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Model Parameters

  For the initial model setup it is of major importance to know about the previous deposition and doping method, e.g. in-situ doped polysilicon exhibits different initial grain sizes and grain growth rates compared to ion implantation doped polysilicon. We use the PROMIS deposition module for the simulation of the polysilicon layer fabrication [Str95], which delivers information like polysilicon grain main axis orientation, deposition temperature, film thickness and doping technique. This information is used to initialize the grain size r as well as the orientation attribute of the grains according to Table 3.2-1.

The other modeling parameters are given in Table 4.3-4, where the grain growth parameter are taken from [Kal90]. All parameters are modeled by Arrhenius laws tex2html_wrap_inline5389 , if applicable. The clustering parameters are obtained from Table 4.3-1.

 

Polysilicon Diffusion Parameters
P tex2html_wrap_inline5301 tex2html_wrap_inline5303
tex2html_wrap_inline5725 1200.0 tex2html_wrap_inline5309 tex2html_wrap_inline5731

tex2html_wrap_inline5733 1200.0 tex2html_wrap_inline5309 tex2html_wrap_inline5739

Arsenic

tex2html_wrap_inline5741 0.066 tex2html_wrap_inline5309 tex2html_wrap_inline5747

tex2html_wrap_inline5749 12.0 tex2html_wrap_inline5309 tex2html_wrap_inline5755
Trapping Factor t tex2html_wrap_inline5759 tex2html_wrap_inline5373 tex2html_wrap_inline5763
Emission Factor e tex2html_wrap_inline5767 tex2html_wrap_inline5373 tex2html_wrap_inline5771
Max. Grain Boundary Area tex2html_wrap_inline5699 tex2html_wrap_inline5775 tex2html_wrap_inline5777
Grain Boundary Thickness tex2html_wrap_inline4869 5 nm
Grain Boundary Energy lat. tex2html_wrap_inline5785 0.25 eV
Grain Boundary Energy vert. tex2html_wrap_inline5791 0.25 eV
Stress Scaling Factor tex2html_wrap_inline5797 150 MPa
Table 4.3-4: Model parameters for polysilicon dopant diffusion model of PROMIS-NT.

 


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Next: Model Verification Up: 4.3.5 Polysilicon Diffusion Previous: 4.3.5 Polysilicon Diffusion

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