7. Applications

To demonstrate the capabilities of the proposed tools several simulation examples are presented in this chapter. We will start with a review of the ring oscillator discussed in Section 5.2.3, but now incorporating the interconnection parasitics in the circuit simulation. Then, we will discuss the application of the proposed tools in Dynamic RAM (DRAM) technologies (both trench and stacked cell types). Next, we discuss interconnect technology optimization, namely contact characterization and wire resistance extraction. Finally, representative examples of the thermal and transient simulation modes are presented and discussed.