5.3.2  Summary and Conclusion

The impact of “unbow” movements due to handling was analyzed in this section. Such scenarios are especially dangerous for unfilled TSVs, because of the lever-like configuration at the bottom of the structure. Filled vias have a better support since there are no open surfaces. A methodology for dealing with problems at different scales was presented. It is particularly useful to study the effects on a macroscale (as wafer bow) to the TSV. It should additionally be noted that the presented method is a special case of the domain decomposition method.