List of Tables

1.1 Evolution in the number of transistors implemented within a single IC.
4.1 Thickness of layers employed.
4.2 Critical values Gc for the considered interface.
4.3 Summary of the conditions for delamination propagation.
4.4 Geometry of the samples used in the simulation study. The thickness h2 includes the thickness of the adhesive. The comments indicate the type of deposition process and the presence or absence of the Ti layer.
4.5 Gc values measured from experimental data and calculated using FEM simulations. The Gc values calculated for Sample 3, Sample 4, and 5 are in good agreement with the experimentally measured Gc values.
5.1 Parameters used for the simulations. The value (2γs - γgb) was used as fitting parameter.