List of Tables

2.1 Mechanical properties of common materials used in semiconductor device manufacturing.
3.1 Expansion of the Lagrangian polynomial for 1 < s < 5  .
4.1 Melting point and electrical resistivity of common interconnection materials. The materials are grouped by their function within an interconnect structure.
5.1 Stress sources identified by Doener and Nix.
5.2 Parameters of the dislocation glide model obtained using a Genetic Algorithm (GA).