2 State of the art

There are no state of the art methods available for the efficient simulation of all electromagnetic emissions from the kHz to the GHz range of complex devices, such as described in Chapter 1.
For accurate simulation of these devices, the ICs, the active and passive components, the structures on the PCB, external cabling and external electromagnetic environment (i.e. scattering objects), and even the software coding have to be properly considered in the model [6][7][8][9]. Currently three somewhat differing approaches for the development of suitable simulation methods for this purpose can be found in the literature.

• Three-dimensional full wave numerical simulation of the whole model.
• Semi-analytical multipole macro modeling of EMI sources to achieve a reduction of
  the three-dimensional model.
• Analytical and numerical modeling of the EMI effects to classify sources and coupling
  paths regarding their potential to exceed emission limits.

These three approaches, their current state, and their future potential to meet the objectives of the EMI simulation task are described in the following sections.

Subsections

• 2.1 The three-dimensional full wave simulation approaches
  • 2.1.1 Time domain methods
  • 2.1.2 Frequency domain methods
  
  
• 2.2 The semi-analytical approach based on EMI source multipole macro modeling
• 2.3 Analytical and numerical modeling of the EMI effects to classify sources and coupling paths regarding their potential to exceed emission limits
• 2.4 Analytical model for the free space radiation of a cubical enclosure intended for fast predesign investigations
• 2.5 Modeling of the common mode coupling from ICs to the cavity field

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover