List of Acronyms

APEMC	Asia-Pacific Symposium on ElectroMagnetic Compatibility
CAD	Computer Aided Design
CAN	Controller Area Network
CD	Compact Disc
CISPR	Comité International Spécial des Perturbations Radioélectriques
CMOS	Complementary Metal Oxide Semiconductor
DVD	Digital Video Disc
EMC	ElectroMagnetic Compatibility
EMI	ElectroMagnetic Interference
ESL	Equivalent Series Inductance L
FDFD	Finite Differences Frequency Domain
FDTD	Finite Differences Time Domain
FEM	Finite Element Method
FFT	Fast Fourier Transformation
FIT	Finite Integration Technique
FR4	Flame Retardant glass-fiber reinforced epoxy
GMRES	Generalized Minimal RESidual method
HFSS®	High Frequency Simulation Software
IC	Integrated Circuit
ICEM	Integrated Circuit Electrical Model
IEC	International Electrotechnical Comission
I$\mu$E	Institute for MicroElectronics
IMIC	Interface Model for Integrated Circuits
ITRS	International Technology Roadmap for Semiconductors
LCR	Inductance L Capacitance Resistance
LIN	Local Interconnect Network
LISN	Line Interface Simulation Network
MLFMM	Multi Level Fast Multipole Method
MoM	Method of Moments
MOS	Metal Oxide Semiconductor
$\mu$TEM	Micro Transversal ElectroMagnetic
NSPWMLFMA	Non-directive Stable Plane Wave Multi Level Fast Multipole Algorithm
PCB	Printed Circuit Board
PEC	Perfect Electric Conduction
PEEC	Partial Equivalent Electric Circuit
PMC	Perfect Magnetic Conduction
RF	Radio Frequency
SAP	Smart Analysis Program
SiP	System in Package
SMA	Sub Miniatur RF connector, version A
SoC	System on Chip
SPI	Serial Peripheral Interface
TE	Transversal Electric
TLM	Transmission Line Method
TM	Transversal Magnetic
TQFP	Thin Quad Flat Patch
VLSI	Very Large Scale Integration

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover