1.1 Traditional Semiconductor Process Technologies

The fabrication of silicon-based IC begins with a uniformly doped silicon wafer. A set of sequential processing steps generates the required geometries in order to obtain a desired device. The most commonly used processing steps for IC fabrication are lithography, etching, deposition, CMP oxidation, ion implantation, and diffusion. Those processes are briefly discussed in this section.


L. Filipovic: Topography Simulation of Novel Processing Techniques