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To extrapolate electromigration failure times measured under accelerated test conditions to operating conditions, a semi-empirical model proposed by Black [75] has been widely used in which the time to failure
is related to the temperature
and the current density
as
exp |
(215) |
The current density exponent
and activation energy
are determined by experiment.
The time to failure distribution according to Black's equation is displayed in Figure 4.1.
In addition to this model, Black also observed that using an interconnect metal with a larger grain size leads to increased lifetimes [75].
Figure 4.1:
Time to failure as a function of current density and temperature, as predicted by Black's equation.
|
|
Next: 2 Modeling of the
Up: 3 Electromigration TCAD Solutions
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J. Cervenka: Three-Dimensional Mesh Generation for Device and Process Simulation