The lack of a decent description of recovery based on the reaction-diffusion theory, cf. (3.2), soon urged the development of modified and extended RD models [63, 33, 64, 41, 17, 59, 65, 66, 67, 55]. In the following variants thereof are summarized.
was suggested to
continue inside the polysilicon as well [63]. By assuming two different
diffusion coefficients, namely fast diffusion in the oxide and slow
diffusion inside the polysilicon, the so-called two-region RD model
was expected to be able to explain the much larger observed recovery
range. Actually this range only increased at little [55].
). Like in the two-region model, the molecular hydrogen
diffuses further into the polysilicon. Since the diffusivity in the oxide is
regarded to be very high compared to the diffusivity in the polysilicon,
the
stored in the oxide is indeed able to cause a fast initial
recovery. For large stress times, on the other hand, it is this higher
oxide diffusivity that locks the hydrogen in the polysilicon for a long
time. This means that the short recovery effect vanishes.
, the
recovery characteristic remains the same compared to the standard
RD model.
switches.
They suggested an RD model assuming slow interface states.
Unfortunately, such a model is in stark contradiction to the
Shockley-Read-Hall theory (SRH) used to describe the trapping
dynamics at the interface with transients due to electron capture being
within the nano-second regime. Under the assumption of exessively
small capture cross sections some sort of fast relaxation in the
microsecond-regime within one or two decades in time is indeed
obtained. However, this form of recovery is not observed in any
experimental data [55].
In contrast, a simplified version of the RDD model does not differentiate between trapped and untrapped hydrogen, i.e. all hydrogen is allowed to interact with the interface [67]. This implies a faster initial recovery, compared to the non-simplified RDD model, cf. simulations performed in [55].
Although with increasing dispersion of the bond breaking at the interface the recovery can be slowed down, none of the RDD variants is finally able to describe the actual experiment.
The following conclusion can be drawn for RD theory in general. While during recovery solely passivation occurs, the stress is modeled using depassivation and passivation simultaneously [31]. At present, no extension of the RD-model is able to describe recovery after stress in a reasonable form. Whether such a model is then able to describe the much more complex stress-relaxation patterns during the operation of a MOSFET is very questionable. The premises are simply not correct. This leads to the conclusion that hydrogen diffusion is very unlikely to be a main player when dealing with NBTI degradation. For this reason completely new approaches are inevitable [11, 6, 40, 61, 68, 69, 18].