Bibliography

1

"GSM Europe," 2002.
http://www.gsmworld.com/gsmeurope/about.

2

B. Stroustrup, C++ Programming Language.
Addison-Wesley, 1997.

3

S. Halama, The Viennese Integrated System for Technology CAD Applications-Architecture and Critical Software Components.
Dissertation, Technische Universität Wien, 1994.
http://www.iue.tuwien.ac.at/phd/halama.

4

F. Fasching, The Viennese Integrated System for Technology CAD Applications-Data Level Design and Implementation.
Dissertation, Technische Universität Wien, 1994.
http://www.iue.tuwien.ac.at/phd/fasching.

5

F. Fasching, W. Tuppa, and S. Selberherr, "VISTA-The Data Level," IEEE Trans.Computer-Aided Design, vol. 13, no. 1, pp. 72-81, Jan. 1994.

6

S.G. Duvall, "An Interchange Format for Process and Device Simulation," IEEE Trans.Computer-Aided Design, vol. 7, no. 7, pp. 741-754, 1988.

7

G. Rieger, Ein graphischer Editor für Entwurf von Halbleiterbauteilen.
Dissertation, Technische Universität Wien, 1996.
http://www.iue.tuwien.ac.at/phd/rieger.

8

D. Kirkpatrick, "Optimal Search in Planar Subdivisions," SIAM J.Computing, vol. 12, no. 1, pp. 28-35, 1983.

9

F.P. Preparata and M.I. Shamos, Computational Geometry.
New York: Springer, 1985.

10

ISE, ISE TCAD Manuals vol. 6, release 4.
ISE Integrated Systems Engineering, 1997.

11

ISE, Integrated Systems Engineering.
http://www.ise.ch.

12

SYNOPSIS.
http://www.synopsys.com/products/avmrg/
product_flow/technology_cad.html.

13

Technology Modeling Associates, Inc., Sunnyvale, California, TMA TSUPREM-4, Two-Dimensional Process Simulation Program, Version 6.5 User's Manual, May 1997.

14

Technology Modeling Associates, Inc., Sunnyvale, California, TMA Medici, Two-Dimensional Device Simulation Program, Version 4.0 User's Manual, Oct. 1997.

15

SYNOPSIS.
http://www.synopsys.com/products/avmrg/
taurus_wb_ds.html.

16

SILVACO.
http://www.silvaco.com/.

17

Silvaco, ATHENA: 2D Process Simulation Framework, 1993.
User's Manual.

18

SILVACO.
http://www.silvaco.com/products/vwf/atlas/
atlas/atlas_br.html.

19

M.D. Giles, D.S. Boning, G.R. Chin, W.C. Dietrich, M.S. Karasick, M.E. Law, P.K. Mozumder, L.R. Nackman, V.T. Rajan, D.M.H. Walker, R.H. Wang, and A.S. Wong, "Semiconductor Wafer Representation for TCAD," IEEE Trans.Computer-Aided Design, vol. 13, no. 1, pp. 82-95, Jan. 1994.

20

C. Yang and M.D. Giles, "Architecture and Implementation of 3D Field Support in Semiconductor Wafer Representation," in Intl. Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits NUPAD V, (Honolulu), pp. 81-84, 1994.

21

Z.H. Sahul, K.C. Wang, Z.-K. Hsiau, E.W. McKenna, and R.W. Dutton, "Heterogeneous Process Simulation Tool Integration," IEEE Trans.Semiconductor Manufacturing, vol. 9, no. 1, pp. 35-48, Feb. 1996.

22

M. Duane, "TCAD Needs and Applications from a User's Perspective," IEICE Trans.Electron., vol. E82-C, no. 6, pp. 976-982, June 1999.

23

T. Binder and S. Selberherr, "Object-Oriented Design Patterns for Process Flow Simulations," in Proc. Software Engineering and Applications (M. H .Hamza, ed.), (Las Vegas, Nevada), pp. 159-166, International Association of Science and Technology for Development - IASTED, 2000.

24

R. Klima, T. Grasser, T. Binder, and S. Selberherr, "Controlling TCAD Applications with a Dynamic Database," in Proc. Software Engineering and Applications (M. H .Hamza, ed.), (Las Vegas, Nevada), pp. 103-112, International Association of Science and Technology for Development - IASTED, 2000.

25

R. Klima, T. Grasser, and S. Selberherr, "Controlling TCAD Applications with an Object-Oriented Dynamic Database," in Proc. 15th European Simulation Multiconference: Modelling and Simulation (ESM 2001), (Prague, Czech Republic), pp. 161-165, June 2001.

26

T. Binder, K. Dragosits, T. Grasser, R. Klima, M. Knaipp, H. Kosina, R. Mlekus, V. Palankovski, M. Rottinger, G. Schrom, S. Selberherr, and M. Stockinger, MINIMOS-NT User's Guide.
Institut für Mikroelektronik, 1998.

27

T. Grasser, Mixed-Mode Device Simulation.
Dissertation, Technische Universität Wien, 1999.
http://www.iue.tuwien.ac.at/phd/grasser.

28

C. Weichselbaum, "Entwicklung eines Finite Oct-Tree," Diplomarbeit, Technische Universität Wien, 1999.

29

W. Wessner, "Jump and Walk," Diplomarbeit, Technische Universität Wien, 2002.

30

American National Standardization Institute, "The C++ Programming Language," 1998.

31

X3 Secretariat, "International Standard -- The C++ Language, X3J16-14882," Information Technology Council (NSITC), Washington DC, USA, 1998.

32

G. L. Schaps, "Compiler Construction with ANTLR and Java," Dr. Dobb's Journal, 1999.
http://www.ddj.com/articles/1999/9903/9903h/9903h.htm, http://www.antlr.org.

33

H. Herold, lex und yacc Lexikalische und syntaktische Analyse.
Bonn, Paris: Addison-Wesley, 1995.

34

K. Arnold, J. Gosling, and D. Holmes, The Java Programming Language, Third Edition.
Addison-Wesley, 2000.

35

C. Hollauer, "Implementierung einer HDF5-Datenschnittstelle für den Wafer-State-Server," Diplomarbeit, Technische Universität Wien, 2002.

36

R. Sabelka and S. Selberherr, "SAP -- A Program Package for Three-Dimensional Interconnect Simulation," in Proc. Intl. Interconnect Technology Conference, (Burlingame, California), pp. 250-252, June 1998.

37

R. Martins, W. Pyka, R. Sabelka, and S. Selberherr, "Modeling Integrated Circuit Interconnections," in Proc. Intl. Conf. on Microelectronics and Packaging, (Curitiba, Brazil), pp. 144-151, Aug. 1998.

38

R. Martins, R. Sabelka, W. Pyka, and S. Selberherr, "Rigorous Capacitance Simulation of DRAM Cells," in SISPAD'98 [119], pp. 69-72.

39

R. Sabelka, R. Martins, and S. Selberherr, "Accurate Layout-Based Interconnect Analysis," in SISPAD'98 [119], pp. 336-339.

40

R. Martins, W. Pyka, R. Sabelka, and S. Selberherr, "High-Precision Interconnect Analysis," IEEE Trans.Computer-Aided Design, vol. 17, no. 11, pp. 1148-1159, Nov. 1998.

41

C. Harlander, R. Sabelka, and S. Selberherr, "Inductance Calculation in Interconnect Structures," in Proc. 3rd Intl. Conf. on Modeling and Simulation of Microsystems [120], pp. 416-419.

42

C. Harlander, R. Sabelka, R. Minixhofer, and S. Selberherr, "Three-Dimensional Transient Electro-Thermal Simulation," in 5th THERMINIC Workshop, (Rome, Italy), pp. 169-172, Oct. 1999.

43

ISE Integrated Systems Engineering, ISE TCAD Manuals vol. 5, release 4, 1997.

44

J. R. Shewchuk, "Triangle: Engineering a 2D Quality Mesh Generator and Delaunay Triangulator," in First Workshop on Applied Computational Geometry, pp. 124-133, Association for Computing Machinery, 1996.

45

P. Fleischmann, Mesh Generation for Technology CAD in Three Dimensions.
Dissertation, Technische Universität Wien, 1999.
http://www.iue.tuwien.ac.at/phd/fleischm.

46

Johann Cervenka, "CGG: Ein Gittergenerator für die Bauelementesimulation," Diplomarbeit, Technische Universität Wien, 1999.

47

T. Binder and S. Selberherr, "A Parallel Finite Oct-Tree for Multi-Threaded Insert, Delete, and Search Operations," in Proc. Intl. Conf. Applied Modeling and Simulation, (Cairns, Australia), pp. 613-616, Sept. 1999.

48

C. Köhle, "Entwicklung eines Parallelen Finite Oct-Tree," Diplomarbeit, Technische Universität Wien, 2000.

49

T.J. Mowbray and R. Zahavi, The Essential CORBA.
John Wiley & Sons, 1995.

50

P. J. Green and R. Sibson, "Computing Dirichlet Tesselations in the Plane," The Computer Journal, 21, pp. 168-173, 1978.

51

D.E. Knuth, The Art of Computer Programming: Fundamental Algorithms, vol. 1.
Reading, Massachusetts: Addison-Wesley, 3rd ed., 1997.

52

Will Schroeder, Ken Martin, and Bill Lorensen, An Object-Oriented Approach to 3D Graphics.
Prentice Hall, 1999.

53

D. Murray and D. Fulker, "New Ways, in Java, of Visualizing the Same Old Data," AGU, 2000.

54

E.F. Johnson, Graphical Applications with Tcl and Tk.
New York: M&T Books, 1996.

55

A. Hössinger, Simulation of Ion Implantation for ULSI Technology.
Dissertation, Technische Universität Wien, 2000.

56

A. Hössinger and S. Selberherr, "Accurate Three-Dimensional Simulation of Damage Caused by Ion Implantation," in Proc. 2nd Intl. Conf. on Modeling and Simulation of Microsystems, (San Juan, Puerto Rico, USA), pp. 363-366, Apr. 1999.

57

A. Hössinger, M. Radi, B. Scholz, T. Fahringer, E. Langer, and S. Selberherr, "Parallelization of a Monte-Carlo Ion Implantation Simulator for Three-Dimensional Crystalline Structures," in SISPAD'99 [118], pp. 103-106.

58

A. Burenkov, K. Tietzel, A. Hössinger, J. Lorenz, H. Ryssel, and S. Selberherr, "A Computationally Efficient Method for Three-Dimensional Simulation of Ion Implantation," in SISPAD'99 [118], pp. 55-58.

59

A. Hössinger, E. Langer, and S. Selberherr, "Parallelization of a Monte Carlo Ion Implantation Simulator," IEEE Trans.Computer-Aided Design, vol. 19, no. 5, pp. 560-567, May 2000.

60

A. Hössinger, S. Selberherr, M. Kimura, I. Nomachi, and S. Kusanagi, "Three-Dimensional Monte-Carlo Ion Implantation Simulation for Molecular Ions," in Electrochemical Society Proceedings, vol. 99-2, pp. 18-25, 1999.

61

P. Fleischmann, B. Haindl, R. Kosik, and S. Selberherr, "Investigation of a Mesh Criterion for Three-Dimensional Finite Element Diffusion Simulation," in SISPAD'99 [118], pp. 71-74.

62

B. Haindl, R. Kosik, P. Fleischmann, and S. Selberherr, "Comparison of Finite Element and Finite Box Discretization for Three-Dimensional Diffusion Modeling Using AMIGOS," in SISPAD'99 [118], pp. 131-134.

63

J. Xu and L. Zikatanov, "A Monotone Finite Element Scheme for Convection-Diffusion Equaions," Math. Computation, vol. 68, no. 228, pp. 1429-1446, 1999.

64

R. Kosik, P. Fleischmann, B. Haindl, P. Pietra, and S. Selberherr, "On the Interplay Between Meshing and Discretization in Three-Dimensional Diffusion Simulation," IEEE Trans.Computer-Aided Design, vol. 19 no. 11, pp. 1233-1240, 2000.

65

I. Kossacky, "A Recursive Approach to Local Mesh Refinement in Two and Three Dimensions," J. Comput. Appl. Math., vol. 55, pp. 275-288, 1994.

66

E. Baensch, "Local Mesh Refinement in 2 and 3 Dimensions," IMPACT of Computing in Science and Engineering, vol. 3, pp. 181-191, 1991.

67

E. Bär and J. Lorenz, "3-D Simulation of LPCVD Using Segment-Based Topography Discretization," IEEE Trans.Semiconductor Manufacturing, vol. 9, no. 1, pp. 67-73, Feb. 1996.

68

M.K. Sheergar, T. Smy, S.K. Dew, and M.J. Brett, "Simulation of Three-dimensional Refractory Metal Step Coverage over Contact Cuts and Vias," J.Vac.Sci.Technol.B, vol. 14, no. 4, pp. 2595-2602, 1996.

69

J.A. Sethian and D. Adalsteinsson, "An Overview of Level Set Methods for Etching, Deposition, and Lithography Development," IEEE Trans.Semiconductor Manufacturing, vol. 10, no. 1, pp. 167-184, Feb. 1997.

70

W. Pyka, R. Martins, and S. Selberherr, "Efficient Algorithms for Three-Dimensional Etching and Deposition Simulation," in SISPAD'98 [119], pp. 16-19.

71

W. Pyka and S. Selberherr, "Three-Dimensional Simulation of TiN Magnetron Sputter Deposition," in 28th European Solid-State Device Research Conference (A. Touboul, Y. Danto, J.-P. Klein, and H. Grünbacher, eds.), (Bordeaux, France), pp. 324-327, Editions Frontieres, 1998.

72

W. Pyka and S. Selberherr, "Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization," in Proc. International Conference on Modeling and Simulation of Microsystems Semiconductors, Sensors and Actuators, (Santa Clara, CA, USA), pp. 65-69, Apr. 1998.

73

W. Pyka, P. Fleischmann, B. Haindl, and S. Selberherr, "Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics," in SISPAD'99 [118], pp. 199-202.

74

W. Pyka, R. Martins, and S. Selberherr, "Optimized Algorithms for Three-Dimensional Cellular Topography Simulation," IEEE J.Technology Computer Aided Design, 2000.
http://www.ieee.org/products/online/journal/tcad/accepted/
Pyka-March00/.

75

W. Pyka, V. Sukharev, K. Kumar, S. Joh, and J.E. McInerney, "A 3D Integrated Simulation of Across-Wafer Metal Stack Gap-Fill for Local Interconnect Applications," in Proc. of the 16th International VLSI Multilevel Interconnection Conference, (Santa Clara, CA, USA), pp. 477-479, Sept. 1999.

76

W. Pyka, H. Kirchauer, and S. Selberherr, "Three-Dimensional Resist Development Simulation - Benchmarks and Integration with Lithography," Microelectronic Engineering, vol. 53, no. (1-4), pp. 449-452, 2000.

77

A. Hössinger, T. Binder, W. Pyka, and S. Selberherr, "Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation," in Simulation of Semiconductor Processes and Devices, (Athens, Greece), pp. 424-427, Sept. 2001.

78

E. Strasser and S. Selberherr, "Algorithms and Models for Cellular Based Topography Simulation," IEEE Trans.Computer-Aided Design, vol. 14, no. 9, pp. 1104-1114, Sept. 1995.

79

R. Plasun, Optimization of VLSI Semiconductor Devices.
Dissertation, Technische Universität Wien, 1999.
http://www.iue.tuwien.ac.at/phd/plasun.

80

R. Strasser, R. Plasun, M. Stockinger, and S. Selberherr, "Inverse Modeling of Semiconductor Devices," in Proc. SIAM Conference on Optimization 1999, p. 77, 1999.

81

T. Grasser, R. Strasser, M. Knaipp, K. Tsuneno, H. Masuda, and S. Selberherr, "Device Simulator Calibration for Quartermicron CMOS Devices," in SISPAD'98 [119], pp. 93-96.

82

T. Grasser, R. Strasser, M. Knaipp, K. Tsuneno, H. Masuda, and S. Selberherr, "Calibration of a Mobility Model for Quartermicron CMOS Devices," in 12th European Simulation Multiconference - Simulation: Past, Present and Future (R. Zobel and D. Moeller, eds.), (Manchester, UK), pp. 75-77, Society for Computer Simulation, June 1998.

83

M. Stockinger and S. Selberherr, "Automatic Device Design Optimization with TCAD Frameworks," in Proc. 3rd Intl. Conf. on Modeling and Simulation of Microsystems [120], pp. 1-6.

84

T. Binder, C. Heitzinger, and S. Selberherr, "A Qualitative Study on Global and Local Optimization Techniques for TCAD Analysis Tasks," in Proc. Modeling and Simulation of Microsystems (MSM 2001), (Hilton Head Island, South Carolina, USA), pp. 466-469, Mar. 2001.

85

R. Strasser, R. Plasun, and S. Selberherr, "Practical Inverse Modeling with SIESTA," in SISPAD'99 [118], pp. 91-94.

86

S. Selberherr, Analysis and Simulation of Semiconductor Devices.
Wien, New York: Springer, 1984.

87

R. Strasser, Rigorous TCAD Investigations on Semiconductor Fabrication Technology.
Dissertation, Technische Universität Wien, 1999.
http://www.iue.tuwien.ac.at/phd/strasser.

88

C. Heitzinger and S. Selberherr, "An Extensible TCAD Optimization Framework Combining Gradient Based and Genetic Optimizers," in Proc. SPIE International Symposium on Microelectronics and Assembly: Design, Modeling, and Simulation in Microelectronics, (Singapore), pp. 279-289, 2000.

89

C. Heitzinger, T. Binder, and S. Selberherr, "Parallel TCAD Optimization and Parameter Extraction for Computationally Expensive Objective Functions," in Proc. 15th European Simulation Multiconference: Modelling and Simulation (ESM 2001), (Prague, Czech Republic), pp. 534-538, June 2001.

90

A. Gehring, C. Heitzinger, T. Grasser, and S. Selberherr, "TCAD Analysis of Gain Cell Retention Time for SRAM Applications," in Proc. Simulation of Semiconductor Processes and Devices (SISPAD 2001) (D. Tsoukalas and C. Tsamis, eds.), (Athens, Greece), pp. 416-419, Springer, Wien, New York, Sept. 2001.

91

C. Heitzinger and S. Selberherr, "An Extensible TCAD Optimization Framework Combining Gradient Based and Genetic Optimizers," Microelectronics Journal (Design, Modeling and Simulation in Microelectronics and MEMS; Smart Electronics and MEMS), vol. 33, no. 1-2, pp. 61-68, 2002.

92

R. Strasser and S. Selberherr, "Parallel and Distributed TCAD Simulations using Dynamic Load Balancing," in SISPAD'98 [119], pp. 89-92.

93

W. Tuppa, VMake - A CASE-Oriented Configuration Management Utility.
Dissertation, Technische Universität Wien, Oct. 1996.
http://www.iue.tuwien.ac.at/phd/tuppa.

94

W. Tuppa and S. Selberherr, "A CASE-Oriented Configuration Management Utility," in IASTED/ISMM Intl. Conf. on Modelling and Simulation (M.H. Hamza, ed.), (Pittsburgh, Pennsylvania, USA), pp. 83-87, Apr. 1996.

95

W. Tuppa and S. Selberherr, "A Configuration Management Utility with CASE-Orientation," in IASTED/ISMM Intl. Conf. on Modelling and Simulation (N. Hamza, ed.), (Gold Coast, Queensland, Australia), May 1996.
CD-ROM, File 242-173.pdf.

96

D. W. Marquardt, "An Algorithm for the Estimation of Nonlinear Parameters," Soc. Ind. Appl. Maths. J., vol. 11, pp. 431-441, 1963.

97

J. J. Moré, D. C. Sorensen, K. E. Hillstrom, and B. S. Garbow, The MINPACK Project.
Sources and Development of Mathematical Software, Englewood Clifs, NJ: Prentice-Hall, 1984.

98

J. J. Moré, B. S. Garbow, and K. E. Hillstrom, Users Guide for MINPACK-1.
Argonne, IL: Argonne National Laboratory Report ANL-80-74, 1980.

99

J. Holland, "Adaption in Natural and Artificial Systems," University of Michigan Press, Ann Arbor, MI, 1975.

100

M. Wall, "GAlib A C++ Library of Genetic Algorithm Components," Massachusetts Institute of Technology, 2000.
http://lancet.mit.edu/ga.

101

D. E. Goldberg, Genetic Algorithms in Search and Optimization.
Addison-Wesley, 1989.

102

S. Kirkpatrick, C.D. Gelatt Jr, and M.P. Vecchi, "Optimization by Simulated Annealing," Science, vol. 220, no. 4598, pp. 671-680, May 1983.

103

V. Cerny, "Thermodynamical Approach to the Traveling Salesman Problem: an Efficient Simulation Algorithm," J. Opt. Theory Appl., vol. 45, pp. 41-45, 1985.

104

N. Metropolis, A. W. Rosenbluth, M. N. Rosenbluth, and A. H. Teller, "Equation of State Calculations by Fast Computing Machines," The Journal of Chemical Physics, vol. 21, no. 6, June 1953.

105

S. Geman and D. Geman, "Stochastic Relaxation, Gibbs Distribution and the Bayesian Restoration in Images," IEEE Trans. Patt. Anal. Mac. Int., vol. 6, pp. 721-741, 1984.

106

M. D. Huang, F. Romeo, and A. Sangiovanni-Vincentelli, "An Efficient General Cooling Schedule for Simulated Annealing," IEEE Trans.Computer-Aided Design, pp. 381-384, 1986.

107

L. Ingber, "Very Fast Simulated Re-Annealing," Mathematical Computer Modelling, vol. 12, pp. 967-973, 1989.
http://www.ingber.com/asa89_vfsr.ps.gz.

108

L. Ingber, "Genetic Algorithms and Very Fast Simulated Re-Annealing: A Comparision," Mathematical and Computer Modelling, vol. 16, pp. 87-100, 1992.
http://www.ingber.com/asa92_saga.ps.gz.

109

C.S. Rafferty, G.H. Gilmer, J. Jaraiz, D. Eaglesham, and H.-J. G ossmann, "Simulation of Cluster Evaporation and Transient Enhanced Diffusion in Silicon," Appl.Phys.Lett., vol. 68, no. 17, pp. 2395-2397, Apr. 1996.

110

M. Uematsu, "Simulation of Clustering and Transient Enhanced Diffusion of Boron in Silicon," J.Appl.Phys., vol. 84, no. 9, pp. 4781-4787, 1998.

111

D.J. Eaglesham, P.A. Stolk, H.J. Gossmann, and J.M. Poate, "Implantation and Transient B Diffusion in Si: The Source of Interstitials," Appl.Phys.Lett., vol. 65, no. 18, pp. 2305-2307, 1994.

112

J.M. Poate, D.J. Eaglesham, G.H. Gilmer, J.-J. Gossmann, M. Jaraiz, C.S. Rafferty, and P.A. Stolk, "Ion Implantation and Transient Enhanced Diffusion," in Intl.Electron Devices Meeting, (Washington, DC, USA), pp. 77-80, 1995.

113

GTS -- The GNU Triangulated Surfaces Library.
http://gts.sourceforge.net.

114

JTC 1/SC 22, "International Standard -- Extended BNF," International Organization for Standardization, Case postale 56 1, rue de Varembé CH-1211 Genève 20 Switzerland, 1996.
http://www.cl.cam.ac.uk/$\sim$mgk25/iso-ebnf.html.

115

Gregor. N. Purdy, CVS Pocket Reference.
O'Reilly, 2000.

116

W. Tuppa, VMake - A CASE-Oriented Configuration Management Utility.
Dissertation,
Technische Universität Wien, 1996.

http://www.iue.tuwien.ac.at/phd/tuppa.

117

Larry Wall, Tom Christiansen, and Jon Orwant, Programming Perl, 3rd Edition.
O'Reilly, 2000.

118

Proc. Simulation of Semiconductor Processes and Devices, (Kyoto, Japan), Sept. 1999.

119

Proc. Simulation of Semiconductor Processes and Devices, (Leuven, Belgium), Sept. 1998.

120

Proc. 3rd Intl. Conf. on Modeling and Simulation of Microsystems, (San Diego, USA), Mar. 2000.

2003-03-27