2  Mechanics in Microelectronics

The mechanics reliability problems in microelectronics require a careful approach. The small dimensions and the thin layers modify the material behavior, leading to the development of phenomena not yet fully understood. This chapter presents the basic framework common to all mechanics problems in engineering. Meanwhile, the specifics in dealing with the mechanics of the TSV structure are described in Chapter 4, Chapter 5 and Chapter 6.

2.1 Mechanical Systems
2.2 Mechanical Theory
2.2.1 Infinitesimal Strain Theory
2.2.2 Hooke’s Law
2.2.3 Thermal Expansion
2.3 Reliability
2.3.1 Yield
2.3.2 Yield Criteria