List of Abbreviations

1D	One dimensional
2.5D	Two and a half dimensional
2D	Two dimensional
3D	Three dimensional
BEOL	Back end of line
CAD	Computer aided design
CMOS	Complementary metal oxide semiconductor
CPU	Central processing unit
DE	Differential equation
FEM	Finite element method
FEOL	Front end of line
IC	Integrated circuit
IMC	Intermetallic compound
MTTF	Mean-time-to-failure
NoC	Network on chip
PDE	Partial differential equation
PoP	Package on package
P	Packaging
RDL	Redistribution layer
SIC	Stacked integrated circuit
SiP	System in package
SoC	System on chip
SOI	Silicon on insulator
SSI	Small scale integration
TCAD	Technology computer aided design
TSV	Through silicon via
TTF	Time-to-failure
UBM	Under bump metallization
ULSI	Ultra large scale integration
VLSI	Very large scale integration
WLP	Wafer level packaging