List of Tables

• 1.1. Activation energies for various diffusional paths in copper interconnects [105].
• 5.1. Materials parameters for the electro-thermal and solid mechanics models [40, 38].
• 5.2. Materials parameters for the vacancy dynamics and diffuse interface models [40].
• 5.3. Materials parameters for the electro-thermal, vacancy dynamics, and solid mechanics models [40, 38, 31]..
• 5.4. Materials parameters for the vacancy dynamics model [40, 25].