings of EUROSENSORS 2018", (2018), ISBN: 978-3-00-025217-4; Paper ID 1508, 5 pages. https://doi.org/10.3390/proceedings2131508

39.		Filipovic, L., Orio, R.: Modeling the Influence of Grains and Material Interfaces on Electromigration Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, Texas, USA; 2018-09-24 - 2018-09-26; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2018), ISBN: 978-1-5386-6788-0; 83 - 87. https://doi.org/10.1109/SISPAD.2018.8551746

38.		Filipovic, L., Lahlalia, A., Selberherr, S.: System-on-Chip Sensor Integration in Advanced CMOS Technology Talk: 233^rd ECS Meeting (ECS), Seattle, Washington, USA (invited); 2018-05-13 - 2018-05-17; in: "Proceedings of the 233^rd ECS Meeting (ECS)", (2018), ISSN: 2151-2043.

37.		Klemenschits, X., Selberherr, S., Filipovic, L.: Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries Poster: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Granada, Spain; 2018-03-19 - 2018-03-21; in: "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2018), ISBN: 978-1-5386-4810-0; 65 - 66.

36.		Filipovic, L., de Orio, R.L., Zisser, W. H., Selberherr, S.: Modeling Electromigration in Nanoscaled Copper Interconnects Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan; 2017-09-07 - 2017-09-09; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2017), ISBN: 978-4-86348-612-6; 161 - 164. https://doi.org/10.23919/SISPAD.2017.8085289

35.		Cervenka, J., Filipovic, L.: Numerical Aspects of the Deterministic Solution of the Wigner Equation Poster: International Wigner Workshop (IW2), Low Wood Bay, Lake District, UK; 2017-06-05; in: "Book of Abstracts of the International Wigner Workshop (IW2)", Institute for Microelectronics, TU Wien, (2017), ISBN: 978-3-200-05129-4; 42 - 43.

34.		Filipovic, L., Selberherr, S.: Effects of the Deposition Process Variation on the Performance of Open TSVs Poster: IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA; 2016-05-31 - 2016-06-03; in: "Proceedings of IEEE Electronic Components and Technology Conference (ECTC)", (2016), ISBN: 978-1-5090-1204-6; 2188 - 2195. https://doi.org/10.1109/ECTC.2016.177

33.		Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., Selberherr, S.: Impact of Across-Wafer Variation on the Electrical Performance of TSVs Talk: IEEE International Interconnect Technology Conference (IITC), San Jose, CA, USA; 2016-05-23 - 2016-05-26; in: "Proceedings of the IEEE International Interconnect Technology Conference (IITC)", (2016), ISBN: 978-1-5090-0386-0; 130 - 132. https://doi.org/10.1109/IITC-AMC.2016.7507707

32.		Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S.: Modeling Neutral Particle Flux in High Aspect Ratio Holes using a One-Dimensional Radiosity Approach Talk: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Wien; 2016-01-25 - 2016-01-27; in: "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2016), ISBN: 978-3-901578-29-8; 68 - 69.

31.		Filipovic, L., Selberherr, S.: Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors Talk: World Congress of Smart Materials (WCSM), Singapore (invited); 2016-03-04 - 2016-03-06; in: "Proceedings of the BIT's 2nd Annual World Congress of Smart Materials 2016", (2016), 517.

30.		Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., Selberherr, S.: Using One-Dimensional Radiosity to Model Neutral Flux in Convex High Aspect Ratio Structures Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nürnberg, Deutschland; 2016-09-06 - 2016-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2016), ISBN: 978-1-5090-0817-9; 265 - 268. https://doi.org/10.1109/SISPAD.2016.7605198

29.		Roger, F., Singulani, A. P., Carniello, S., Filipovic, L., Selberherr, S.: Global Statistical Methodology for the Analysis of Equipment Parameter Effects on TSV Formation Talk: International Workshop on CMOS Variability (VARI), Salvador, Brazil; 2015-09-01 - 2015-09-04; in: "Proceedings of the 6^th International Workshop on CMOS Variability (VARI)", (2015), ISBN: 978-1-5090-0071-5; 39 - 44. https://doi.org/10.1109/VARI.2015.7456561

28.		Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., Selberherr, S.: Intrinsic Stress Analysis of Tungsten-Lined Open TSVs Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Toulouse, France; 2015-10-05 - 2015-10-09; in: "Abstracts of the 26^th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis", (2015), 71.

27.		Filipovic, L., Selberherr, S.: Kinetics of Droplet Motion During Spray Pyrolysis Talk: Energy-Materials-Nanotechnology Meeting on Droplets (EMN), Phuket, Thailand (invited); 2015-05-08 - 2015-05-11; in: "Abstracts of the Energy-Materials-Nanotechnology Meeting on Droplets (EMN)", (2015), 127 - 128.

26.		Filipovic, L., Selberherr, S.: Processing of Integrated Gas Sensor Devices Talk: IEEE International Technical Conference of IEEE Region 10 (TENCON), Macau, China (invited); 2015-11-01 - 2015-11-04; in: "Proceedings of the IEEE International Technical Conference of IEEE Region 10 (TENCON)", (2015), ISBN: 978-1-4799-8639-2; 6 pages. https://doi.org/10.1109/TENCON.2015.7372781

25.		Filipovic, L., Selberherr, S.: Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors Talk: Meeting of the Electrochemical Society (ECS), Chicago, Illinois, USA; 2015-05-24 - 2015-05-28; in: "Proceedings of the 227th ECS Meeting (ECS)", ECS Transactions, 67 (2015), ISSN: 1938-6737; 2 pages.

24.		Filipovic, L., Selberherr, S.: Stress in Three-Dimensionally Integrated Sensor Systems Talk: International Conference on Materials for Advanced Technologies(ICMAT), Singapore (invited); 2015-06-28 - 2015-07-03; in: "Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT)", (2015), 342.

23.		Filipovic, L., Selberherr, S.: About Processes and Performance of Integrated Gas Sensor Components Talk: Energy-Materials-Nanotechnology Fall Meeting (EMN), Orlando, USA (invited); 2014-11-22 - 2014-11-25; in: "Abstracts of the Energy-Materials-Nanotechnology Fall Meeting (EMN)", (2014), 96 - 97.

22.		Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., Orio, R., Selberherr, S.: Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAs Talk: European Workshop on Materials for Advanced Metallization (MAM), Chemnitz, Germany; 2014-03-02 - 2014-03-05; in: "Book of Abstracts", (2014), 2 pages.

21.		Filipovic, L., Orio, R., Selberherr, S., Singulani, A. P., Roger, F., Minixhofer, R.: Effects of Sidewall Scallops on Open Tungsten TSVs Talk: International Reliability Physics Symposium (IRPS), Waikoloa, Hawaii, USA; 2014-06-01 - 2014-06-05; in: "Proceedings of the International Reliability Physics Symposium (IRPS)", (2014), ISBN: 978-1-4799-3317-4; 3E.3.1 - 3E.3.6. https://doi.org/10.1109/IRPS.2014.6860633

20.		Filipovic, L., Orio, R., Selberherr, S.: Effects of Sidewall Scallops on the Performance and Reliability of Filled Copper and Open Tungsten TSVs Talk: IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Singapore; 2014-06-30 - 2014-07-04; in: "Proceedings of the 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits", (2014), ISBN: 978-1-4799-3931-2; 321 - 326. https://doi.org/10.1109/IPFA.2014.6898137

19.		Filipovic, L., Orio, R., Selberherr, S.: Process and Performance of Copper TSVs Talk: Workshop of the Thematic Network on Silicon On Insulator Technology, Devices and Circuits (EUROSOI), Tarragona, Spain; 2014-01-27 - 2014-01-29; in: "Conference Proceedings of the Tenth Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits", (2014), 1 - 2.

18.		Filipovic, L., Orio, R., Selberherr, S.: Process and Reliability of SF6/O2 Plasma Etched Copper TSVs Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium; 2014-04-07 - 2014-04-09; in: "Proceedings of the IEEE 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)", (2014), ISBN: 978-1-4799-4791-1; 4 pages. https://doi.org/10.1109/EuroSimE.2014.6813768

17.		Filipovic, L., Selberherr, S.: Spray Pyrolysis Deposition for Gas Sensor Integration in the Backend of Standard CMOS Processes Talk: International Conference on Solid State and Integrated Circuit Technology (ICSICT), Guilin, China (invited); 2014-10-28 - 2014-10-31; in: "Proc.Intl.Conf.on Solid-State and Integrated Circuit Technology (ICSICT)", (2014), ISBN: 978-1-4799-3282-5; 1692 - 1695. https://doi.org/10.1109/ICSICT.2014.7021507

16.		Filipovic, L., Selberherr, S.: Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology Talk: International Workshop on Stress-Induced Phenomena in Microelectronics, Austin, TX, USA; 2014-10-15 - 2014-10-17; in: "Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics", (2014), 46.

15.		Filipovic, L., Selberherr, S.: The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias Talk: European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF), Berlin, Germany; 2014-09-29 - 2014-10-02; in: "Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)", (2014), 36.

14.		Filipovic, L., Rudolf, F., Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Singulani, A. P., Minixhofer, R., Selberherr, S.: Three-Dimensional Simulation for the Reliability and Electrical Performance of Through-Silicon Vias Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan; 2014-09-09 - 2014-09-11; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2014), ISBN: 978-1-4799-5285-4; 341 - 344. https://doi.org/10.1109/SISPAD.2014.6931633

13.		Singulani, A. P., Ceric, H., Filipovic, L., Langer, E.: Impact of Bosch Scallops Dimensions on Stress of an Open Through Silicon Via Technology Talk: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland; 2013-04-14 - 2013-04-17; in: "Proceedings of the IEEE 14th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EurSimE)", (2013), ISBN: 978-1-4673-6137-8; 6 pages. https://doi.org/10.1109/EuroSimE.2013.6529938

12.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F.: Modeling Spray Pyrolysis Deposition Talk: World Congress on Engineering (WCE), London, UK; 2013-07-03 - 2013-07-05; in: "Proceedings of the World Congress on Engineering (WCE) Vol II", (2013), ISBN: 978-988-19252-8-2; 987 - 992.

11.		Filipovic, L., Selberherr, S., Mutinati, G., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., Grogger, W.: Modeling the Growth of Thin SnO2 Films using Spray Pyrolysis Deposition Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, Scotland, United Kingdom; 2013-09-03 - 2013-09-05; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2013), ISBN: 978-1-4673-5733-3; 208 - 211. https://doi.org/10.1109/SISPAD.2013.6650611

10.		Filipovic, L., Selberherr, S.: Electric Field Based Simulations of Local Oxidation Nanolithography using Atomic Force Microscopy in a Level Set Environment Talk: Intl. Symposium on Microelectronics Technology and Devices (SBMicro), Brasilia, Brazil; 2012-08-30 - 2012-09-02; in: "ECS Transactions", 49, 1 (2012), ISBN: 978-1-56677-990-6; 265 - 272. https://doi.org/10.1149/04901.0265ecst

9.		Filipovic, L., Selberherr, S.: Simulation of Silicon Nanopatterning Using nc-AFM Poster: International Conference on non-contact Atomic Force Microscopy, Cesky Krumlov; 2012-07-01 - 2012-07-05; in: "Abstracts 15th International Conference on non-contact Atomic Force Microscopy (nc-AFM)", (2012), 108.

8.		Filipovic, L., Selberherr, S.: Simulations of Local Oxidation Nanolithography by AFM Based on the Generated Electric Field Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Denver, CO, USA; 2012-09-05 - 2012-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2012), ISBN: 978-0-615-71756-2; 189 - 192.

7.		Weinbub, J., Rupp, K., Filipovic, L., Makarov, A., Selberherr, S.: Towards a Free Open Source Process and Device Simulation Framework Poster: International Workshop on Computational Electronics (IWCE), Madison, WI, USA; 2012-05-22 - 2012-05-25; in: "Book of Abstracts of the International Workshop on Computational Electronics (IWCE)", (2012), 141 - 142.

6.		Filipovic, L., Selberherr, S.: A Level Set Simulator for Nanooxidation using Non-Contact Atomic Force Microscopy Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Osaka, Japan; 2011-09-08 - 2011-09-10; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2011), ISBN: 978-1-61284-418-3; 307 - 310. https://doi.org/10.1109/SISPAD.2011.6035031

5.		Filipovic, L., Nedjalkov, M., Selberherr, S.: A Monte Carlo Simulator for Non-Contact Atomic Force Microscopy Talk: International Conference on Large-Scale Scientific Computations (LSSC), Sozopol, Bulgaria; 2011-06-06 - 2011-06-10; in: "Abstracts Intl. Conf. on Large-Scale Scientific Computations", (2011), 42 - 43.

4.		Filipovic, L., Ceric, H., Cervenka, J., Selberherr, S.: A Simulator for Local Anodic Oxidation of Silicon Surfaces Talk: IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Niagara Falls, Canada; 2011-05-08 - 2011-05-11; in: "Proceedings of the 24th Canadian Conference on Electrical and Computer Engineering (CCECE 2011)", (2011), ISBN: 978-1-4244-9789-8; 695 - 698. https://doi.org/10.1109/CCECE.2011.6030543

3.		Filipovic, L., Selberherr, S.: A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator Talk: Seminar on Monte Carlo Methods (MCM), Borovets; 2011-08-29 - 2011-09-02; in: "Abstracts IMACS Seminar on Monte Carlo Methods (MCM)", (2011), 30.

2.		Filipovic, L., Ertl, O., Selberherr, S.: Parallelization Strategy for Hierarchical Run Length Encoded Data Structures Talk: IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011), Innsbruck; 2011-02-15 - 2011-02-17; in: "Proceedings of the IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011)", (2011), ISBN: 978-0-88986-864-9; 131 - 138. https://doi.org/10.2316/P.2011.719-045

1.		Ertl, O., Filipovic, L., Selberherr, S.: Three-Dimensional Simulation of Focused Ion Beam Processing Using the Level Set Method Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Bologna, Italy; 2010-09-06 - 2010-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2010), ISBN: 978-1-4244-7700-5; 49 - 52. https://doi.org/10.1109/SISPAD.2010.5604573

Talks and Poster Presentations (without Proceedings-Entry)

5.		Kostal, R., Reiter, T., Manstetten, P., Filipovic, L. (2025, June 26). Novel Approaches to Objective Function Design for Optimizing Process TCAD Model Parameters [Poster Presentation]. 24th Conference on “Insulating Films on Semiconductors” (INFOS 2025), Granada, Spain. (reposiTUm)

4.		Filipovic, L. (2022). A Broadly-Applicable Ensemble Monte Carlo Framework. Workshop Monte Carlo Simulation: Beyond Moore’s Law, 2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain. (reposiTUm)

3.		Filipovic, L. (2022, September 5). ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework Workshop WS1 - Monte Carlo Simulation: Beyond Moore’s LAW 2022, Granada, Spain. (reposiTUm)

2.		Filipovic, L., Kampl, M., Knobloch, T., Rzepa, G., Weinbub, J.: "Ihr Smartphone - Ein Supercomputer vor 20 Jahren. Ein Einblick in die Mikro- und Nanoelektronik (mit Virtual Reality)"; Talk: Lange Nacht der Forschung 2018, Wien; 2018-04-13.

1.		Ullmann, B., Grill, A., Manstetten, P., Jech, M., Kampl, M., Zisser, W. H., Filipovic, L., Thesberg, M., Rudolf, F., Windbacher, T., Cervenka, J., Katterbauer, M., Weinbub, J.: "Ihr Smartphone - ein Supercomputer vor 20 Jahren. Ein Einblick in die Mikro- und Nanoelektronik"; Talk: Lange Nacht der Forschung 2016, Wien; 2016-04-22.

Habilitation Theses

1.		Filipovic, L.: "Semiconductor Based Integrated Sensors"; TU Wien, Fakultät für Elektrotechnik und Informationstechnik, 2020.

Doctor's Theses (authored and supervised)

2.		Klemenschits, X.: Emulation and Simulation of Microelectronic Fabrication Processes Supervisor, Reviewer: L. Filipovic, A. Erdmann, H. Pottmann; Institut für Mikroelektronik, 2022; oral examination: 2022-04-08.

1.		Filipovic, L.: Topography Simulation of Novel Processing Techniques Supervisor, Reviewer: S. Selberherr, D. Vasileska; Institut für Mikroelektronik, 2012; oral examination: 2012-12-17.

Diploma and Master Theses (authored and supervised)

12.		Stella, R. (2026). Atomistic Description of 4h-SiC Using Molecular Dynamics With Quantum Mechanical Accuracy Technische Universität Wien. https://doi.org/10.34726/hss.2026.134901 (reposiTUm)

11.		Riedel, X. (2026). GPU-accelerated Ray-Tracing for Particle Simulations in ViennaPS Technische Universität Wien. https://doi.org/10.34726/hss.2026.138751 (reposiTUm)

10.		Strasser, F. (2025). Numerical Modeling of Diffusion and FDTD Wave Propagation in Semiconductor Devices Technische Universität Wien. https://doi.org/10.34726/hss.2025.135643 (reposiTUm)

9.		Mond, F. (2024). A Distributed Forest of Octrees Datastructure for Particle Wigner Simulations Technische Universität Wien. https://doi.org/10.34726/hss.2024.113934 (reposiTUm)

8.		Rößl, T. (2024). FlowTutor: Programming Using Flowcharts Technische Universität Wien. https://doi.org/10.34726/hss.2024.95781 (reposiTUm)

7.		Haslhofer, P. (2024). Interpolation Methods and Position-Dependent Effective Mass for ViennaWD Technische Universität Wien. https://doi.org/10.34726/hss.2024.116820 (reposiTUm)

6.		Müller, D. (2024). Multi-Scale Modeling of the Multi Beam Mask Writer Writing Process Technische Universität Wien. https://doi.org/10.34726/hss.2024.113914 (reposiTUm)

5.		Skënderaj, E. (2023). Automated FEM Model Generation for the Simulation of Microheaters Technische Universität Wien. https://doi.org/10.34726/hss.2023.111425 (reposiTUm)

4.		Benzer, A. (2023). Density Functional Theory (DFT) Investigation of Novel Materials for Application in Sensing Technische Universität Wien. https://doi.org/10.34726/hss.2023.103762 (reposiTUm)

3.		Gollner, L. (2023). Development and Application of an Ensemble Monte Carlo Framework Technische Universität Wien. https://doi.org/10.34726/hss.2023.95902 (reposiTUm)

2.		Bobinac, J. (2023). Process Simulation and Model Development in ViennaPS Technische Universität Wien. https://doi.org/10.34726/hss.2023.95903 (reposiTUm)

1.		Balla, C. (2023). Tetrahedral Mesh Cleaving of Level Set Surfaces Technische Universität Wien. https://doi.org/10.34726/hss.2023.106905 (reposiTUm)