Chapter 3
Previous Modeling Attempts

In the 1960’s, the investigations of the Si-SiO2   interface revealed a close-coupling of the increase of surface traps sitting at the interface and a phenomenon which will be later on known as the bias temperture instability. Both effects were known to cause a negative shift of the threshold voltage [3453]. Though this phenonmenon was already known not to cause real device failure as for example time dependent dielectric breakdown (TDDB) [3554], the creeping shift of VTH   alerted the industry and the scientific community to develop a model which is capable of describing the mechanisms behind BTI. In order to judge such a model as functional, clear definitions of its applicability but also potential limits have to be listed. The following review summarizes the existing modeling efforts, including their advantages and disadvantages.

 3.1 Reaction Diffusion Model
  3.1.1 Stress Phase
  3.1.2 Back Diffusion of Hydrogen during Recovery
 3.2 Extensions of the Reaction-Diffusion Model
  3.2.1 Dispersive-Reaction-Rate Models