List of Acronyms

APEMC Asia-Pacific Symposium on ElectroMagnetic Compatibility
CAD Computer Aided Design
CAN Controller Area Network
CD Compact Disc
CISPR Comité International Spécial des Perturbations Radioélectriques
CMOS Complementary Metal Oxide Semiconductor
DVD Digital Video Disc
EMC ElectroMagnetic Compatibility
EMI ElectroMagnetic Interference
ESL Equivalent Series Inductance L
FDFD Finite Differences Frequency Domain
FDTD Finite Differences Time Domain
FEM Finite Element Method
FFT Fast Fourier Transformation
FIT Finite Integration Technique
FR4 Flame Retardant glass-fiber reinforced epoxy
GMRES Generalized Minimal RESidual method
HFSS® High Frequency Simulation Software
IC Integrated Circuit
ICEM Integrated Circuit Electrical Model
IEC International Electrotechnical Comission
I$ \mu $E Institute for MicroElectronics
IMIC Interface Model for Integrated Circuits
ITRS International Technology Roadmap for Semiconductors
LCR Inductance L Capacitance Resistance
LIN Local Interconnect Network
LISN Line Interface Simulation Network
MLFMM Multi Level Fast Multipole Method
MoM Method of Moments
MOS Metal Oxide Semiconductor
$ \mu $TEM Micro Transversal ElectroMagnetic
NSPWMLFMA Non-directive Stable Plane Wave Multi Level Fast Multipole Algorithm
PCB Printed Circuit Board
PEC Perfect Electric Conduction
PEEC Partial Equivalent Electric Circuit
PMC Perfect Magnetic Conduction
RF Radio Frequency
SAP Smart Analysis Program
SiP System in Package
SMA Sub Miniatur RF connector, version A
SoC System on Chip
SPI Serial Peripheral Interface
TE Transversal Electric
TLM Transmission Line Method
TM Transversal Magnetic
TQFP Thin Quad Flat Patch
VLSI Very Large Scale Integration

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover